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NTIS 바로가기IEEE electron device letters : a publication of the IEEE Electron Devices Society, v.38 no.2, 2017년, pp.164 - 167
Choi, Woo Young (Department of Electronic Engineering, Sogang University, Seoul, South Korea) , Kwon, Hyug Su (Department of Electronic Engineering, Sogang University, Seoul, South Korea) , Kim, Yong Jun (Flash Device Technology Team, SK Hynix, Icheon-si, South Korea) , Lee, Byungin (Flash Device Technology Team, SK Hynix, Icheon-si, South Korea) , Yoo, Hyunseung (Flash Device Technology Team, SK Hynix, Icheon-si, South Korea) , Choi, Sangmoo (Department of Electronic Engineering, Sogang University, Seoul, South Korea) , Cho, Gyu-Seog (Flash Device Technology Team, SK Hynix, Icheon-si, South Korea) , Park, Sung-Kye
The influence of intercell trapped charge (ITC)-the charge trapped at the inter-cell nitride regions by fringe electric fields during programand erase operations-on vertical NAND (VNAND) flash memory is investigated. In addition to conventional degradation mechanisms such as tunnel oxide damage, ITC...
Liu, L., Arreghini, A., Van den bosch, G., Pan, L., Van Houdt, J.. Comprehensive understanding of charge lateral migration in 3D SONOS memories. Solid-state electronics, vol.116, 95-99.
Sentaurus Device User Guide version E-2010 12 2010
Padovani, A., Arreghini, A., Vandelli, L., Larcher, L., Van den bosch, G., Pavan, P., Van Houdt, J.. A Comprehensive Understanding of the Erase of TANOS Memories Through Charge Separation Experiments and Simulations. IEEE transactions on electron devices, vol.58, no.9, 3147-3155.
Chou, S.Y., Antoniadis, D.A.. Relationship between measured and intrinsic transconductances of FET's. IEEE transactions on electron devices, vol.34, no.2, 448-450.
IEDM Tech Dig A highly manufacturable low-k ALD-SiBN process for 60nm NAND flash devices and beyond kim 2004 1063
IEDM Tech Dig Novel 3-dimensional dual control-gate with surrounding floating-gate (DC-SF) NAND flash cell for 1Tb file storage application whang 2010 668
Park, Young-Bog, Schroder, D.K.. Degradation of thin tunnel gate oxide under constant Fowler-Nordheim current stress for a flash EEPROM. IEEE transactions on electron devices, vol.45, no.6, 1361-1368.
Maconi, A., Compagnoni, C. M., Spinelli, A. S., Lacaita, A. L.. New Erase Constraint for the Junction-Less Charge-Trap Memory Array in Cylindrical Geometry. IEEE transactions on electron devices, vol.60, no.7, 2203-2208.
Maconi, A., Arreghini, A., Monzio Compagnoni, C., Van den bosch, G., Spinelli, A.S., Van Houdt, J., Lacaita, A.L.. Comprehensive investigation of the impact of lateral charge migration on retention performance of planar and 3D SONOS devices. Solid-state electronics, vol.74, 64-70.
Lee, K.H., Degraeve, R., Toledano-Luque, M., Arreghini, A., Breuil, L., Blomme, P., Van den bosch, G., Van Houdt, J.. Assessment of tunnel oxide and poly-Si channel traps in 3D SONOS memory before and after P/E cycling. Microelectronic engineering, vol.147, 45-50.
VLSI Symp Tech Dig Vertical cell array using TCAT(terabit cell array transistor) technology for ultra high density NAND flash memory jang 2009 192
VLSI Symp Tech Dig Pipe-shaped BiCS flash memory with 16 stacked layers and multi-level-cell operation for ultra high density storage devices katsumata 2009 136
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