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NTIS 바로가기ECS journal of solid state science and technology : jss, v.6 no.7, 2017년, pp.P405 - P409
Kim, Kijung (aDepartment of Nanoscale Semiconductor Engineering, Hanyang University, Seoul, South Korea) , Seo, Jihoon (bDepartment of Energy Engineering, Hanyang University, Seoul, South Korea) , Lee, Myeongjae (aDepartment of Nanoscale Semiconductor Engineering, Hanyang University, Seoul, South Korea) , Moon, Jinok (bDepartment of Energy Engineering, Hanyang University, Seoul, South Korea) , Lee, Kangchun (bDepartment of Energy Engineering, Hanyang University, Seoul, South Korea) , Yi, Dong Kee (dDepartment of Chemistry, Myongji University, Yongin, South Korea) , Paik, Ungyu (aDepartment of Nanoscale Semiconductor Engineering, Hanyang University, Seoul, South Korea)
Silica nanoparticles (NPs) are used as abrasives for tungsten chemical mechanical planarization (CMP) at acidic pH. However, the use of silica NPs at pH near their isoelectric point remains a problem because agglomeration due to low surface charge leads to defects on the tungsten surface during CMP....
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