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Highly Dispersed Fe3+-Substituted Colloidal Silica Nanoparticles for Defect-Free Tungsten Chemical Mechanical Planarization

ECS journal of solid state science and technology : jss, v.6 no.7, 2017년, pp.P405 - P409  

Kim, Kijung (aDepartment of Nanoscale Semiconductor Engineering, Hanyang University, Seoul, South Korea) ,  Seo, Jihoon (bDepartment of Energy Engineering, Hanyang University, Seoul, South Korea) ,  Lee, Myeongjae (aDepartment of Nanoscale Semiconductor Engineering, Hanyang University, Seoul, South Korea) ,  Moon, Jinok (bDepartment of Energy Engineering, Hanyang University, Seoul, South Korea) ,  Lee, Kangchun (bDepartment of Energy Engineering, Hanyang University, Seoul, South Korea) ,  Yi, Dong Kee (dDepartment of Chemistry, Myongji University, Yongin, South Korea) ,  Paik, Ungyu (aDepartment of Nanoscale Semiconductor Engineering, Hanyang University, Seoul, South Korea)

Abstract AI-Helper 아이콘AI-Helper

Silica nanoparticles (NPs) are used as abrasives for tungsten chemical mechanical planarization (CMP) at acidic pH. However, the use of silica NPs at pH near their isoelectric point remains a problem because agglomeration due to low surface charge leads to defects on the tungsten surface during CMP....

주제어

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