다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기
Applied thermal engineering, v.123, 2017년, pp.19 - 28
Wang, Yiwei (Corresponding author at: 2 Nengyuan Rd, Wushan, Tianhe District, Guangzhou 510640, China.) , Cen, Jiwen , Jiang, Fangming , Cao, Wenjiong
AI-Helper
Abstract A new flat plate heat pipe (FPHP) which has many parallel-arranged micro-fins casted on the condensation surface was designed and fabricated. An experimental system for studying the thermal performance of this FPHP when applied for cooling high-power LED (light emitting diode) COBs (chip o...
Appl. Therm. Eng. Lai 29 1239 2009 10.1016/j.applthermaleng.2008.06.023 Liquid cooling of bright LEDs for automotive applications
Microelectron. J. Lei 38 1 2007 10.1016/j.mejo.2006.09.004 Color rendering and luminous efficacy of trichromatic and tetrachromatic LED-based white LEDs
Microelectron. J. Wu 43 280 2012 10.1016/j.mejo.2012.01.007 A study on the heat dissipation of high power multi-chip COB LEDs
Microelectron. Reliab. Tsai 52 845 2012 10.1016/j.microrel.2011.04.008 Thermal measurements and analyses of low-cost high-power LED packages and their modules
Microelectron. Reliab. Ha 52 836 2012 10.1016/j.microrel.2012.02.005 Development of a thermal resistance model for chip-on-board packaging of high power LED arrays
Mat. Sci. Semicon. Proc. Maeng 38 357 2015 10.1016/j.mssp.2014.11.025 Thermal characteristics for chip on metal package of LED lighting module
Curr. Appl. Phys. Sim 12 494 2012 10.1016/j.cap.2011.08.008 Characteristic enhancement of white LED lamp using low temperature co-fired ceramic-chip on board package
Int. J. Precis. Eng. Manuf. Jeon 15 2437 2014 10.1007/s12541-014-0611-7 Quantitative analysis on air-dispensing parameters for manufacturing dome lenses of chip-on-board LED system
IEEE T. Electron. Dev. Kong 62 2251 2015 10.1109/TED.2015.2436820 Effects of die-attach material and ambient temperature on properties of high-power COB blue LED module
J. Cryst. Growth Narendran 268 449 2004 10.1016/j.jcrysgro.2004.04.071 Solid-state lighting: failure analysis of white LEDs
J. Illuminat. Eng. Soc. Narendran 30 57 2001 10.1080/00994480.2001.10748334 What is useful life for white light LEDs?
Thermochim. Acta Lu 493 25 2009 10.1016/j.tca.2009.03.016 Thermal analysis of loop heat pipe used for high-power LED
Energ. Procedia Dehuai 17 1974 2012 10.1016/j.egypro.2012.02.341 A novel manufacturing approach of phase-change heat sink for high-power LED
Microelectron. J. Lu 42 1257 2011 10.1016/j.mejo.2011.08.009 Thermal analysis of high power LED package with heat pipe heat sink
Appl. Therm. Eng. Lin 31 2221 2011 10.1016/j.applthermaleng.2011.03.003 Heat transfer characteristics and LED heat sink application of aluminum plate oscillating heat pipes
Int. J. Heat Mass Transf. Jang 55 515 2012 10.1016/j.ijheatmasstransfer.2011.11.016 Multidisciplinary optimization of a pin-fin radial heat sink for LED lighting applications
Appl. Therm. Eng. Li 56 18 2013 10.1016/j.applthermaleng.2013.03.016 A loop-heat-pipe heat sink with parallel condensers for high-power integrated LED chips
Int. Commun. Heat Mass Deng 37 788 2010 10.1016/j.icheatmasstransfer.2010.04.011 A liquid metal cooling system for the thermal management of high power LEDs
Microelectron. Reliab. Li 51 2210 2011 10.1016/j.microrel.2011.05.006 Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs
Appl. Therm. Eng. Wong 31 1757 2011 10.1016/j.applthermaleng.2011.02.020 Performance tests on a novel vapor chamber
Exp. Therm. Fluid Sci. Ji 40 93 2012 10.1016/j.expthermflusci.2012.02.004 Copper foam based vapor chamber for high heat flux dissipation
Adv. Mech. Eng. Boukhanouf 5 474935 2013 10.1155/2013/474935 Simulation and experimental investigation of thermal performance of a miniature flat plate heat pipe
Microelectron. Reliab. Hsieh 52 1071 2012 10.1016/j.microrel.2011.11.016 Experimental study of micro rectangular groove structure covered with multi mesh layers on performance of FPHP for LED lighting module
Int. J. Heat Mass Transf. Wang 53 3990 2010 10.1016/j.ijheatmasstransfer.2010.05.018 Development of 30Watt high-power LEDs vapor chamber-based plate
Int. J. Heat Mass Transf. Wong 53 2377 2010 10.1016/j.ijheatmasstransfer.2010.02.001 A novel vapor chamber and its performance
Appl. Therm. Eng. Lefèvre 37 95 2012 10.1016/j.applthermaleng.2011.11.022 Experimental investigations of flat plate heat pipes with screen meshes or grooves covered with screen meshes as capillary structure
Appl. Therm. Eng. Ming 29 422 2009 10.1016/j.applthermaleng.2008.03.030 The experimental and numerical investigation of a grooved vapor chamber
Energ. Convers. Manage. Peng 74 44 2013 10.1016/j.enconman.2013.05.004 Study on heat transfer performance of an aluminum flat plate heat pipe with fins in vapor chamber
Int. J. Heat Mass Transf. Lips 53 694 2010 10.1016/j.ijheatmasstransfer.2009.10.022 Combined effects of the filling ratio and the vapour space thickness on the performance of a flat plate heat pipe
Exp. Heat Transf. Huang 22 26 2009 10.1080/08916150802530187 Experimental investigation of vapor chamber module applied to high-power light-emitting diodes
J. Mar. Sci. Techn. Wang 19 353 2011 10.51400/2709-6998.2175 Experimental analysis for thermal performance of a vapor chamber applied to high-performance servers
Appl. Therm. Eng. Chen 51 864 2013 10.1016/j.applthermaleng.2012.10.035 Feasibility study of an aluminum vapor chamber with radial grooved and sintered powders wick structures
Appl. Therm. Eng. Wang 31 2367 2011 10.1016/j.applthermaleng.2011.03.037 Effect of evaporation section and condensation section length on thermal performance of flat plate heat pipe
Int. J. Heat Mass Transf. Chen 77 874 2014 10.1016/j.ijheatmasstransfer.2014.06.029 Cooling performance of flat plate heat pipes with different liquid filling ratios
Energ. Convers. Manage. Hsieh 49 1774 2008 10.1016/j.enconman.2007.10.024 Thermal performance of flat vapor chamber heat spreader
Int. Commun. Heat Mass Yung 37 1266 2010 10.1016/j.icheatmasstransfer.2010.07.023 Thermal performance of high brightness LED array package on PCB
Exp. Therm. Fluid Sci. Guo 48 147 2013 10.1016/j.expthermflusci.2013.02.017 Effects of upwind area of tube inserts on heat transfer and flow resistance characteristics of turbulent flow
IEEE T. Power Electr. Juntunen 29 1410 2014 10.1109/TPEL.2013.2260769 Copper-core MCPCB with thermal vias for high-power COB LED modules
IEEE Trans. Electro. Dev. Ying 62 896 2015 10.1109/TED.2015.2390255 Thermal analysis of high-power multichip COB light-emitting diodes with different chip sizes
Exp. Therm. Fluid Sci. Wang 48 222 2013 10.1016/j.expthermflusci.2013.03.004 Experimental investigations of flat plate heat pipes with interlaced narrow grooves or channels as capillary structure
Exp. Techn. Wang 35 35 2011 10.1111/j.1747-1567.2010.00652.x A novel formula for effective thermal conductivity of vapor chamber
Appl. Therm. Eng. Solomon 100 462 2016 10.1016/j.applthermaleng.2016.02.042 Analytical expression for thermal conductivity of heat pipe
ANSYS Inc., Southpointe, Ansys Icepak user’s guide release 14.0, Canonsburg, PA; 2011, pp. 694-695.
Comput. Phys. Commun. Jiang 176 471 2007 10.1016/j.cpc.2006.12.003 Mesoscale SPH modeling of fluid flow in isotropic porous media
*원문 PDF 파일 및 링크정보가 존재하지 않을 경우 KISTI DDS 시스템에서 제공하는 원문복사서비스를 사용할 수 있습니다.
Copyright KISTI. All Rights Reserved.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.