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[해외논문] Graphene–Carbon–Metal Composite Film for a Flexible Heat Sink

ACS applied materials & interfaces, v.9 no.46, 2017년, pp.40801 - 40809  

Cho, Hyunjin (Applied Quantum Composites Research Center, Korea Institute of Science and Technology, Chudong-ro 92, Bongdong-eup, Wanju, Jeollabuk-do 55324,) ,  Rho, Hokyun (Applied Quantum Composites Research Center, Korea Institute of Science and Technology, Chudong-ro 92, Bongdong-eup, Wanju, Jeollabuk-do 55324,) ,  Kim, Jun Hee (Applied Quantum Composites Research Center, Korea Institute of Science and Technology, Chudong-ro 92, Bongdong-eup, Wanju, Jeollabuk-do 55324,) ,  Chae, Su-Hyeong (Applied Quantum Composites Research Center, Korea Institute of Science and Technology, Chudong-ro 92, Bongdong-eup, Wanju, Jeollabuk-do 55324,) ,  Pham, Thang Viet (Applied Quantum Composites Research Center, Korea Institute of Science and Technology, Chudong-ro 92, Bongdong-eup, Wanju, Jeollabuk-do 55324,) ,  Seo, Tae Hoon (Department of Advanced Chemicals & Engineering, Chonnam National University, 77, Yongbong-ro, Buk-gu, Gwangju 61186,) ,  Kim, Hak Yong (Applied Quantum Composites Research Center, Korea Institute of Science and Technology, Chudong-ro 92, Bongdong-eup, Wanju, Jeollabuk-do 55324,) ,  Ha, Jun-Seok (Applied Qua) ,  Kim, Hwan Chul ,  Lee, Sang Hyun ,  Kim, Myung Jong

Abstract AI-Helper 아이콘AI-Helper

The heat generated from electronic devices such as light emitting diodes (LEDs), batteries, and highly integrated transistors is one of the major causes obstructing the improvement of their performance and reliability. Herein, we report a comprehensive method to dissipate the generated heat to a vas...

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