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NTIS 바로가기Microelectronics reliability, v.80, 2018년, pp.85 - 90
Lim, Chulseung (Hanyang University, Electronic and Communication Engineering Department, 55 Hanyangdaehak-ro, Sangnok-gu, Ansan-si, Gyeonggi-do 426-791, Republic of Korea) , Park, Kyungbae (Hanyang University, Electronic and Communication Engineering Department, 55 Hanyangdaehak-ro, Sangnok-gu, Ansan-si, Gyeonggi-do 426-791, Republic of Korea) , Bak, Geunyong (Hanyang University, Electronic and Communication Engineering Department, 55 Hanyangdaehak-ro, Sangnok-gu, Ansan-si, Gyeonggi-do 426-791, Republic of Korea) , Yun, Donghyuk (Hanyang University, Electronic and Communication Engineering Department, 55 Hanyangdaehak-ro, Sangnok-gu, Ansan-si, Gyeonggi-do 426-791, Republic of Korea) , Park, Myungsang (Hanyang University, Electronic and Communication Engineering Department, 55 Hanyangdaehak-ro, Sangnok-gu, Ansan-si, Gyeonggi-do 426-791, Republic of Korea) , Baeg, Sanghyeon (Hanyang University, Electronic and Communication Engineering Department, 55 Hanyangdaehak-ro, Sangnok-gu, Ansan-si, Gyeonggi-do 426-791, Republic of Korea) , Wen, Shi-Jie (Cisco Systems Inc., Component Engineering Group, San Jose,) , Wong, Richard
Proton-based radiation damage tests were performed with DDR4 SDRAM components from two different technologies. Experiment results showed that after proton irradiation, the number of bit errors caused by the row hammering test increased about 41% and 66% in technologies 2x-nm and 2y-nm, respectively....
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