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Thermochimica acta, v.663, 2018년, pp.53 - 57
Feng, Hongliang (Corresponding author.) , Huang, Jihua , Peng, Xianwen , Lv, Zhiwei , Wang, Yue , Yang, Jian , Chen, Shuhai , Zhao, Xingke
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Abstract Transient liquid phase sintering (TLPS) bonding process is a promising packaging process for the new generation semiconductor devices. In this paper, the dynamics of Ni-Sn TLPS bonding is researched. The melting enthalpy and the residual rate of Sn in the simulative and actual bonding proc...
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