Mousnier, M.
(CNES (French Space Agency), 18 av. E. Belin, Toulouse, France)
,
Sanchez, K.
(CNES (French Space Agency), 18 av. E. Belin, Toulouse, France)
,
Locatelli, E.
(CNES (French Space Agency), 18 av. E. Belin, Toulouse, France)
,
Lebey, T.
(LAboratoire PLAsma et Conversion d'Energie (LAPLACE Laboratory), UMR 5213, Université)
,
Bley, V.
(de Toulouse CNRS, 31062 Toulouse, France)
Abstract Non-destructive failure analysis and defect characterization are necessary steps for every component that is destined to space projects. Infrared Thermography is a non-invasive, contactless technique providing information regarding defect localization as well as thermal characterization. T...
Abstract Non-destructive failure analysis and defect characterization are necessary steps for every component that is destined to space projects. Infrared Thermography is a non-invasive, contactless technique providing information regarding defect localization as well as thermal characterization. The system used in CNES Expertise Laboratory is a DCG ELITE system equipped with an InSb camera that detects IR between 3 and 5 μm. Defect localization could be done in steady state observation, where the Device Under Test (DUT) is observed in nominal condition for hot spot localization. The spatial resolution for the localization of defect heat sources could be improved by a lock-in mode, also known as phase sensitive modulation thermography. Defective or not, the component can be thermally characterized by time related heat propagation. Here the origin of the heat source is visualized, and the temperature measurements give a thermal map of the DUT. Both defect localization and thermal characterization are possible on board and component level, and their utilization will be illustrated by studying case analyses. Highlights The IR Thermography is a nondestructive and contactless tool. Defect localization on ceramic capacitor before electrical signature of the defect. Temperature measurement for failure propagation prevention and characterization. Temperature measurement stays difficult due to emissivity issue.
Abstract Non-destructive failure analysis and defect characterization are necessary steps for every component that is destined to space projects. Infrared Thermography is a non-invasive, contactless technique providing information regarding defect localization as well as thermal characterization. The system used in CNES Expertise Laboratory is a DCG ELITE system equipped with an InSb camera that detects IR between 3 and 5 μm. Defect localization could be done in steady state observation, where the Device Under Test (DUT) is observed in nominal condition for hot spot localization. The spatial resolution for the localization of defect heat sources could be improved by a lock-in mode, also known as phase sensitive modulation thermography. Defective or not, the component can be thermally characterized by time related heat propagation. Here the origin of the heat source is visualized, and the temperature measurements give a thermal map of the DUT. Both defect localization and thermal characterization are possible on board and component level, and their utilization will be illustrated by studying case analyses. Highlights The IR Thermography is a nondestructive and contactless tool. Defect localization on ceramic capacitor before electrical signature of the defect. Temperature measurement for failure propagation prevention and characterization. Temperature measurement stays difficult due to emissivity issue.
Sensors Bae 17 2331 1 2017 3D defect localization on exothermic faults within multi-layered structures using lock-in thermography: an experimental and numerical approach
2014 Thermal Modeling and Characterization of High-power Devices
1993 The Physics of Liquid Crystals
Int. J. Precis. Eng. Manuf. Ranjit 16 11 2255 2015 10.1007/s12541-015-0290-z Investigation of Lock-in Infrared Thermography for evaluation of subsurface defects size and depth
J. Therm. Sci. Yang 11 4 331 2002 10.1007/s11630-002-0046-9 Infrared thermography for true temperature measurement of the main board in personal computer
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