[논문]Reduced thermal resistance of heat sink using graphene oxide decorated with copper nanoparticles

Ryu, Beo Deul; Han, Min; Ko, Kang Bok; Lee, Kyu-Han; Cuong, Tran Viet; Han, Nam; Kim, Kyurin; Ryu, Jae Hyung; Park, Noh-Joon; Lim, Yongsu; Thanh, Do Trong; Jo, Chang Hee; Ju, Kwanseon; Hong, Chang-Hee

doi:10.1016/j.materresbull.2018.06.028

Reduced thermal resistance of heat sink using graphene oxide decorated with copper nanoparticles

Materials research bulletin, v.110, 2019년, pp.76 - 81

Ryu, Beo Deul (School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea) , Han, Min (School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea) , Ko, Kang Bok (School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea) , Lee, Kyu-Han (LED Agri-bio Fusion Technology Research Center, Chonbuk National University, Iksan, 54596, South Korea) , Cuong, Tran Viet (School of Semiconductor and Chemical Engineering, Semiconductor Physics Research Center, Chonbuk National University, Jeonju, 54896, South Korea) , Han, Nam (Department of Material Science and Engineering, Pohang University of Science and Technology (POSTECH), Pohang 37673, South Korea) , Kim, Kyurin (Korea Institute of Lighting Technology Jeonbuk Institute, Wonkwang University, Iksan, 54538, South Korea) , Ryu, Jae Hyung (Korea Institute of Lighting Technology Jeonbuk Institute, Wonkwang Un) , Park, Noh-Joon , Lim, Yongsu , Thanh, Do Trong , Jo, Chang Hee , Ju, Kwanseon , Hong, Chang-Hee

Abstract ▼ AI-Helper

Abstract Three–dimensional thermal interface materials made of graphene oxide (GO) and copper nanoparticles (Cu NPs) were applied for enhancing light–emitting diode heat dissipation. The effect of the stacking order of GO and Cu NPs on thermal resistance was explored by creating two types of samples: spray–coated with a mixed GO–Cu NPs and layer–by–layer stacked with GO/Cu NPs/GO. A reduction of thermal resistance for mixed GO–Cu NPs and layer–by–layer stacked structure by 37% and 33%, respectively, compared to that of Al heat sink. The lower thermal resistance of the mixed GO–Cu NPs sample is attributed to the fact that distributed Cu NPs at the step edge of GO sheets enhances the out–of–plane heat transfer at wrinkles/folds of GO interlayers. Therefore, a mixed GO–Cu NPs is considered as a promising composite for effective thermal management of high–performance optoelectronic devices. Highlights Three–dimensional thermal interface materials made of graphene oxide and copper nanoparticles (GO–Cu NPs) have synthesized. The effect of the stacking order of GO–Cu NPs on thermal resistance has explored for enhancing LED heat dissipation. Analysis by a FLIR camera has showed that the combination of GO and Cu NPs enabled heat dissipation properties. The thermal resistance of the mixed GO–Cu NPs structure is less 37 % than that of the Al heat sink. Graphical abstract [DISPLAY OMISSION]

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Reduced thermal resistance of heat sink using graphene oxide decorated with copper nanoparticles

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Reduced thermal resistance of heat sink using graphene oxide decorated with copper nanoparticles

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