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NTIS 바로가기Journal of electronic packaging, v.138 no.1, 2016년, pp.010906 -
Schlottig, Gerd (IBM Research-Zurich, Rü) , de Fazio, Marco (schlikon 8803, Switzerland e-mail:) , Escher, Werner (Advanced System Technology, ST Microelectronics, Burlington, MA 01803) , Granatieri, Paola (IBM Research-Zurich, Rü) , Khanna, Vijayeshwar D. (schlikon 8803, Switzerland) , Brunschwiler, Thomas (Custom MEMS Division, ST Microelectronics, Agrate Brianza 20864, MB, Italy)
We demonstrate the lid-integral silicon cold-plate topology as a way to bring liquid cooling closer to the heat source integrated circuit (IC). It allows us to eliminate one thermal interface material (TIM2), to establish and improve TIM1 during packaging, to use wafer-level processes, and to ease i...
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