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NTIS 바로가기Electrical Performance of Electronic Packaging, 1996., IEEE 5th Topical Meeting, 1996, 1996년, pp.11 - 13
Harrer, B. (IBM Deutschland Entwicklung GmbH, Boeblingen, Germany) , Kaller, D. , Klink, E.
The paper describes the modeling and simulation of thin film interconnection lines with frequency dependent attenuation. It compares different modeling approaches and shows, for which lengths frequency dependency due to the large resistance is no longer negligible. Signal integrity is discussed for the coupled noise, where two horizontal neighbors are considered. The performance impact of the coupled lines is shown for four different operation modes.
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