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NTIS 바로가기Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013 8th International, 2013 Oct, 2013년, pp.198 - 201
Huang, Shih-Hsu (Department of Electronic Engineering, Chung Yuan Christian University, Chung Li, Taiwan, R.O.C.) , Yeh, Hua-Hsin (Department of Electronic Engineering, Chung Yuan Christian University, Chung Li, Taiwan, R.O.C.) , Cheng, Chun-Hua (Department of Electronic Engineering, Chung Yuan Christian University, Chung Li, Taiwan, R.O.C.)
The minimization of TSV (through-silicon-via) count is one of the most important objectives in the 3D IC (three-dimensional integrated circuit) design. In this paper, we demonstrate that the selection of wafer bonding type for each pair of adjacent layers has a great impact on the TSV count. However...
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