3D IC assembly using thermal compression bonding and wafer-level underfill — Strategies for quality improvement and throughput enhancement
Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th,
2016 Nov,
2016년, pp.791 - 796
Wang, Teng
(IMEC, Kapeldreef 75, 3001 Leuven, Belgium)
,
Bex, Pieter
(IMEC, Kapeldreef 75, 3001 Leuven, Belgium)
,
Capuz, Giovanni
(IMEC, Kapeldreef 75, 3001 Leuven, Belgium)
,
Duval, Fabrice
(IMEC, Kapeldreef 75, 3001 Leuven, Belgium)
,
Inoue, Fumihiro
(IMEC, Kapeldreef 75, 3001 Leuven, Belgium)
,
Gerets, Carine
(IMEC, Kapeldreef 75, 3001 Leuven, Belgium)
,
Bertheau, Julien
(IMEC, Kapeldreef 75, 3001 Leuven, Belgium)
,
Rebibis, Kenneth June
(IMEC, Kapeldreef 75, 3001 Leuven, Belgium)
,
Miller, Andy
(IMEC, Kapeldreef 75, 3001 Leuven, Belgium)
,
Beyer, Gerald
(IMEC, Kapeldreef 75, 3001 Leuven, Belgium)
,
Beyne, Eric
(IMEC, Kapeldreef 75, 3001 Leuven, Belgium)
,
Natsukawa, Masanori
(Electronics-related Materials Development Center, R&)
,
Mitsukura, Kazuyuki
(D headquarters, Hitachi Chemical Co., Ltd., Ichihara-shi, Chiba, 290-8697, Japan)
,
Hatakeyama, Keiichi
(Packaging Solution Center, R&)
This paper examines the key aspects for quality improvement and throughput enhancement of thermal compression bonding (TCB) process using dry film laminated wafer-level underfill (WLUF) material. The WLUF material must have good compatibility with pre-assembly and assembly process steps. And all the...
This paper examines the key aspects for quality improvement and throughput enhancement of thermal compression bonding (TCB) process using dry film laminated wafer-level underfill (WLUF) material. The WLUF material must have good compatibility with pre-assembly and assembly process steps. And all the process steps after and including WLUF lamination have to be co-optimized to ensure the integrity of the WLUF material, consequently leading to higher stacking yield. Good bump joining and underfill filling quality is achieved by optimization different stages of the TCB profiles. A new method enabled by WULF, termed vertical collective bonding (VCB), is applied to multi-layer 3D stacking, producing good bonding quality and significant process time saving. Multi-layer 3D stacks made by the VCB process show good thermomechanical reliability in high temperature storage and thermal cycling tests.
This paper examines the key aspects for quality improvement and throughput enhancement of thermal compression bonding (TCB) process using dry film laminated wafer-level underfill (WLUF) material. The WLUF material must have good compatibility with pre-assembly and assembly process steps. And all the process steps after and including WLUF lamination have to be co-optimized to ensure the integrity of the WLUF material, consequently leading to higher stacking yield. Good bump joining and underfill filling quality is achieved by optimization different stages of the TCB profiles. A new method enabled by WULF, termed vertical collective bonding (VCB), is applied to multi-layer 3D stacking, producing good bonding quality and significant process time saving. Multi-layer 3D stacks made by the VCB process show good thermomechanical reliability in high temperature storage and thermal cycling tests.
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