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NTIS 바로가기Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th, 2018 Dec, 2018년, pp.843 - 847
Wai, Leong Ching (A*STAR (Agency for Science, Technology and Research), 2 Fusionopolis Way, #08-02 Innovis Tower, Institute of Microelectronics, 138634, Singapore) , Guan, Lim Teck (A*STAR (Agency for Science, Technology and Research), 2 Fusionopolis Way, #08-02 Innovis Tower, Institute of Microelectronics, 138634, Singapore)
Gold wire bonding process was evaluated with ENEPIG bondfingers which consist of 5umNi/0.2umPd/0.2umAu layers on the Cu traces. Total of 295 wires with wire length range from 2.4 to 3.8mm were bonded for each package. Massive short tail issues were encountered at initial set-up, which resulted in th...
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