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NTIS 바로가기Electronic Packaging Technology (ICEPT), 2020 21st International Conference on, 2020 Aug, 2020년, pp.1 - 3
Chen, Hang (Ceprei Laboratory,Components and Material Research Department,Guangzhou,China) , Ma, Lili (Reliabilitiy research and analysis center,Ceprei Laboratory,Guangzhou,China)
Wire bonding was still the most popular interconnect technology in the first-level packaging. In fine pitch packaging, Au-Au bonding system was preferred, and had a higher reliability, which was widely used in consumer and military products. The quality and reliability of Au-Au bonding was influence...
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