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NTIS 바로가기Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), 2019 20th International Conference on, 2019 June, 2019년, pp.402 - 404
Cho, Seongkyu (Department of Electrical and Computer Engineering, Seoul National University, Republic of Korea) , Lee, Daewon (Interdisciplinary Program in Bioengineering, Seoul National University, Republic of Korea) , Kwon, Sunghoon (Department of Electrical and Computer Engineering, Seoul National University, Republic of Korea)
In this paper, we present a demonstration of high yield Fluidic Self-Assembly (FSA) technology to transfer gallium nitride (GaN) microchips which can be used for Micro-LED display. The low melting point alloy on the substrate and the metal electrode of the chip were assembled in heated solution by a...
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