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NTIS 바로가기Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th, 2020 June, 2020년, pp.1728 - 1735
Guan, Lim Teck (Institute of Microelectronics,ASTAR (Agency for Science, Technology and Research),Singapore) , Soon Wee Ho, David (Institute of Microelectronics,ASTAR (Agency for Science, Technology and Research),Singapore) , Chong, Chai Tai (Institute of Microelectronics,ASTAR (Agency for Science, Technology and Research),Singapore) , Bhattacharya, Surya (Institute of Microelectronics,ASTAR (Agency for Science, Technology and Research),Singapore)
Fan-Out Wafer Level Packaging (FOWLP) is the most popular packaging and integration technology today. It has evolved from providing basic routing of the bare chip electrical Input/Output (I/Os) connection to a complex multi-functionality System-in-Package (SiP) integration platform. The FOWLP has th...
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