초록 ▼

A multi-bridge-channel MOSFET (MBCFET) may be formed by forming a stacked structure on a substrate that includes channel layers and interchannel layers interposed between the channel layers. Trenches are formed by selectively etching the stacked structure. The trenches run across the stacked struct

A multi-bridge-channel MOSFET (MBCFET) may be formed by forming a stacked structure on a substrate that includes channel layers and interchannel layers interposed between the channel layers. Trenches are formed by selectively etching the stacked structure. The trenches run across the stacked structure parallel to each other and separate a first stacked portion including channel patterns and interchannel patterns from second stacked portions including channel and interchannel layers remaining on both sides of the first stacked portion. First source and drain regions are grown using selective epitaxial growth. The first source and drain regions fill the trenches and connect to second source and drain regions defined by the second stacked portions. Marginal sections of the interchannel patterns of the first stacked portion are selectively exposed. Through tunnels are formed by selectively removing the interchannel patterns of the first stacked portion beginning with the exposed marginal sections. The through tunnels are surrounded by the first source and drain regions and the channel patterns. A gate is formed along with a gate dielectric layer, the gate filling the through tunnels and extending onto the first stacked portion.

대표청구항 ▼

That which is claimed: 1. A method of forming a multi-bridge-channel metal oxide semiconductor field effect transistor (MOSFET), comprising: forming a stacked structure on a substrate, the stacked structure comprising channel layers and interchannel layers interposed between the channel layers;

That which is claimed: 1. A method of forming a multi-bridge-channel metal oxide semiconductor field effect transistor (MOSFET), comprising: forming a stacked structure on a substrate, the stacked structure comprising channel layers and interchannel layers interposed between the channel layers; forming trenches by selectively etching the stacked structure, the trenches running across the stacked structure parallel to each other and separating a first stacked portion comprising channel patterns and interchannel patterns from second stacked portions comprising channel layers and interchannel layers remaining on both sides of the first stacked portion; growing first source and drain regions using selective epitaxial growth, the first source and drain regions filling the trenches and being connected to second source and drain regions defined by the second stacked portions; selectively exposing marginal sections of the interchannel patterns of the first stacked portion; forming through tunnels by selectively removing the interchannel patterns of the first stacked portion beginning with the exposed marginal sections, the through tunnels being surrounded by the first source and drain regions and the channel patterns; and forming a gate along with a gate dielectric layer, the gate filling the through tunnels and extending onto the first stacked portion. 2. The method of claim 1, wherein the substrate comprises a silicon substrate and a silicon on insulator (SOI) substrate. 3. The method of claim 1, wherein the channel layers and the interchannel layers comprise single crystalline semiconductor materials, respectively, having an etch selectivity with respect to each other. 4. The method of claim 3, wherein the first source and drain regions have an etch selectivity with respect to the interchannel layers. 5. The method of claim 4, wherein forming the stacked structure comprises: forming the channel layers by epitaxially growing a silicon layer; forming the interchannel layers by epitaxially growing a silicon germanium layer; and forming the first source and drain regions by growing a silicon layer using selective epitaxial growth. 6. The method of claim 1, wherein the trenches are spaced apart from each other such that the first stacked portion has about a same width as a width of a portion of the gate that extends onto the first stacked portion. 7. The method of claim 1, wherein the first source and drain regions have about a same height as a top surface of the first stacked portion. 8. The method of claim 1, further comprising: forming gate spacers on sidewalls of a portion of the gate that extends onto the first stacked portion; wherein the trenches have about a same width as that of the gate spacers. 9. The method of claim 8, further comprising: selectively forming a metal silicide layer on portions of the gate that are exposed by the gate spacers and surfaces of the second source and drain regions. 10. The method of claim 1, wherein the gate dielectric layer is formed between the gate and the channel patterns and between the gate and the first source and drain regions. 11. A method of forming a multi-bridge-channel FET (MBCFET), comprising: forming a stacked structure on a substrate, the stacked structure comprising channel layers and interchannel layers interposed between the channel layers; forming an isolation region defining the stacked structure; forming a dummy gate pattern on the stacked structure; forming dummy spacers on sides of the dummy gate pattern; forming a first mask pattern by oxidizing a surface of the stacked structure exposed by the dummy spacers; selectively removing the dummy spacers; forming trenches by selectively removing exposed portions of the stacked structure using the dummy gate pattern and the first mask pattern as an etch mask, the trenches separating a first stacked portion comprising channel patterns and interchannel patterns from second stacked portions comprising channel layers and interchannel layers remaining on both sides of the first stacked portion; growing first source and drain regions using selective epitaxial growth, the first source and drain regions filling the trenches and being connected to second source and drain regions defined by the second stacked portions; forming second mask patterns on sides of the dummy gate patterns; exposing marginal sections of the interchannel patterns of the first stacked portion by selectively removing the dummy gate pattern using the second mask pattern as an etch mask and selectively removing a portion of the isolation region that is exposed under the dummy gate pattern; forming through tunnels by selectively removing the interchannel patterns of the first stacked portion beginning with the exposed marginal sections, the through tunnels being surrounded by the first source and drain regions and the channel patterns; and forming a gate along with a gate dielectric layer, the gate filling the through tunnels and extending onto the first stacked portion. 12. The method of claim 11, wherein the channel layers and the interchannel layers comprise single crystalline semiconductor materials, respectively, having an etch selectivity with respect to each other. 13. The method of claim 12, wherein the first source and drain regions have an etch selectivity with respect to the interchannel layers. 14. The method of claim 13, wherein forming the stacked structure comprises: forming the channel layers by epitaxially growing a silicon layer; forming the interchannel layers by epitaxially growing a silicon germanium layer; and forming the first source and drain regions by growing a silicon layer using selective epitaxial growth. 15. The method of claim 11, wherein the dummy gate pattern comprises silicon oxide. 16. The method of claim 11, wherein the dummy spacers comprise silicon nitride. 17. The method of claim 11, wherein the first source and drain regions have about a same height as a top surface of the first stacked portion. 18. The method of claim 11, wherein forming the second mask patterns comprises: forming a silicon nitride layer to cover the first source and drain regions; and planarizing the silicon nitride layer until a top surface of the dummy gate pattern is exposed. 19. The method of claim 11, further comprising: selectively removing the second mask patterns; selectively removing the first mask pattern; forming gate spacers on sidewalls of a portion of the gate that extends onto the first stacked portion; and selectively forming a metal suicide layer on the portion of the gate and the second source and drain regions that are exposed by the gate spacers. 20. The method of claim 11, wherein the gate dielectric layer extends between the gate and the channel patterns of the first stacked portion and between the gate and the first source and drain regions.