Chip Front Surface Touchless Pick and Place Tool or Flip Chip Bonder
원문보기
IPC분류정보
국가/구분
United States(US) Patent
공개
국제특허분류(IPC7판)
H01L-021/67
H01L-023/00
H01L-021/683
출원번호
16550109
(2019-08-23)
공개번호
20210057242
(2021-02-25)
발명자
/ 주소
Tang, Yunjun
Liu, Zongrong
Yi, Ge
출원인 / 주소
Tang, Yunjun
인용정보
피인용 횟수 :
0인용 특허 :
0
초록▼
A piece of pick and place tool or a chip bonding equipment, which has innovative designs enabling chip(s) on a tape to get picked up without touching its front surface, is invented. The designs use levitation technologies to receive and hold the chips detached from the tape from a face-down position
A piece of pick and place tool or a chip bonding equipment, which has innovative designs enabling chip(s) on a tape to get picked up without touching its front surface, is invented. The designs use levitation technologies to receive and hold the chips detached from the tape from a face-down position. A streamline design is also invented to provide better productivity. The invented pick and place tool or chip bonder is particularly useful for applications which require using chips with zero tolerance of particle and/or contamination on the chip front surfaces.
대표청구항▼
1. A pick and place tool or flip chip bonder—a piece of equipment for chip picking up and placement, or bonding, comprises at least: A chip supply station, to supply a set of chips from a tape, having a chip supply stand and at least a chip receiving head with a levitation mechanism to sequentially
1. A pick and place tool or flip chip bonder—a piece of equipment for chip picking up and placement, or bonding, comprises at least: A chip supply station, to supply a set of chips from a tape, having a chip supply stand and at least a chip receiving head with a levitation mechanism to sequentially catch and float the chips without touching the chips' front surface;A chip placement or bonding station with a chip handling head. 2. The system of claim 1, wherein said set of chips on said tape is placed on said chip supply stand with the chips' front surface down. 3. The system of claim 1, wherein said chip bonder further comprises a surface activation station to activate the bonding surface of said set of chips. 4. The system of claim 1, wherein said chip supply station has at least a UV source to provide a UV light illumination to weaken the adhesion strength between said set of chips and said tape while a UV sensitive tape other than a pressure sensitive tape is used. 5. The system of claim 1, wherein said chip supply station has at least a mechanism to detach said set of chips from said tape. 6. The system of claim 5, wherein said mechanism is a pushing tool. 7. The system of claim 1, wherein said chip handling head from said chip placement or bonding station is capable of picking a chip floating on said chip receiving head. 8. The system of claim 1, wherein said levitation mechanism is an aerodynamic levitation. 9. The system of claim 1, wherein said levitation mechanism is an electrostatic levitation after said set of chips are electrically charged from the back of said tape. 10. The system of claim 1, wherein said levitation mechanism is an acoustic levitation. 11. The system of the claim 10, wherein said acoustic levitation is provided by an interference effect between a group of acoustic waves from a set of ultrasonic generators with a predetermined arrangement. 12. The system of the claim 10, wherein said acoustic levitation is provided by an interference effect between at least an acoustic wave from an acoustic wave generator and its reflected wave. 13. The system of the claim 1, wherein said pick and place tool or flip chip bonder further comprises a chip sitting levitation station with a chip acoustic levitation stand for holding a chip from said chip supply station. 14. The system of the claim 1, wherein said chip supply station has a set of chip receiving heads placed on a moving conveyor belt, which links said chip supply station with said chip placement or bonding station. 15. The system of the claim 14, wherein said moving conveyor belt has a fixed location under the chip supply stand for a member of said set of chip receiving heads catching and floating a detached chip, then continue following the moving conveyor belt toward the chip placement or bonding station. 16. The system of the claim 14, wherein said moving conveyor belt has a fixed site in the chip placement or bonding station for a chip handling head to pick up a chip from a member of said set of chip receiving heads. 17. The system of the claim 16, wherein said member of the chip receiving heads, with its chip picked by said chip handling head, moves along the conveyor belt to return back to the chip supply station and queues for chip receiving. 18. The system of the claim 14, wherein said chip supply station has an assemble made by a set of pushing tools, which is capable of being activated individually to push and detach its targeted chip. 19. The system of the claim 1, wherein said chip supply stand is movable laterally, and even vertically, by an adjustable computer program, based on the incoming chips' size and weight, on a control computer of said pick and place tool or flip chip bonder.
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