CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
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IPC분류정보
국가/구분
United States(US) Patent
공개
국제특허분류(IPC7판)
H01L-023/373
H01L-023/498
H01L-025/18
H05K-001/18
H05K-001/02
출원번호
17508483
(2021-10-22)
공개번호
20220139799
(2022-05-05)
우선권정보
KR-10-2020-0143874 (2020-10-30)
발명자
/ 주소
Jung, Jaemin
Han, Sanguk
Jung, Yoonha
출원인 / 주소
Jung, Jaemin
인용정보
피인용 횟수 :
0인용 특허 :
0
초록▼
A chip-on-film package includes a base film including an upper surface and a lower surface that opposite from each other, a semiconductor chip mounted on the upper surface of the base film, a heat emission layer disposed on the lower surface of the base film to at least partially overlap the semicon
A chip-on-film package includes a base film including an upper surface and a lower surface that opposite from each other, a semiconductor chip mounted on the upper surface of the base film, a heat emission layer disposed on the lower surface of the base film to at least partially overlap the semiconductor chip in a thickness direction, an insulating layer disposed on a lower surface of the heat emission layer, and a protective layer surrounding side and lower surfaces of the insulating layer. Accordingly, thermal fatigue of the chip-on-film package may be reduced, and reliability may be increased.
대표청구항▼
1. A chip-on-film package comprising: a base film comprising an upper surface and a lower surface opposite to each other;a semiconductor chip mounted on the upper surface of the base film;a heat emission layer disposed on the lower surface of the base film to at least partially overlap the semicondu
1. A chip-on-film package comprising: a base film comprising an upper surface and a lower surface opposite to each other;a semiconductor chip mounted on the upper surface of the base film;a heat emission layer disposed on the lower surface of the base film to at least partially overlap the semiconductor chip in a thickness direction;an insulating layer disposed on a lower surface of the heat emission layer; anda protective layer surrounding side and lower surfaces of the insulating layer. 2. The chip-on-film package of claim 1, wherein the insulating layer comprises a plurality of pores in the insulating layer, and a thickness of the insulating layer is between about 30 μm and about 100 μm. 3. The chip-on-film package of claim 1, wherein the insulating layer comprises a material that has a melting point at a temperature exceeding about 150° C. and thermal conductivity from about 0.02 W/(m·K) to about 0.08 W/(m·K). 4. The chip-on-film package of claim 1, wherein the insulating layer comprises heat-resistant fiber, graphite, and/or polyurethane. 5. The chip-on-film package of claim 1, wherein the heat emission layer comprises a metal material. 6. The chip-on-film package of claim 1, wherein the protective layer comprises carbon. 7. The chip-on-film package of claim 1, wherein, in a plan view, a horizontal width and a vertical width of the insulating layer are less than a horizontal width and a vertical width, respectively, of the heat emission layer overlapping the insulating layer in the thickness direction. 8. The chip-on-film package of claim 7, wherein the protective layer conformally covers: the side and lower surfaces of the insulating layer; andthe lower surface of the heat emission layer exposed by the insulating layer. 9. The chip-on-film package of claim 8, wherein the protective layer is formed by using a spray coating method. 10. The chip-on-film package of claim 1, wherein the base film comprises a flexible insulation substrate. 11. A chip-on-film package comprising: a base film comprising an upper surface and a lower surface opposite from each other, wherein a chip mount area is defined on the upper surface;a conductive line disposed on the upper surface of the base film and comprising a conductive pad on an end portion of the conductive line;a semiconductor chip mounted in the chip mount area and comprising a long side in a first direction and a short side in a second direction perpendicular to the first direction;a protection layer disposed on the conductive line and the upper surface of the base film, wherein the protection layer exposes the conductive pad;a bump structure arranged between the conductive pad and a bump pad of the semiconductor chip;an underfill filled between the semiconductor chip and the base film and surrounding the bump structure;a heat emission layer disposed on the lower surface of the base film to at least partially overlap the chip mount area in a thickness direction;an insulating layer disposed on a lower surface of the heat emission layer;a first adhesive layer arranged between the base film and the heat emission layer;a second adhesive layer arranged between the heat emission layer and the insulating layer; anda protective layer surrounding side and lower surfaces of the insulating layer. 12. The chip-on-film package of claim 11, wherein the heat emission layer comprises a metal material, and the insulating layer comprises a plurality of pores 13. The chip-on-film package of claim 11, wherein a width of the insulating layer in the first direction is less than a width of the heat emission layer in the first direction, and a width of the insulating layer in the second direction is less than a width of the heat emission layer in the second direction. 14. The chip-on-film package of claim 11, wherein the protective layer comprises carbon and is formed by using a spray coating method. 15. The chip-on-film package of claim 11, wherein the heat emission layer, the second adhesive layer, the insulating layer, and the protective layer form one composite material tape. 16. A display apparatus comprising: a chip-on-film package comprising a base film that comprises an upper surface and a lower surface opposite from each other;a display panel contacting a portion of the upper surface of the base film; anda driving printed circuit board contacting another portion of the upper surface of the base film,wherein the chip-on-film package comprises:a display driver IC mounted on the upper surface of the base film;a heat emission layer disposed on the lower surface of the base film to at least partially overlap the display driver IC in a thickness direction;an insulating layer disposed on a lower surface of the heat emission layer; anda protective layer surrounding side and lower surfaces of the insulating layer. 17. The display apparatus of claim 16, wherein the base film comprises a flexible film. 18. The display apparatus of claim 16, wherein the display panel comprises a front surface comprising a plurality of pixels, and a rear surface opposite to the front surface, the chip-on-film package is bent and fixed to the front surface of the display panel, andthe driving printed circuit board contacts the rear surface of the display panel. 19. The display apparatus of claim 16, wherein the insulating layer comprises a plurality of pores in the insulating layer, and a thickness of the insulating layer is between about 30 μm and about 100 μm. 20. The display apparatus of claim 16, wherein the heat emission layer comprises a metal material, and the protective layer comprises carbon and is formed by using a spray coating method.
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