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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.29 no.2, 2022년, pp.113 - 119
고명준 (한국생산기술연구원 접합적층연구부문 마이크로조이닝센터) , 손민정 (한국생산기술연구원 접합적층연구부문 마이크로조이닝센터) , 김민수 (한국생산기술연구원 접합적층연구부문 마이크로조이닝센터) , 나지후 (한국생산기술연구원 접합적층연구부문 마이크로조이닝센터) , 주병권 (고려대학교 전기전자공학부 디스플레이 및 나노시스템 연구실) , 박영배 (안동대학교 신소재공학부 청정에너지소재기술연구센터) , 이태익 (한국생산기술연구원 접합적층연구부문 마이크로조이닝센터)
In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have a...
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