CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
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IPC분류정보
국가/구분
United States(US) Patent
공개
국제특허분류(IPC7판)
H01L-023/538
H01L-025/18
H05K-001/18
출원번호
17579635
(2022-01-20)
공개번호
20220246530
(2022-08-04)
우선권정보
KR-10-2021-0016276 (2021-02-04)
발명자
/ 주소
Jung, Jaemin
Ha, Jeongkyu
Han, Sanguk
출원인 / 주소
Jung, Jaemin
인용정보
피인용 횟수 :
0인용 특허 :
0
초록▼
A chip on film (COF) package includes a base film having an upper surface and a lower surface opposite to each other, a bridge film having an edge that overlaps the base film, and an upper surface and a lower surface opposite to each other, a display driver integrated circuit (IC) mounted on the upp
A chip on film (COF) package includes a base film having an upper surface and a lower surface opposite to each other, a bridge film having an edge that overlaps the base film, and an upper surface and a lower surface opposite to each other, a display driver integrated circuit (IC) mounted on the upper surface of the base film, and a heat dissipation member arranged in correspondence with the display driver IC on the lower surface of the base film. The upper surface of the base film and the lower surface of the bridge film adhere to each other in their respective long axis directions, and a long axis length of the bridge film is greater than a long axis length of the base film.
대표청구항▼
1. A chip on film (COF) package comprising: a base film having an upper surface and a lower surface opposite to each other;a bridge film having an edge that overlaps the base film, and an upper surface and a lower surface opposite to each other;a display driver integrated circuit (IC) mounted on the
1. A chip on film (COF) package comprising: a base film having an upper surface and a lower surface opposite to each other;a bridge film having an edge that overlaps the base film, and an upper surface and a lower surface opposite to each other;a display driver integrated circuit (IC) mounted on the upper surface of the base film; anda heat dissipation member arranged in correspondence with the display driver IC on the lower surface of the base film,wherein the upper surface of the base film and the lower surface of the bridge film adhere to each other in their respective long axis directions, andwherein a long axis length of the bridge film is greater than a long axis length of the base film. 2. The COF package of claim 1, wherein a plurality of base films are attached to the bridge film. 3. The COF package of claim 1, wherein a short axis length of the bridge film is about 35 mm to about 156 mm. 4. The COF package of claim 1, wherein a first width of each first conductive line arranged on the upper surface of the base film is less than a second width of each second conductive lines arranged on the lower surface of the bridge film. 5. The COF package of claim 4, wherein, in the base film, a first protective layer covering the first conductive line includes solder resist or dry film resist, andwherein in the bridge film, a second protective layer covering the second conductive line includes UV reactive polyimide. 6. The COF package of claim 5, wherein the first protective layer is a first color and the second protective layer is a second color different from the first color. 7. The COF package of claim 1, wherein at least one of a passive element and a logic element are arranged on the lower surface of the bridge film. 8. The COF package of claim 7, wherein the passive element monitors a current amount. 9. The COF package of claim 1, wherein the bridge film comprises a flexible insulating material. 10. The COF package of claim 1, wherein an attachment area of a driving printed circuit board is included on the upper surface of the base film, andwherein an attachment area of a display panel is included on the lower surface of the bridge film. 11. A chip on film (COF) package comprising: a base film having an upper surface and a lower surface opposite to each other; anda bridge film having an edge that overlaps the base film, and an upper surface and a lower surface opposite to each other,wherein the base film comprises: a first conductive line arranged on the upper surface of the base film and having a first conductive pad;a display driver integrated circuit (IC) mounted on the upper surface of the base film;a first protective layer formed on the first conductive line and the upper surface of the base film so as to expose the first conductive pad;an underfill filled between the display driver IC and the base film; anda heat dissipation member arranged in correspondence with the display driver IC on the lower surface of the base film,wherein the bridge film comprises a second conductive line arranged on the lower surface of the bridge film and having a second conductive pad; and a second protective layer formed on the second conductive line and the lower surface of the bridge film so as to expose the second conductive pad,wherein the first conductive pad contacts the second conductive pad, andwherein a plurality of base films are spaced apart from each other and adhere to the bridge film. 12. The COF package of claim 11, wherein the second conductive line is arranged radially in a direction away from the first conductive line. 13. The COF package of claim 11, wherein a line and space interval of the first conductive line is less than a line and space interval of the second conductive line. 14. The COF package of claim 11, wherein the first protective layer and the second protective layer comprise different materials from each other, and wherein the first protective layer and the second protective layer have different colors from each other. 15. The COF package of claim 11, wherein the base film is in the shape of a substantially flat panel, and wherein the bridge film comprises a bending area having a predetermined radius of curvature. 16. A display apparatus comprising: a chip on film (COF) package comprising a base film and a bridge film;a display panel to which the COF package is bent and fixed; anda driving printed circuit board that faces the display panel,wherein the COF package comprises: a base film having an upper surface and a lower surface opposite to each other;a bridge film including an edge that overlaps the base film, and an upper surface and a lower surface opposite to each other;a display driver integrated circuit (IC) mounted on the upper surface of the base film; anda heat dissipation member arranged in correspondence with the display driver IC on the lower surface of the base film,wherein the upper surface of the base film and the lower surface of the bridge film adhere to each other in their respective long axis directions, andwherein a long axis length of the bridge film is greater than a long axis length of the base film. 17. The display apparatus of claim 16, wherein the display panel has a front surface including a plurality of pixels and a rear surface opposite to the front surface,wherein the lower surface of the bridge film has a predetermined radius of curvature and is bent to and attached to the front surface of the display panel,wherein the lower surface of the base film flatly faces the rear surface of the display panel, andwherein the driving printed circuit board is arranged on the upper surface of the base film so as to face the rear surface of the display panel. 18. The display apparatus of claim 16, wherein a plurality of base films are spaced apart from each other and adhere to the bridge film, andwherein a short axis length of the bridge film is about 35 mm to about 156 mm. 19. The display apparatus of claim 16, wherein the bridge film is attached to a lower end of the display panel, andwherein a short axis length of an area where the bridge film is attached to the display panel is about 0.9 mm to about 1.5 mm. 20. The display apparatus of claim 16, wherein at least one of a passive element and a logic element are arranged on the lower surface of the bridge film to monitor a current amount.
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