WAFER LEVEL CHIP SCALE PACKAGE HAVING VARYING THICKNESSES
원문보기
IPC분류정보
국가/구분
United States(US) Patent
공개
국제특허분류(IPC7판)
H01L-023/00
H01L-023/498
출원번호
18340380
(2023-06-23)
공개번호
20230411332
(2023-12-21)
발명자
/ 주소
LUAN, Jing-En
출원인 / 주소
STMICROELECTRONICS PTE LTD
인용정보
피인용 횟수 :
0인용 특허 :
0
초록▼
A wafer level chip scale package (WLCSP) with portions that have different thicknesses. A first passive surface of a die in the WLSCP includes a plurality of surfaces. The plurality of surfaces may include inclined surfaces or flat surfaces. Thicker portions of die, with more semiconductor material
A wafer level chip scale package (WLCSP) with portions that have different thicknesses. A first passive surface of a die in the WLSCP includes a plurality of surfaces. The plurality of surfaces may include inclined surfaces or flat surfaces. Thicker portions of die, with more semiconductor material remaining are non-critical portions that increase a WLCSP's strength for further processing and handling after formation, and the thinner portions are critical portions that reduce a Coefficient of Thermal Expansion (CTE) mismatch between a WLCSP and a PCB.
대표청구항▼
1. A device, comprising: a die including: a first surface, a plurality of second surfaces, and a third surface, the third surface being opposite the first surface and the plurality of second surfaces;a first portion positioned at a center of the die having a first thickness, the first thickness exte
1. A device, comprising: a die including: a first surface, a plurality of second surfaces, and a third surface, the third surface being opposite the first surface and the plurality of second surfaces;a first portion positioned at a center of the die having a first thickness, the first thickness extending between the first surface and the third surface; anda plurality of second portions having a second thickness that is less than the first thickness, the second thickness extending between each one of the plurality of second surfaces and the third surface, each one of the plurality of second portions being positioned at a corresponding one of a plurality of corners of the die, each one of the second portions separated from each other by the first portion. 2. The device of claim 1, wherein the first surface has a plus shape. 3. The device of claim 2, further comprising: a first sidewall and a second sidewall opposite to the first sidewall, the first and second sidewalls having a T-shape; anda third sidewall and a fourth sidewall opposite to the third sidewall, the third and fourth sidewalls having a T-shape. 4. The device of claim 3, wherein the first surface includes: a first region extending from the first sidewall to the second sidewall; anda second region extending from the third sidewall to the fourth sidewall, the second region being transverse to the first region, the second region overlaps the first region. 5. The device of claim 1, wherein the first portion extends from a first one of the plurality of second portions to a second one of the plurality of second portions. 6. The device of claim 1, further comprising a plurality of fourth surfaces transverse to the first surface and the plurality of second surfaces, the plurality of fourth surfaces extending from the first surface to the plurality of second surfaces, the plurality of fourth surfaces delimiting the second surfaces. 7. The device of claim 1, wherein a plurality of contact pads are on the third surface of the die and a plurality of solder balls are coupled to the plurality of contact pads. 8. A device, comprising: a die including: a plurality of first portions, each one of the plurality of first portions includes a first surface;a second portion including: a second surface opposite to the first surfaces of the plurality of first portions, the second surface faces away from the first surfaces of the plurality of first portions; anda third surface opposite to the second surface, the third surface faces away from the second surface, the third surface extends around the plurality of first portions and is between adjacent pairs of the plurality of first portions, the third surface is between the first surfaces of the plurality of first portions and the second surface. 9. The device of claim 8, wherein a plurality of contact pads are on the second surface of the die and a plurality of solder balls are coupled to the plurality of contact pads. 10. The device of claim 8, wherein the plurality of first portions are protrusions, and each one of the plurality of protrusions extend from the third surface to a corresponding first surface of the first surfaces. 11. The device of claim 8, wherein the plurality of first portions are arranged in an array. 12. The device of claim 11, wherein the plurality of first portions are equally spaced apart from each other. 13. The device of claim 8, wherein the die further includes a plurality of sidewalls that extend from the second surface to the third surface and are transverse to the second and third surfaces. 14. The device of claim 13, wherein the plurality of first portions are spaced inward from the plurality of sidewalls. 15. The device of claim 8, wherein the plurality of first portions are positioned at non-critical areas with respect to thermal contraction and expansion and the second portion is positioned at critical areas with respect to thermal contraction and expansion. 16. The device of claim 8, wherein the first surfaces of the plurality of first portions are rectangular. 17. The device of claim 8, wherein the second surface is rectangular. 18. A device, comprising: a die including: a first surface;a plurality of corners;a plurality of corner portions, each respective corner portion of the plurality of corner portions is at a corresponding corner of the plurality of corner portions, each respective corner portion of the plurality of corner portions includes a second surface opposite to the first surface; anda plus shaped portion extending from the first portion and separating each respective corner portion of the plurality of corner portions from each other, the plus shaped portion including a third surface facing away from the first surface. 19. The device of claim 18, wherein: each respective corner portion of the plurality of corner portions have a first thickness that extends from the first surface to a corresponding second surface of the second surfaces of the plurality of corner portions; andthe plus shape portion has a second thickness that extends from the first surface to the third surface, the second thickness being greater than the first thickness. 20. The device of claim 18, wherein: a first corner portion of the plurality of corner portions has a first thickness that extends from a corresponding second surface of the first corner portion to the first surface;a second corner portion of the plurality of corner portions has a second thickness that extend from a corresponding second surface of the second corner portion to the first surface, the second thickness being different than the first thickness; andthe plus shape portion has a third thickness that extends from the first surface to the third surface, the third thickness being greater than the first thickness and greater than the second thickness.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.