초록 ▼

The cross-sectional profile which is produced upon development of a layer of alkali soluble resin-diazo ketone photoresist is modified by treating the layer with a solvent or solvent mixture which is different from but miscible with the solvent or solvent mixture used to form the resist layer. The t

The cross-sectional profile which is produced upon development of a layer of alkali soluble resin-diazo ketone photoresist is modified by treating the layer with a solvent or solvent mixture which is different from but miscible with the solvent or solvent mixture used to form the resist layer. The treating solvent is believed to dilute the resist solvent in a surface layer portion of the resist thereby modifying the alkaline developer solubility of this portion. Undercut resist profiles may be obtained by this method with normal optical exposure of the resist.

대표청구항 ▼

A method of producing a positive resist image having a sidewall profile with reduced overcut, which consists essentially of the following steps in sequence: depositing on a substrate surface a layer comprising a mixture of an alkali soluble resin, a light sensitive sensitizer having diazo and keto g

A method of producing a positive resist image having a sidewall profile with reduced overcut, which consists essentially of the following steps in sequence: depositing on a substrate surface a layer comprising a mixture of an alkali soluble resin, a light sensitive sensitizer having diazo and keto groups at adjacent positions on an aromatic ring and a first solvent; baking the layer at an elevated temperature to remove most of the solvent in the layer; imagewise exposing the layer to actinic light to alter the solubility characteristics of the exposed portion of the layer; treating the layer with a second solvent which is incapable of completely dissolving the layer and which is different from but miscible with the solvent still remaining in the layer so as to reduce the alkali solubility of only a surface region of the layer; and treating the layer with an alkali developer solution until the exposed portion of the layer has been completely dissolved away, the reduced alkali solubility of the surface region of the layer reducing the overcut of the developed sidewall profile. A method of producing a positive resist image having a sidewall profile with reduced overcut, which consists essentially of the following steps in sequence: depositing on a substrate surface a layer comprising a mixture of an alkali soluble resin, a light sensitive sensitizer having diazo and keto groups at adjacent positions on an aromatic ring and a first solvent; at least partly drying the layer in air to remove some of the first solvent; treating the layer with a second solvent which is incapable of completely dissolving the layer and which is different from but miscible with the solvent still remaining in the layer so as to reduce the alkali solubility of only a surface region of the layer; baking the layer at an elevated temperature to remove most of the solvents in the layer; imagewise exposing the layer to actinic light to alter the solubility characteristics of the exposed portion of the layer; and treating the layer with an alkali developer solution until the exposed portion of the layer has been completely dissolved away, the reduced alkali solubility of the surface region of the layer reducing the overcut of the developed sidewall profile. A method of producing a positive resist image having a sidewall profile with reduced overcut, which consists essentially of the following steps in sequence: depositing on a substrate surface a layer comprising a mixture of an alkali soluble resin, a light sensitive sensitizer having diazo and keto groups at adjacent positions on an aromatic ring and a first solvent; baking the layer at an elevated temperature to remove most of the solvent in the layer; treating the layer with a second solvent which is incapable of completely dissolving the layer and which is different from but miscible with the solvent still remaining in the layer so as to reduce the alkali solubility of only a surface region of the layer; imagewise exposing the layer to actinic light to alter the solubility characteristics of the exposed portion of the layer; and treating the layer with an alkali developer solution until the exposed portion of the layer has been completely dissolved away, the reduced alkali solubility of the surface region of the layer reducing the overcut of the developed sidewall profile.