초록 ▼

Solder reflow or solder chip joining can be accomplished in a fluxless system by conducting the solder reflow or chip joining procedure in a carrier gas which comprises from about 0.1 to about 10% by volume SiH4, based on the volume of carrier gas and SiH4. A preferred carrier gas for the reflow is

Solder reflow or solder chip joining can be accomplished in a fluxless system by conducting the solder reflow or chip joining procedure in a carrier gas which comprises from about 0.1 to about 10% by volume SiH4, based on the volume of carrier gas and SiH4. A preferred carrier gas for the reflow is hydrogen and a preferred carrier gas for the chip joining is nitrogen.

대표청구항 ▼

In a process for joining a semiconductor chip to a substrate by soldering in a carrier gas, the improvement which comprises: performing the soldering step in the presence of SiH4, thereby reducing any oxide on the solder, resulting in the formation of H2O and SiO2 which exit with the carrier gas and

In a process for joining a semiconductor chip to a substrate by soldering in a carrier gas, the improvement which comprises: performing the soldering step in the presence of SiH4, thereby reducing any oxide on the solder, resulting in the formation of H2O and SiO2 which exit with the carrier gas and SiH4.