$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

LDD CMOS process 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/265
출원번호 US-0071002 (1987-07-09)
발명자 / 주소
  • Parrillo Louis C. (Austin TX) Poon Stephen S. (Austin TX)
출원인 / 주소
  • Motorola, Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 182  인용 특허 : 0

초록

A process is disclosed for fabricating LDD CMOS structures having a reduced mask count and improved manufacturability. In one embodiment of the invention a CMOS structure is formed having gate insulators overlying N and P type surface regions. Gate electrodes are formed on each of the surface region

대표청구항

A process for fabricating a CMOS device comprising the sequential steps of: providing a silicon substrate including surface regions of first and second conductivity type; forming an insulator overlying said surface regions; forming first and second gate electrodes insulatively spaced from said surfa

이 특허를 인용한 특허 (182)

  1. Nemani, Srinivas D.; Koshizawa, Takehito, Air gap process.
  2. Purayath, Vinod R.; Ingle, Nitin K., Air gaps between copper lines.
  3. Kang, Sean; Ko, Jungmin; Luere, Oliver, Airgap formation with damage-free copper.
  4. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Aluminum oxide selective etch.
  5. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Aluminum selective etch.
  6. Xue, Jun; Hsu, Ching-Mei; Li, Zihui; Godet, Ludovic; Wang, Anchuan; Ingle, Nitin K., Anisotropic gap etch.
  7. Benjaminson, David; Lubomirsky, Dmitry; Math, Ananda Seelavanth; Natarajan, Saravanakumar; Chourey, Shubham, Bolted wafer chuck thermal management systems and methods for wafer processing systems.
  8. Benjaminson, David; Lubomirsky, Dmitry; Math, Ananda Seelavanth; Natarajan, Saravanakumar; Chourey, Shubham, Bolted wafer chuck thermal management systems and methods for wafer processing systems.
  9. Fulford ; Jr. H. Jim ; Gardner Mark I. ; Wristers Derick J., CMOS integrated circuit and method for implanting NMOS transistor areas prior to implanting PMOS transistor areas to optimize the thermal diffusivity thereof.
  10. Dennison Charles H. ; Helm Mark, CMOS integrated circuitry with Halo and LDD regions.
  11. Pfiester James R. (Austin TX), CMOS process using doped glass layer.
  12. Lubomirsky, Dmitry, Chamber with flow-through source.
  13. Lubomirsky, Dmitry, Chamber with flow-through source.
  14. Liang, Qiwei; Chen, Xinglong; Chuc, Kien; Lubomirsky, Dmitry; Park, Soonam; Yang, Jang-Gyoo; Venkataraman, Shankar; Tran, Toan; Hinckley, Kimberly; Garg, Saurabh, Chemical control features in wafer process equipment.
  15. Liang, Qiwei; Chen, Xinglong; Chuc, Kien; Lubomirsky, Dmitry; Park, Soonam; Yang, Jang-Gyoo; Venkataraman, Shankar; Tran, Toan; Hinckley, Kimberly; Garg, Saurabh, Chemical control features in wafer process equipment.
  16. Wang, Xikun; Pandit, Mandar; Cui, Zhenjiang; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K.; Liu, Jie, Chlorine-based hardmask removal.
  17. Wang, Xikun; Cui, Zhenjiang; Park, Soonam; Ingle, Nitin K., Cobalt-containing material removal.
  18. Lubomirsky, Dmitry; Kim, Sung Je, Conditioned semiconductor system parts.
  19. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Conformal oxide dry etch.
  20. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Conformal oxide dry etch.
  21. Hoinkis, Mark; Yan, Chun; Miyazoe, Hiroyuki; Joseph, Eric, Copper residue chamber clean.
  22. Chapman Richard A. (Dallas TX), Counter-doped transistor.
  23. Zhu, Lina; Kang, Sean S.; Nemani, Srinivas D.; Kao, Chia-Ling, Delicate dry clean.
  24. Park, Seung H.; Wang, Yunyu; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Differential silicon oxide etch.
  25. Park, Seung H.; Wang, Yunyu; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Differential silicon oxide etch.
  26. Purayath, Vinod R.; Wang, Anchuan; Ingle, Nitin K., Dopant etch selectivity control.
  27. Tran, Luan C.; McQueen, Mark; Kerr, Robert, Double LDD devices for improved DRAM refresh.
  28. Tran, Luan C.; McQueen, Mark; Kerr, Robert, Double LDD devices for improved DRAM refresh.
  29. Luan C. Tran ; Mark McQueen ; Robert Kerr, Double LDD devices for improved dram refresh.
  30. Liou Tian-I (San Jose CA) Teng Chih-Sieh (San Jose CA), Double-diffused drain CMOS process using a counterdoping technique.
  31. Zhang, Jingchun; Ingle, Nitin K.; Wang, Anchuan, Dry etch process.
  32. Kim, Sang Hyuk; Yang, Dongqing; Lee, Young S.; Jung, Weon Young; Kim, Sang-jin; Hsu, Ching-Mei; Wang, Anchuan; Ingle, Nitin K., Dry-etch for selective oxidation removal.
  33. Wang, Xikun; Hsu, Ching-Mei; Ingle, Nitin K.; Li, Zihui; Wang, Anchuan, Dry-etch for selective tungsten removal.
  34. Wang, Xikun; Hsu, Ching-Mei; Ingle, Nitin K.; Li, Zihui; Wang, Anchuan, Dry-etch for selective tungsten removal.
  35. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Wang, Yunyu; Lee, Young, Dry-etch for silicon-and-carbon-containing films.
  36. Ren, He; Yang, Jang-Gyoo; Baek, Jonghoon; Wang, Anchuan; Park, Soonam; Garg, Saurabh; Chen, Xinglong; Ingle, Nitin K., Dry-etch selectivity.
  37. Ren, He; Yang, Jang-Gyoo; Baek, Jonghoon; Wang, Anchuan; Park, Soonam; Garg, Saurabh; Chen, Xinglong; Ingle, Nitin K., Dry-etch selectivity.
  38. Cho, Tae Seung; Sen, Yi-Heng; Park, Soonam; Lubomirsky, Dmitry, Dual discharge modes operation for remote plasma.
  39. Ingle, Nitin K.; Lubomirsky, Dmitry; Chen, Xinglong; Venkataraman, Shankar, Enhanced etching processes using remote plasma sources.
  40. Korolik, Mikhail; Ingle, Nitin K.; Zhang, Jingchun; Wang, Anchuan; Liu, Jie, Etch suppression with germanium.
  41. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K., Even tungsten etch for high aspect ratio trenches.
  42. Bergonzoni Carlo (Arcore ITX), Fabrication of CMOS integrated devices with reduced gate length and lightly doped drain.
  43. Purayath, Vinod R.; Ingle, Nitin K., Flash gate air gap.
  44. Pandit, Mandar; Wang, Xikun; Cui, Zhenjiang; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Fluorine-based hardmask removal.
  45. Park, Seung; Wang, Xikun; Liu, Jie; Wang, Anchuan; Kim, Sang-jin, Gas-phase tungsten etch.
  46. Kim, Sung Je; Kalita, Laksheswar; Pareek, Yogita; Kadam, Ankur; Goradia, Prerna Sonthalia; Thakur, Bipin; Lubomirsky, Dmitry, Generation of compact alumina passivation layers on aluminum plasma equipment components.
  47. Korolik, Mikhail; Ingle, Nitin; Kioussis, Dimitri, Germanium etching systems and methods.
  48. Cho, Tae; Kang, Sang Won; Yang, Dongqing; Lu, Raymond W.; Hillman, Peter; Celeste, Nicholas; Tan, Tien Fak; Park, Soonam; Lubomirsky, Dmitry, Grooved insulator to reduce leakage current.
  49. Monkowski Michael ; Ogura Seiki ; Rovedo Nivo ; Shepard Joseph Francis, High performance/high density BICMOS process.
  50. Tran, Toan Q.; Malik, Sultan; Lubomirsky, Dmitry; Roy, Shambhu N.; Kobayashi, Satoru; Cho, Tae Seung; Park, Soonam; Venkataraman, Shankar, High temperature chuck for plasma processing systems.
  51. Chen, Zhijun; Li, Zihui; Ingle, Nitin K.; Wang, Anchuan; Venkataraman, Shankar, Highly selective doped oxide removal method.
  52. Chen, Xinglong; Lubomirsky, Dmitry; Venkataraman, Shankar, Insulated semiconductor faceplate designs.
  53. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated bit-line airgap formation and gate stack post clean.
  54. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated bit-line airgap formation and gate stack post clean.
  55. Dennison Charles H. ; Helm Mark, Integrated circuitry comprising halo regions and LDD regions.
  56. Purayath, Vinod R.; Thakur, Randhir; Ingle, Nitin K., Integrated oxide and nitride recess for better channel contact in 3D architectures.
  57. Purayath, Vinod R.; Thakur, Randhir; Venkataraman, Shankar; Ingle, Nitin K., Integrated oxide recess and floating gate fin trimming.
  58. Sapre, Kedar; Ingle, Nitin; Tang, Jing, Intrench profile.
  59. Sapre, Kedar; Ingle, Nitin; Tang, Jing, Intrench profile.
  60. Nguyen, Son T.; Lubomirsky, Dmitry, Layered thin film heater and method of fabrication.
  61. Hsu, Ching-Mei; Ingle, Nitin K.; Hamana, Hiroshi; Wang, Anchuan, Low temperature gas-phase carbon removal.
  62. Hongyong Zhang JP; Hideto Ohnuma JP; Yasuhiko Takemura JP, Manufacturing method of semiconductor integrated circuit.
  63. Purayath, Vinod R.; Thakur, Randhir; Ingle, Nitin K., Metal air gap.
  64. Shikata Shin-ichi (Yokohama JPX), Method for manufacturing a field effect transistor using spacers of different thicknesses.
  65. Hamatake Nobuhisa (Tokyo JPX), Method for manufacturing field effect transistor having LDD structure.
  66. Kimizuka, Naohiko; Matsumoto, Takuji, Method for manufacturing solid-state imaging device.
  67. Kimizuka, Naohiko; Matsumoto, Takuji, Method for manufacturing solid-state imaging device.
  68. Kobayashi Migaku (Tokyo JPX), Method of fabricating a semiconductor device.
  69. Watabe Kiyoto,JPX ; Kamoto Satoru,JPX, Method of fabrication LDD semiconductor device with amorphous regions.
  70. Ko, Jungmin, Method of fin patterning.
  71. Charles H. Dennison ; Mark Helm, Method of forming CMOS integrated circuitry.
  72. Dennison Charles H. (Meridian ID) Helm Mark (Boise ID), Method of forming CMOS integrated circuitry.
  73. Dennison Charles H. ; Helm Mark, Method of forming CMOS integrated circuitry.
  74. Dennison Charles H. ; Helm Mark, Method of forming CMOS integrated circuitry.
  75. Dennison Charles H. ; Helm Mark, Method of forming CMOS integrated circuitry.
  76. Dennison Charles H. ; Helm Mark, Method of forming CMOS integrated circuitry having halo regions.
  77. Shen Lewis (Cupertino CA) Hadjizadeh-Amini Zahra (Cupertino CA) Wang Hsingya A. (San Jose CA) Hsu James J. (Saratoga CA), Method of forming and removing polysilicon lightly doped drain spacers.
  78. Wollesen Donald L. (Saratoga CA), Method of making a high performance MOS device having both P- and N-LDD regions using single photoresist mask.
  79. Yoshikawa Kuniyoshi (Tokyo JPX), Method of manufacturing a semiconductor device.
  80. Zhang Hongyong,JPX ; Ohnuma Hideto,JPX ; Takemura Yasuhiko,JPX, Method of manufacturing a thin film transistor using anodic oxidation.
  81. Kim, Sung-Hwan; Satoru, Yamada, Method of manufacturing semiconductor device.
  82. Yamane, Hiroyuki; Higuchi, Yasushi, Method of producing a complementary-type semiconductor device.
  83. Li, Zihui; Kao, Chia-Ling; Wang, Anchuan; Ingle, Nitin K., Methods for anisotropic control of selective silicon removal.
  84. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of SiN films.
  85. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of metal and metal-oxide films.
  86. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Methods for etch of metal and metal-oxide films.
  87. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin, Methods for etch of sin films.
  88. Kim Hyun-sik,KRX ; Shin Heon-jong,KRX, Methods of fabricating field effect transistors by first forming heavily doped source/drain regions and then forming lightly doped source/drain regions.
  89. Hong, Sukwon; Hamana, Hiroshi; Liang, Jingmei, Methods of reducing substrate dislocation during gapfill processing.
  90. Chen, Zhijun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Non-local plasma oxide etch.
  91. Chen, Zhijun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Non-local plasma oxide etch.
  92. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K.; Anthis, Jeffrey W.; Schmiege, Benjamin, Oxide and metal removal.
  93. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Oxide etch selectivity enhancement.
  94. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Oxide etch selectivity enhancement.
  95. Xu, Lin; Chen, Zhijun; Wang, Anchuan; Nguyen, Son T., Oxide etch selectivity systems and methods.
  96. Lubomirsky, Dmitry, Oxygen compatible plasma source.
  97. Chen, Xinglong; Yang, Jang-Gyoo; Tam, Alexander; Tam, Elisha, Pedestal with multi-zone temperature control and multiple purge capabilities.
  98. Altmann, Michael W., Physically defined varactor in a CMOS process.
  99. Altmann, Michael W., Physically defined varactor in a CMOS process.
  100. Altmann, Michael W., Physically defined varactor in a CMOS process.
  101. Lubomirsky, Dmitry, Plasma processing system with direct outlet toroidal plasma source.
  102. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Plasma-free metal etch.
  103. Cho, Tae Seung; Sen, Yi-Heng; Park, Soonam; Lubomirsky, Dmitry, Polarity control for remote plasma.
  104. Choi, Tom; Ko, Jungmin; Kang, Sean, Poly directional etch by oxidation.
  105. Zhang, Jingchun; Zhang, Hanshen, Procedure for etch rate consistency.
  106. Zhang, Jingchun; Zhang, Hanshen, Procedure for etch rate consistency.
  107. Hsu Chen-Chung (Taichung TWX), Process for fabricating a semiconductor electrostatic discharge (ESD) protective device.
  108. Kinzer Daniel M. (El Segundo CA), Process for manufacture of P channel MOS-gated device.
  109. Gardner Mark I. ; Fulford ; Jr. H. Jim, Process of fabricating transistors having source and drain regions laterally displaced from the transistors gate.
  110. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  111. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  112. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  113. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  114. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  115. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  116. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  117. Wang, Anchuan; Chen, Xinglong; Li, Zihui; Hamana, Hiroshi; Chen, Zhijun; Hsu, Ching-Mei; Huang, Jiayin; Ingle, Nitin K.; Lubomirsky, Dmitry; Venkataraman, Shankar; Thakur, Randhir, Processing systems and methods for halide scavenging.
  118. Naik, Mehul; Ma, Paul F.; Nemani, Srinivas D., Protective via cap for improved interconnect performance.
  119. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry, Radial waveguide systems and methods for post-match control of microwaves.
  120. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.
  121. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.
  122. Kobayashi, Satoru; Park, Soonam; Lubomirsky, Dmitry; Sugai, Hideo, Radial waveguide systems and methods for post-match control of microwaves.
  123. Chen, Zhijun; Zhang, Jingchun; Hsu, Ching-Mei; Park, Seung; Wang, Anchuan; Ingle, Nitin K., Radical-component oxide etch.
  124. Chen, Zhijun; Zhang, Jingchun; Hsu, Ching-Mei; Park, Seung; Wang, Anchuan; Ingle, Nitin K., Radical-component oxide etch.
  125. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Remotely-excited fluorine and water vapor etch.
  126. Xu, Lin; Chen, Zhijun; Huang, Jiayin; Wang, Anchuan, Removal methods for high aspect ratio structures.
  127. Xu, Lin; Chen, Zhijun; Huang, Jiayin; Wang, Anchuan, Removal methods for high aspect ratio structures.
  128. Pfiester James R. (Austin TX), Salicided source/drain structure.
  129. Yang, Dongqing; Zhu, Lala; Wang, Fei; Ingle, Nitin K., Saving ion-damaged spacers.
  130. Chen, Zhijun; Huang, Jiayin; Wang, Anchuan; Ingle, Nitin, Selective SiN lateral recess.
  131. Wang, Xikun; Lei, Jianxin; Ingle, Nitin; Shaviv, Roey, Selective cobalt removal for bottom up gapfill.
  132. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Selective etch for metal-containing materials.
  133. Ingle, Nitin K.; Kachian, Jessica Sevanne; Xu, Lin; Park, Soonam; Wang, Xikun; Anthis, Jeffrey W., Selective etch for metal-containing materials.
  134. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Selective etch for silicon films.
  135. Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Selective etch for silicon films.
  136. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective etch of silicon by way of metastable hydrogen termination.
  137. Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective etch of silicon by way of metastable hydrogen termination.
  138. Chen, Zhijun; Li, Zihui; Wang, Anchuan; Ingle, Nitin K.; Venkataraman, Shankar, Selective etch of silicon nitride.
  139. Chen, Zhijun; Li, Zihui; Wang, Anchuan; Ingle, Nitin K.; Venkataraman, Shankar, Selective etch of silicon nitride.
  140. Citla, Bhargav; Ying, Chentsau; Nemani, Srinivas; Babayan, Viachslav; Stowell, Michael, Selective etch using material modification and RF pulsing.
  141. Wang, Xikun; Ingle, Nitin, Selective in situ cobalt residue removal.
  142. Hoinkis, Mark; Miyazoe, Hiroyuki; Joseph, Eric, Selective sputtering for pattern transfer.
  143. Wang, Yunyu; Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective suppression of dry-etch rate of materials containing both silicon and nitrogen.
  144. Wang, Yunyu; Wang, Anchuan; Zhang, Jingchun; Ingle, Nitin K.; Lee, Young S., Selective suppression of dry-etch rate of materials containing both silicon and oxygen.
  145. Liu, Jie; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Park, Seung; Chen, Zhijun; Hsu, Ching-Mei, Selective titanium nitride etching.
  146. Liu, Jie; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K.; Park, Seung; Chen, Zhijun; Hsu, Ching-Mei, Selective titanium nitride etching.
  147. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K.; Lubomirsky, Dmitry, Selective titanium nitride removal.
  148. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K.; Lubomirsky, Dmitry, Selective titanium nitride removal.
  149. Wang, Xikun; Ingle, Nitin, Selective tungsten removal.
  150. Pandit, Mandar B.; Wang, Anchuan; Ingle, Nitin K., Self-aligned process.
  151. Wu Shye-Lin,TWX, Self-aligned silicided MOS devices with an extended S/D junction and an ESD protection circuit.
  152. Arnepalli, Ranga Rao; Goradia, Prerna Sonthalia; Visser, Robert Jan; Ingle, Nitin; Korolik, Mikhail; Biswas, Jayeeta; Lodha, Saurabh, Self-limiting atomic thermal etching systems and methods.
  153. Suga Shigeru,JPX, Semiconductor IC with FET and capacitor having side wall spacers.
  154. Suga Shigeru (Hamamatsu JPX), Semiconductor IC with FET and capacitor having side wall spacers and manufacturing method thereof.
  155. Fujiwara Nobuo,JPX ; Maruyama Takahiro,JPX ; Sakamori Shigenori,JPX ; Teratani Akemi,JPX ; Ogino Satoshi,JPX ; Ohmi Kazuyuki,JPX ; Irie Yuzo,JPX, Semiconductor device and manufacturing method thereof.
  156. Kamiya Takayuki,JPX, Semiconductor device handling multi-level voltages.
  157. Kuroda Hideaki,JPX, Semiconductor device having various threshold voltages and manufacturing same.
  158. Kuroda Hideaki,JPX, Semiconductor device having various threshold voltages and manufacturing same.
  159. Lubomirsky, Dmitry; Chen, Xinglong; Venkataraman, Shankar, Semiconductor processing systems having multiple plasma configurations.
  160. Yang, Jang-Gyoo; Chen, Xinglong; Park, Soonam; Baek, Jonghoon; Garg, Saurabh; Venkataraman, Shankar, Semiconductor processing with DC assisted RF power for improved control.
  161. Yang, Jang-Gyoo; Chen, Xinglong; Park, Soonam; Baek, Jonghoon; Garg, Saurabh; Venkataraman, Shankar, Semiconductor processing with DC assisted RF power for improved control.
  162. Nguyen, Andrew; Ramaswamy, Kartik; Nemani, Srinivas; Howard, Bradley; Vishwanath, Yogananda Sarode, Semiconductor system assemblies and methods of operation.
  163. Huston, Joel M., Showerhead assembly.
  164. Ko, Jungmin; Choi, Tom; Ingle, Nitin; Kim, Kwang-Soo; Wou, Theodore, SiN spacer profile patterning.
  165. Park, Seung; Wang, Anchuan, Silicon etch process with tunable selectivity to SiO2 and other materials.
  166. Korolik, Mikhail; Ingle, Nitin K.; Wang, Anchuan; Xu, Jingjing, Silicon germanium processing.
  167. Chen, Zhijun; Wang, Anchuan; Ingle, Nitin K., Silicon oxide selective removal.
  168. Huang, Jiayin; Chen, Zhijun; Wang, Anchuan; Ingle, Nitin, Silicon pretreatment for nitride removal.
  169. Li, Zihui; Hsu, Ching-Mei; Zhang, Hanshen; Zhang, Jingchun, Silicon selective removal.
  170. Chen, Zhijun; Zhang, Jingchun; Wang, Anchuan; Ingle, Nitin K., Silicon-carbon-nitride selective etch.
  171. Kim, Hun Sang; Choi, Jinhan; Koseki, Shinichi, Simplified litho-etch-litho-etch process.
  172. Luere, Olivier; Kang, Sean S.; Nemani, Srinivas D., Spacer formation.
  173. Lowrey Tyler A. (Boise ID) Chance Randal W. (Boise ID) Parkinson Ward D. (Boise ID), Split-polysilicon CMOS process incorporating unmasked punchthrough and source/drain implants.
  174. Draper Donald A., System for enhancing the performance of a circuit by reducing the channel length of one or more transistors.
  175. Draper Donald A., System for enhancing the performance of a circuit by reducing the channel length of one or more transistors.
  176. Benjaminson, David; Lubomirsky, Dmitry, Thermal management systems and methods for wafer processing systems.
  177. Wang, Xikun; Pandit, Mandar; Wang, Anchuan; Ingle, Nitin K., Titanium nitride removal.
  178. Wang, Xikun; Xu, Lin; Wang, Anchuan; Ingle, Nitin K., Titanium oxide etch.
  179. Liu, Jie; Wang, Xikun; Park, Seung; Korolik, Mikhail; Wang, Anchuan; Ingle, Nitin K., Tungsten oxide processing.
  180. Wang, Xikun; Liu, Jie; Wang, Anchuan; Ingle, Nitin K., Tungsten separation.
  181. Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., V trench dry etch.
  182. Liu, Jie; Purayath, Vinod R.; Wang, Xikun; Wang, Anchuan; Ingle, Nitin K., Vertical gate separation.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로