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Die attach pickup tools 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-013/04
출원번호 US-0158729 (1988-02-22)
발명자 / 주소
  • Sakiadis Byron C. (Chadds Ford PA)
출원인 / 주소
  • E. I. Du Pont de Nemours and Company (Wilmington DE 02)
인용정보 피인용 횟수 : 24  인용 특허 : 19

초록

Die attach pickup tools for relocating a flexible die attach. The pickup tools comprise a head portion connected to an end portion. The head portions have a face for contacting a die attach and at least one hole in the face. Passage means extend from the hole(s) through the tool for connection to a

대표청구항

A die attach pickup tool for picking up a flexible ribbon shaped die attach having a thickness in a range of about 25 to 125 micrometers, an elastic modulus in the range of about 500 to 7,500 N/mm2 at 23°C. and a first surface area from a first station, transferring the die attach to a heated bond s

이 특허에 인용된 특허 (19)

  1. Carrell Ross M. (Cinnaminson NJ), Adjustable vacuum pad.
  2. Taki Yasuo (Hirakata JPX) Araki Shigeru (Katano JPX) Mori Kazuhiro (Katano JPX) Misawa Yoshihiko (Katano JPX) Tanaka Souhei (Hirakata JPX), Apparatus for carrying and placing components.
  3. Harigane Kotaro (Tokyo JPX) Takahashi Kenichi (Tokyo JPX) Shudo Hirokazu (Tokyo JPX) Tando Shuichi (Tokyo JPX), Apparatus for mounting chip type circuit elements on printed circuit boards.
  4. Tamai, Kouichi; Tanaka, Masao, Apparatus for mounting electronic components.
  5. Koltuniak Thomas A. (Huntington Beach CA) Lawrence William A. (Palos Verdes Estates CA), Circuit board and component manipulation device.
  6. Polansky Carl (Landisville PA), Collet for die bonding.
  7. Van Hooreweder Godwin J. O. G. (Brugge BEX), Device for mounting chip-type electronic components on a substrate.
  8. Gumbert Hans (Sinn DEX) Eufinger Norbert (Limburg DEX), Device for transferring leadless components to a given mounting position on a circuit board.
  9. Harada Yoshio (Akita JPX), Electronic component mounting system having a vacuum suction head with a magnetic sensor for locating an electronic comp.
  10. Tarbuck Robert R. (Ardmore PA), Lockable compliant end effector apparatus.
  11. Mang Paul (Schmitten DEX) Joppe Werner (Neu-Anspach DEX) Schuch Jrn (Oberursel DEX), Mechanically operable suction device for lifting and holding objects.
  12. McIver, Chandler H., Method of mounting an I.C. chip on a substrate.
  13. Kubota Shigeru (Tokyo JPX) Kanou Shoji (Yokohama JPX) Kubo Masahiro (Machida JPX), Method of mounting electronic parts on the predetermined positions of a printed circuit board.
  14. Buchmann Albert H. (Richmond KY) Cochran Thomas J. (LaGrangeville NY) Ficker Walter W. (Fishkill NY) Stricker Alfred A. (Pompano Beach FL) von Kaenel Walter (Pompano Beach FL), Pick up and placement head for green sheet and spacer.
  15. Neff Dieter Klaus (Cambridge VT), Pick up assembly for fragile devices.
  16. Vancelette Stanley R. (Manchester NH), Placement mechanism.
  17. Avedissian Michael K. (Mohnton PA) Hertzog Earl D. (Reading PA), Registering articles to sites with recessed ultrasonic bonding tool head.
  18. Clarke William F. (Sykesville MD) Handlesman Mark W. (Upper Darby PA), Robotic end effector.
  19. Schwartz Vladimir (Lexington MA) Freytsis Avrum (Swampscott MA), Vacuum pick for semiconductor wafers.

이 특허를 인용한 특허 (24)

  1. Hung, Kin Yik; Leung, Pak Kin; Tang, Cheuk Wah; Hung, Chi Ping; Widdowson, Gary Peter, Bond head for thermal compression die bonding.
  2. Pan, Xiangsheng; Widdowson, Gary Peter, Collet mounting assembly for a die bonder.
  3. Jin Ho Tae,KRX ; Choi Hee Kook,KRX, Die collet for a semiconductor chip and apparatus for bonding semiconductor chip to a lead frame.
  4. Izumi Yasuo (Ikoma JPX) Ishimoto Kazumi (Katano JPX) Makino Yutaka (Kobe JPX), Electric component mounting method.
  5. Wendt, Michael; Gutentag, Charles, Hybrid nozzle for pick and place assembly of very small form factor components.
  6. Kiyokawa Toshiyuki,JPX, Integrated circuit transporting apparatus including a guide with an integrated circuit positioning function.
  7. Kotato Akio,JPX ; Miyamae Yuusuke,JPX ; Satou Tadaji,JPX ; Saitou Makoto,JPX ; Kikuchi Tooru,JPX ; Kageyama Akira,JPX ; Takeda Shinji,JPX ; Masuko Takashi,JPX ; Yusa Masami,JPX ; Miyadera Yasuo,JPX ;, Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device.
  8. Takeda, Shinji; Masuko, Takashi; Yusa, Masami; Miyadera, Yasuo; Yamasaki, Mituo; Maekawa, Iwao; Kotato, Akio; Miyamae, Yuusuke; Satou, Tadaji; Saitou, Makoto; Kikuchi, Tooru; Kageyama, Akira; Kaneda,, Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device.
  9. Narikiyo Kazuhiko,JPX ; Sato Shoichiro,JPX ; Kashiwazaki Takao,JPX ; Ikenoue Noboru,JPX, Manufacturing method for an electronic part absorbing nozzle.
  10. Leu, Felix, Method and apparatus for mounting semiconductor chips.
  11. Schneegans, Manfred; Guth, Karsten; Galesic, Ivan, Method for production of a semiconductor component.
  12. Naundorf, Jörg; Weidner, Karl; Wulkesch, Hans, Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device.
  13. Narikiyo Kazuhiko,JPX ; Sato Shoichiro,JPX ; Kashiwazaki Takao,JPX ; Ikenoue Noboru,JPX, Nozzle block of electronic part suction holding nozzle.
  14. Wang, Ya Ping; Yang, Jian Ming; Shen, Guo Qiang; Chin, Chee Keong, Pick-up heads and systems for die bonding and related applications.
  15. Takeda, Shinji; Masuko, Takashi; Yusa, Masami; Kikuchi, Tooru; Miyadera, Yasuo; Maekawa, Iwao; Yamasaki, Mitsuo; Kageyama, Akira; Kaneda, Aizou, Semiconductor device and process for fabrication thereof.
  16. Takeda, Shinji; Masuko, Takashi; Yusa, Masami; Kikuchi, Tooru; Miyadera, Yasuo; Maekawa, Iwao; Yamasaki, Mitsuo; Kageyama, Akira; Kaneda, Aizou, Semiconductor device and process for fabrication thereof.
  17. Takeda, Shinji; Masuko, Takashi; Yusa, Masami; Kikuchi, Tooru; Miyadera, Yasuo; Maekawa, Iwao; Yamasaki, Mitsuo; Kageyama, Akira; Kaneda, Aizou, Semiconductor device and process for fabrication thereof.
  18. Takeda,Shinji; Masuko,Takashi; Yusa,Masami; Kikuchi,Tooru; Miyadera,Yasuo; Maekawa,Iwao; Yamasaki,Mitsuo; Kageyama,Akira; Kaneda,Aizou, Semiconductor device and process for fabrication thereof.
  19. Takeda,Shinji; Masuko,Takashi; Yusa,Masami; Kikuchi,Tooru; Miyadera,Yasuo; Maekawa,Iwao; Yamasaki,Mitsuo; Kageyama,Akira; Kaneda,Aizou, Semiconductor device and process for fabrication thereof.
  20. Takeda,Shinji; Masuko,Takashi; Yusa,Masami; Kikuchi,Tooru; Miyadera,Yasuo; Maekawa,Iwao; Yamasaki,Mitsuo; Kageyama,Akira; Kaneda,Aizou, Semiconductor device and process for fabrication thereof.
  21. Takeda,Shinji; Masuko,Takashi; Yusa,Masami; Kikuchi,Tooru; Miyadera,Yasuo; Maekawa,Iwao; Yamasaki,Mitsuo; Kageyama,Akira; Kaneda,Aizou, Semiconductor device and process for fabrication thereof.
  22. Ho Tae Jin KR; Hee Kook Choi KR, Semiconductor die pickup method that prevents electrostatic discharge.
  23. Poli Bernard (Saint Etienne FRX) Chincholle Grard (Saint Etienne FRX), Tip for a vacuum pipette.
  24. Chandler Johnny C. ; Conley Douglas J., Vacuum connector apparatus for retreading tires.
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