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Fluxless soldering process 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-001/20
  • B23K-035/38
출원번호 US-0324247 (1989-03-15)
발명자 / 주소
  • Dishon Giora (Jerusalem NC ILX) Bobbio Stephen M. (Wake Forest NC)
출원인 / 주소
  • Microelectronics Center of North Carolina (Research Triangle Park NC 02)
인용정보 피인용 횟수 : 55  인용 특허 : 5

초록

A method of soldering without the need for fluxing agents, high temperature, hydrogen, laser excitation or sputtering techniques. The method uses plasma excitation to remove surface oxides from solder surfaces, thereby eliminating the need for post-soldering cleaning in an accurate and efficient man

대표청구항

A method of soldering without the need for fluxing agents, comprising the steps of: a. depositing solder on a first surface, said solder having a surface oxide layer; b. performing fluorine-containing plasma excitation on said solder; and c. reflowing said solder on said first surface.

이 특허에 인용된 특허 (5)

  1. Chasteen Jack W. (Kettering OH), Method for cleaning metal parts.
  2. Sliwa John W. (Los Altos Hills CA) Burt Roy J. (Sunnyvale CA) Lee Chune (San Francisco CA) MacKay John (Saratoga CA) Johnson Cindy A. (Sunnyvale CA), Method for mounting a semiconductor chip.
  3. Picard ; Paul, Method of high temperature assembly.
  4. Faris Sadeg M. (Yorktown Heights NY) Moskowitz Paul A. (Yorktown Heights NY) Davidson Arthur (Yorktown Heights NY) Sai-Halasz George A. (Mt. Kisco NY), Room temperature cryogenic test interface.
  5. Anderson ; Jr. Herbert R. (Patterson NY) Araps Constance J. (Wappingers Falls NY) Bates Richard A. (Wappingers Falls NY), Solder and braze fluxes and processes for using the same.

이 특허를 인용한 특허 (55)

  1. Haji Hiroshi,JPX, Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus.
  2. Mori Kozo,JPX, Apparatus and method of removing unnecessary matter and coating process using such method.
  3. Robbins, Michael D., Apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates.
  4. Fang Lu ; Potteiger Brian Dale ; Scrak Shaun P. ; Yeagle Frederick Arthur, Automated fluxless soldering using inert gas.
  5. Sakamoto, Eiji; Hata, Shohei, Bonding structure and method for manufacturing same.
  6. Mori Yoshiaki,JPX ; Takahashi Katsuhiro,JPX ; Miyakawa Takuya,JPX ; Karasawa Yasushi,JPX, Brazing or soldering material and manufacturing method therefor.
  7. Mori Yoshiaki,JPX ; Takahashi Katsuhiro,JPX ; Miyakawa Takuya,JPX, Brazing or soldering material and production method thereof.
  8. Furuno, Masahiko; Masuda, Tsugunori; Aoki, Hideo; Doi, Kazuhide, Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus.
  9. Kuo, Wen-Chang; Lin, Chia-Fu; Pan, Sheng-Liang; Wang, Szu-Yao; Chu, Cheng-Yu, Bump reflow method by inert gas plasma.
  10. Connie M. Wong ; Michael G. Lee, Conductive interconnect structures and methods for forming conductive interconnect structures.
  11. Fang Lu ; Potteiger Brian Dale ; Warning Frederick W. ; Yeagle Frederick Arthur, Direct-placement fluxless soldering using inert gas environment.
  12. Fay, Owen; Li, Xiao; Woodland, Josh; Luo, Shijian; Gandhi, Jaspreet; Wu, Te-Sung, Dry flux bonding device and method.
  13. Egitto Frank D. ; Fey Edmond O. ; Matienzo Luis J. ; Questad David L. ; Rai Rajinder S. ; Van Hart Daniel C., Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties.
  14. Bobbio Stephen M. (Wake Forest NC) Rinne Glenn A. (Cary NC), Fluorinated fluxless soldering.
  15. Bobbio Stephen M. ; Rinne Glenn A., Fluorinated fluxless soldering.
  16. Garyainov,Stanislav A.; Gotman,Alexander S.; Novikov,Vladimir V., Fluxless assembly of chip size semiconductor packages.
  17. Egitto Frank D. ; Matienzo Luis J., Fluxless joining process for enriched solders.
  18. Trabucco Robert T., Fluxless solder ball attachment process.
  19. Bobbio Stephen M. (Wake Forest NC) DuBois Thomas D. (Charlotte NC) Tranjan Farid M. (Charlotte NC) Lucey ; Jr. George K. (Burtonsville MD) Geis James D. (Cheshire CT) Lipscomb Robert F. (Chapel Hill , Fluxless soldering method.
  20. Jiang, Tongbi; Yamashita, Tsuyoshi, Integrated circuit assemblies and assembly methods.
  21. Yun, Changhan; Villarreal, Javier; Karpman, Maurice S., Interconnection of through-wafer vias using bridge structures.
  22. Takuya Miyakawa JP; Hiroaki Akiyama JP; Shintaro Asuke JP, Method and apparatus for atmospheric pressure plasma surface treatment, method of manufacturing semiconductor device, and method of manufacturing ink jet printing head.
  23. Mori Yoshiaki,JPX ; Miyakawa Takuya,JPX ; Asano Yasuhiko,JPX ; Kurashina Osamu,JPX ; Miyamori Satoshi,JPX ; Kurashima Yohei,JPX ; Anan Makoto,JPX, Method and apparatus for bonding using brazing material.
  24. Mori Yoshiaki,JPX ; Miyakawa Takuya,JPX ; Asano Yasuhiko,JPX ; Kurashina Osamu,JPX ; Miyamori Satoshi,JPX ; Kurashima Yohei,JPX ; Anan Makoto,JPX, Method and apparatus for bonding using brazing material.
  25. Takuya Miyakawa,JPX ; Yoshiaki Mori,JPX ; Yohei Kurashima,JPX ; Makoto Anan,JPX, Method and apparatus for bonding using brazing material at approximately atmospheric pressure.
  26. Bobbio Stephen M. ; Dubois Thomas D., Method and apparatus for forming hydrogen fluoride.
  27. Mori, Yoshiaki; Aoki, Yasutsugu; Miyakawa, Takuya, Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent.
  28. Murali Venkatesan, Method for cutting integrated circuit dies from a wafer which contains a plurality of solder bumps.
  29. Lindstrom Johan,SEX, Method for plasma brazing.
  30. Nishikawa Toru,JPX ; Satoh Ryohei,JPX ; Harada Masahide,JPX ; Hayashida Tetsuya,JPX ; Shirai Mitugu,JPX, Method of fabricating an electronic circuit device and apparatus for performing the method.
  31. Hong, Soon-Min; Moon, Young-Jun; Park, Min-Young; Choi, Sea-Gwang, Method of fabricating and mounting flip chips.
  32. Nishikawa Toru,JPX ; Satoh Ryohei,JPX ; Harada Masahide,JPX ; Hayashida Tetsuya,JPX ; Shirai Mitugu,JPX, Method of fabricating electronic circuit device and apparatus for performing the same method.
  33. Ikegami Yasumitsu,JPX ; Miyakawa Takuya,JPX, Method of making a piezoelectric element.
  34. Casey William J., Method of utilizing a plasma gas mixture containing argon and CF.sub.4 to clean and coat a conductor.
  35. Mis Joseph Daniel, Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structu.
  36. Ochiai Masayuki (Kawasaki JPX) Hashimoto Kaoru (Kawasaki JPX) Kawahara Toshimi (Kawasaki JPX) Osumi Mayumi (Kawasaki JPX), Methods for making metal particle spherical and removing oxide film solder paste and soldering method.
  37. Powell, Douglas O., Organic dielectric electronic interconnect structures and method for making.
  38. Powell,Douglas O., Organic dielectric electronic interconnect structures and method for making.
  39. Ikegami Yasumitsu,JPX ; Miyakawa Takuya,JPX, Piezoelectric element, manufacturing method thereof, and mounting apparatus of piezoelectric resonators.
  40. Miyakawa Takuya,JPX, Plasma etching method and method of manufacturing liquid crystal display panel.
  41. Hashimoto Yasuharu,JPX ; Takahashi Osamu,JPX ; Miyazaki Hajime,JPX ; Funasaka Tsukasa,JPX ; Furuhata Makoto,JPX, Power generation method and power generator using a piezoelectric element, and electronic device using the power.
  42. Poenisch Paul ; Matthews James A. ; Tsao Trancy, Process for flip-chip bonding a semiconductor die having gold bump electrodes.
  43. Ramm, Juergen; Beck, Eugen, Process for manufacturing component parts, use of same, with air bearing supported workpieces and vacuum processing chamber.
  44. Masahito Ijuin JP; Toru Nishikawa JP; Ryohei Sato JP; Mitsugu Shirai JP; Yuzo Taniguchi JP; Kosuke Inoue JP; Masahide Harada JP; Tetsuya Hayashida JP, Process for manufacturing electronic circuit devices.
  45. Masayuki Kitajima JP; Masakazu Takesue JP; Yoshitaka Muraoka JP, Semiconductor device with gold bumps, and method and apparatus of producing the same.
  46. Egitto, Frank D.; Fey, Edmond O.; Matienzo, Luis J.; Questad, David L.; Rai, Rajinder S.; Van Hart, Daniel C., Solder ball with chemically and mechanically enhanced surface properties.
  47. D'Asaro Lucian Arthur ; Goossen Keith Wayne ; Hui Sanghee Park ; Tseng Betty Jyue ; Walker James Albert, Solder bonding of dense arrays of microminiature contact pads.
  48. Masuo Koshi JP; Kenichirou Todoroki JP; Hiroaki Nakayama JP; Tadahiko Sugimoto JP, Soldering method.
  49. Bachman,Mark Adam; Chesire,Daniel Patrick; Merchant,Sailesh Mansinh, Structure and method for bonding to copper interconnect structures.
  50. Miyashita Takeshi,JPX ; Miyakawa Takuya,JPX ; Aoki Yasutugu,JPX ; Kubota Isao,JPX ; Kurashina Osamu,JPX ; Asano Yasuhiko,JPX ; Oda Yoshio,JPX ; Mori Yoshiaki,JPX, Surface treatment apparatus.
  51. Mori Yoshiaki,JPX ; Miyakawa Takuya,JPX ; Takahashi Katsuhiro,JPX ; Miyashita Takeshi,JPX ; Katagami Satoru,JPX, Surface treatment method.
  52. Fang Lu ; Pottelger Brian Dale ; Rinaudo Dominic Paul ; Yeagle Frederick Arthur, System for providing back-lighting of components during fluxless soldering.
  53. Koopman Nicholas G. ; Nangalia Sundeep, Tacking processes and systems for soldering.
  54. Pasch Nicholas F., Use of plasma activated NF.sub.3 to clean solder bumps on a device.
  55. Wang, Qing; Seurin, Jean-Francois; Ghosh, Chuni Lal; Watkins, Laurence, VCSEL packaging.
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