초록

A fluxless soldering method utilizing a strongly internally bonded fluorine containing gas such as hydrogen fluoride (HF). The solder surface is exposed to the gas in place of a flux treatment, resulting in a modified surface layer which allows reflow or joining for an extended period.

대표청구항 ▼

A fluxless soldering method, comprising: (a) selecting a strongly internally bonded fluorine-containing gas; and (b) exposing a substance to be soldered to the strongly internally bonded fluorine-containing gas at a temperature of about 10°-250°C., wherein said method results in a treatment of said

A fluxless soldering method, comprising: (a) selecting a strongly internally bonded fluorine-containing gas; and (b) exposing a substance to be soldered to the strongly internally bonded fluorine-containing gas at a temperature of about 10°-250°C., wherein said method results in a treatment of said substance which enables solder to be reflowed on a surface at a later time, wherein the surface is selected from the group consisting of solder precoated on a surface, tin, copper and gold.