이 특허를 인용한 특허 (43)

1. Larsen, Grant Kenji, Active electrostatic seal and electrostatic vacuum pump.

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2. Zide, Barry M.; Kirkpatrick, Sean R., Apparatus and method for reduced particulate generation during workpiece handling.

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3. Parkhe Vijay ; Hausmann Gilbert, Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck.

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4. Edwin C. Weldon ; Kenneth S. Collins ; Arik Donde ; Brian Lue ; Dan Maydan ; Robert J. Steger ; Timothy Dyer ; Ananda H. Kumar ; Alexander M. Veytser ; Kadthala R. Narendrnath ; Semyon L. K, Dielectric covered electrostatic chuck.

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5. Kubota Yoshihiro (Gunma-ken JPX) Kawai Makoto (Gunma-ken JPX), Electrostatic chuck.

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6. Yoshida,Kazuto; Inoue,Masahiko; Matsuda,Ryuichi; Sakamoto,Hitoshi, Electrostatic chuck and its manufacturing method.

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7. Simpson, Matthew A., Electrostatic chuck and method of forming.

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8. Hausmann Gilbert, Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing.

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9. Kholodenko Arnold ; Veytser Alexander M. ; Shamouilian Shamouil, Electrostatic chuck having a unidirectionally conducting coupler layer.

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10. Weldon, Edwin C.; Collins, Kenneth S.; Donde, Arik; Lue, Brian; Maydan, Dan; Steger, Robert J.; Dyer, Timothy; Kumar, Ananda H.; Veytser, Alexander M.; Narendrnath, Kadthala R.; Kats, Semyon L.; Khol, Electrostatic chuck having composite dielectric layer and method of manufacture.

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11. Shamouilian Shamouil ; Kumar Ananda H. ; Kholodenko Arnold, Electrostatic chuck with improved RF power distribution.

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12. Shamouilian Shamouil ; Kholodenko Arnold ; Kats Semyon ; Sherstinsky Semyon ; Clinton Jon ; Bedi Surinder, Electrostatic chuck with improved temperature control and puncture resistance.

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13. Collins Kenneth S. ; Tsui Joshua Chiu-Wing ; Buchberger Douglas, Electrostatic chuck with polymeric impregnation and method of making.

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14. Collins Kenneth S. ; Tsui Joshua Chiu-Wing ; Buchberger Douglas, Electrostatic chuck with polymeric impregnation and method of making.

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15. William A. Frutiger, Electrostatic wafer clamp.

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16. Grant Kenji Larsen, Electrostatic wafer clamp having electrostatic seal for retaining gas.

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17. Larsen Grant Kenji, Electrostatic wafer clamp having low particulate contamination of wafers.

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18. Narendrnath, Kadthala R.; Shamouilian, Shamouil; Grimard, Dennis S., Fabricating an electrostatic chuck having plasma resistant gas conduits.

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19. Abney, Stephen; Vesci, Anthony; Sommers, Joseph F.; Schweitzer, Marc O'Donnell; Dickerson, Scott; Tiller, Jennifer Watia, Flow-formed chamber component having a textured surface.

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20. Mitsumori, Takahiro; Kinoshita, Takeru; Ise, Hirotoshi, Glass substrate-holding tool and method for producing an EUV mask blank by employing the same.

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21. Mandal, Robert P., Integrally formed bake plate unit for use in wafer fabrication system.

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22. Bhatnagar, Ashish; Murugesh, Laxman; Gopalakrishnan, Padma, Localized surface annealing of components for substrate processing chambers.

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23. Ravi Kramadhati, Method and apparatus for the use of diamond films as dielectric coatings on electrostatic chucks.

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24. Fairbairn Kevin ; Sinha Ashok, Multideck wafer processing system.

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25. Sivaramakrishnan Visweswaren ; Ravi Tirunelveli S. ; Ravi Kramadhati V., Multiple substrate processing apparatus for enhanced throughput.

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26. Shamouil Shamouilian ; Arnold Kholodenko ; Kwok Manus Wong ; Liang-Guo Wang ; Alexander M. Veytser ; Dennis S. Grimard, Plasma chamber support having dual electrodes.

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27. Shamouilian, Shamouil; Sun, Jennifer Y.; Kumar, Ananda H., Process chamber having a corrosion-resistant wall and method.

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28. Schneider Gerhard ; Weldon Edwin C., Process chamber having improved gas distributor and method of manufacture.

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29. Lu Guo-Quan ; Bang Jaecheol, Process for providing a glass dielectric layer on an electrically conductive substrate and electrostatic chucks made by.

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30. Scheible, Kathleen; Flanigan, Michael Allen; Yoshidome, Goichi; Allen, Adolph Miller; Pavloff, Cristopher M., Process kit and target for substrate processing chamber.

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31. Young, Donny; Ritchie, Alan Alexander; Hong, Ilyoung (Richard); Scheible, Kathleen A., Process kit components for titanium sputtering chamber.

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32. Pavloff, Cristopher Mark; Hong, Ilyoung, Process kit for substrate processing chamber.

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33. Donde Arik ; Levinstein Hyman J. ; Wu Robert W. ; Hegedus Andreas ; Weldon Edwin C. ; Shamouilian Shamouil ; Clinton Jon T. ; Bedi Surinder S., Puncture resistant electrostatic chuck.

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34. Donde Arik ; Levinstein Hyman J. ; Wu Robert W. ; Hegedus Andreas ; Weldon Edwin C. ; Shamouilian Shamouil ; Clinton Jon T. ; Bedi Surinder S., Puncture resistant electrostatic chuck.

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35. Kadomura Shingo,JPX ; Jozaki Tomohide,JPX ; Hirano Shinsuke,JPX ; Miyashita Kinya,JPX ; Miyata Seiichirou,JPX ; Tatsumi Yoshiaki,JPX, Static electricity chuck and wafer stage.

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36. Riker, Martin; Wang, Wei W., Substrate cleaning chamber and components.

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37. Shamouilian Shamouil ; Kumar Ananda H. ; Salimian Siamak ; Dahimene Mahmoud ; Chafin Michael G. ; Grimard Dennis S., Substrate support for plasma processing.

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38. Miller, Keith A.; Lavitsky, Ilya, Support ring assembly.

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39. Bhatnagar, Ashish; Murugesh, Laxman; Gopalakrishnan, Padma, Surface annealing of components for substrate processing chambers.

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40. Lee, Cheng-Tsin; Mercer, Randel F., Transition metal oxide doped alumina and methods of making and using.

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41. Ravi Kramadhati, Use of carbon-based films in extending the lifetime of substrate processing system components.

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42. McMillin Brian ; Barnes Michael ; Berney Butch ; Nguyen Huong, Variable high temperature chuck for high density plasma chemical vapor deposition.

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43. Yang,Chen Hsiung, Wafer carrier.

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