이 특허를 인용한 특허 (83)

1. Flanigan Allen ; Sugarman Michael N., Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system.

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2. Ono Masanori,JPX, Apparatus for retaining a workpiece upon a workpiece support and method of manufacturing same.

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3. Herchen Harald, Bipolar electrostatic chuck and method of making same.

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4. Miwa, Kaname; Niwa, Tomonori; Kurano, Jun, Carrier device and ceramic member.

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5. Shu Nakajima JP; Neil Benjamin, Ceramic electrostatic chuck assembly and method of making.

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6. Richard R. Mett ; Hamid Noorbakhsh ; Robert D. Greenway, Chamber having improved gas feed-through and method.

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7. Burkhart Vincent E. ; Sugarman Michael N., Conductive feed-through for creating a surface electrode connection within a dielectric body and method of fabricating same.

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8. Burkhart Vince, Conductive feedthrough for a ceramic body and method of fabricating same.

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9. Parkhe Vijay ; Hausmann Gilbert, Conductive polymer pad for supporting a workpiece upon a workpiece support surface of an electrostatic chuck.

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10. Brown, Karl; Arellano, Nora; Sherstinsky, Semyon; Lau, Allen; Tsai, Cheng-Hsiung; Mehta, Vineet; Sansoni, Steve; Wang, Wei W., Detachable electrostatic chuck.

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11. Brown,Karl; Sherstinsky,Semyon; Wang,Wei W.; Tsai,Cheng Hsiung; Mehta,Vineet; Lau,Allen; Sansoni,Steve, Detachable electrostatic chuck for supporting a substrate in a process chamber.

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12. Parkhe, Vijay D.; Tsai, Cheng Tsiung; Sansoni, Steven V., Detachable electrostatic chuck having sealing assembly.

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13. Edwin C. Weldon ; Kenneth S. Collins ; Arik Donde ; Brian Lue ; Dan Maydan ; Robert J. Steger ; Timothy Dyer ; Ananda H. Kumar ; Alexander M. Veytser ; Kadthala R. Narendrnath ; Semyon L. K, Dielectric covered electrostatic chuck.

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14. Jones Phillip Lawrence ; Jafarian-Tehrani Seyed Jafar ; Atlas Boris V. ; Liu David R-Chen ; Tokunaga Ken Edward ; Chen Ching-Hwa, Dynamic feedback electrostatic wafer chuck.

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15. Gaff, Keith William; Busche, Matthew; Ricci, Anthony; Povolny, Henry S.; Stevenot, Scott, Edge seal for lower electrode assembly.

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16. Schaefer, David; Chhatre, Ambarish; Gaff, Keith William; Lee, Sung, Edge seal for lower electrode assembly.

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17. Schaefer, David; Chhatre, Ambarish; Gaff, Keith William; Lee, Sung; Lai, Brooke Mesler, Edge seal for lower electrode assembly.

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18. Shinohara Nobuhiro (Yokohama JPX) Kida Otojiro (Yokohama JPX), Electrification removing component.

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19. Kazue Takahasi JP; Youichi Itou JP; Saburo Kanai JP; Seiichiro Kanno JP, Electrostatic chuck.

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20. Morita, Naotoshi; Kameyama, Ryosuke, Electrostatic chuck.

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21. Tomaru Kazuhiko,JPX ; Handa Ryuichi,JPX ; Yoneyama Tsutomu,JPX, Electrostatic chuck.

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22. Watanabe Masahide (Yamanashi-ken JPX) Kubota Masami (Yamanashi-ken JPX) Koyama Shiro (Tokyo JPX) Ishikawa Kenji (Sagamihara JPX) Kazama Kouichi (Yamanashi-ken JPX) Komino Mitsuaki (Tokyo JPX) Sakurai, Electrostatic chuck.

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23. Nakajima,Shu; Tanaka,Yasushi, Electrostatic chuck and its manufacturing method.

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24. Simpson, Matthew A., Electrostatic chuck and method of forming.

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25. Logan Joseph ; Tompkins Robert ; Miller John R., Electrostatic chuck and method of manufacture.

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26. Nakamura, Tsunehiko; Migita, Yasushi, Electrostatic chuck and wafer holding member and wafer treatment method.

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27. You Wang ; Shamouil Shamouilian ; Arnold Kholodenko ; Alexander M. Veytser ; Surinder S. Bedi ; Kadthala R. Narendrnath ; Semyon L. Kats ; Dennis S. Grimard ; Wing L. Cheng ; Ananda H. Kumar, Electrostatic chuck bonded to base with a bond layer and method.

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28. Logan Joseph ; Tompkins Robert, Electrostatic chuck employing thermoelectric cooling.

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29. Hausmann Gilbert, Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing.

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30. Matyushkin, Alexander; Koosau, Dennis; Panagopoulos, Theodoros; Holland, John, Electrostatic chuck having a plurality of heater coils.

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31. Kholodenko Arnold ; Veytser Alexander M. ; Shamouilian Shamouil, Electrostatic chuck having a unidirectionally conducting coupler layer.

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32. Weldon, Edwin C.; Collins, Kenneth S.; Donde, Arik; Lue, Brian; Maydan, Dan; Steger, Robert J.; Dyer, Timothy; Kumar, Ananda H.; Veytser, Alexander M.; Narendrnath, Kadthala R.; Kats, Semyon L.; Khol, Electrostatic chuck having composite dielectric layer and method of manufacture.

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33. Kholodenko Arnold ; Shamouilian Shamouil ; Wang You ; Cheng Wing L. ; Veytser Alexander M. ; Bedi Surinder S. ; Narendrnath Kadthala R. ; Kats Semyon L. ; Grimard Dennis S. ; Kumar Ananda H., Electrostatic chuck having gas cavity and method.

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34. Wang, You; Shamouilian, Shamouil; Kholodenko, Arnold; Veytser, Alexander M.; Bedi, Surinder S.; Narendrnath, Kadthala R.; Kats, Semyon L.; Grimard, Dennis S.; Cheng, Wing L.; Kumar, Ananda H., Electrostatic chuck having heater and method.

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35. Shamouil Shamouilian ; You Wang ; Surinder S. Bedi ; Arnold Kholodenko ; Alexander M. Veytser ; Kadthala R. Narendrnath ; Semyon L. Kats ; Dennis S. Grimard ; Wing L. Cheng ; Ananda H. Kumar, Electrostatic chuck having improved electrical connector and method.

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36. Shamouilian Shamouil ; Birang Manoocher ; Cameron John F. ; Deshpandey Chandra ; Goldspeil Alfred ; Northrup Ron ; Shertinsky Semyon ; Somekh Sasson, Electrostatic chuck with improved erosion resistance.

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37. Shamouilian Shamouil ; Birang Manoocher ; Cameron John F. ; Deshpandey Chandra ; Goldspiel Alfred ; Northrup Ron ; Shertinsky Semyon ; Somekh Sasson, Electrostatic chuck with improved erosion resistance.

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38. Collins Kenneth S. ; Tsui Joshua Chiu-Wing ; Buchberger Douglas, Electrostatic chuck with polymeric impregnation and method of making.

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39. Collins Kenneth S. ; Tsui Joshua Chiu-Wing ; Buchberger Douglas, Electrostatic chuck with polymeric impregnation and method of making.

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40. Stephen Edward Savas TW; John Zajac, Electrostatic clamp for holding workpieces with irregular surfaces.

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41. Mogi Hiroshi,JPX ; Kobayashi Toshimi,JPX, Electrostatic holding apparatus and method of producing the same.

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42. Takahashi Kazue,JPX ; Itou Youichi,JPX ; Kanai Saburo,JPX ; Kanno Seiichiro,JPX, Electrostatically attracting electrode and a method of manufacture thereof.

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43. Takahasi, Kazue; Itou, Youichi; Kanai, Saburo; Kanno, Seiichiro, Electrostatically attracting electrode and a method of manufacture thereof.

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44. Narendrnath, Kadthala R.; Shamouilian, Shamouil; Grimard, Dennis S., Fabricating an electrostatic chuck having plasma resistant gas conduits.

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45. Abney, Stephen; Vesci, Anthony; Sommers, Joseph F.; Schweitzer, Marc O'Donnell; Dickerson, Scott; Tiller, Jennifer Watia, Flow-formed chamber component having a textured surface.

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46. Shareef, Iqbal A.; Landau, Igor; Markle, David A.; Talwar, Somit; Thompson, Michael O.; Angelov, Ivelin A.; Zhou, Senquan, Heated chuck for laser thermal processing.

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47. Nasman, Ronald; Robison, Rodney L.; Fujisato, Toshiaki, High temperature electrostatic chuck and method of using.

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48. Logan, Joseph; Miller, John R.; Naim, Mahmood; Tompkins, Robert E., Hybrid ceramic electrostatic clamp.

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49. Burkhart Vincent E., Laminated ceramic with multilayer electrodes and method of fabrication.

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50. Bhatnagar, Ashish; Murugesh, Laxman; Gopalakrishnan, Padma, Localized surface annealing of components for substrate processing chambers.

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51. Shufflebotham Paul Kevin ; Barnes Michael Scott, Low voltage electrostatic clamp for substrates such as dielectric substrates.

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52. Lin,Hongy; Smith,Jason Eugene; Laskowski,Thomas Michael, Method for manufacturing an electrostatic chuck.

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53. Shamouilian, Shamouil; Birang, Manoocher; Cameron, John F.; Deshpandey, Chandra; Goldspeil, Alfred; Northrup, Ron; Sherstinsky, Semyon; Someth, Sasson, Method of fabricating an electrostatic chuck.

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54. Ikeda, Koji; Takahashi, Fumitake; Shibata, Kazuyoshi, Method of producing a piezoelectric/electrostrictive device.

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55. Ikeda,Koji; Takahashi,Fumitake; Shibata,Kazuyoshi, Method of producing a piezoelectric/electrostrictive device.

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56. Husain Anwar, Multilayered electrostatic chuck and method of manufacture thereof.

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57. Castro Edward Ross ; Tokunaga Ken Edwin ; Atlas Boris V. ; Liu David Ru-Chen, Negative offset bipolar electrostatic chucks.

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58. Shamouil Shamouilian ; Arnold Kholodenko ; Kwok Manus Wong ; Liang-Guo Wang ; Alexander M. Veytser ; Dennis S. Grimard, Plasma chamber support having dual electrodes.

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59. Naim, Mahmood, Polyceramic e-chuck.

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60. Dible Robert D. ; Lenz Eric H. ; Lambson Albert M., Power segmented electrode.

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61. Dible Robert D. ; Lenz Eric H. ; Lambson Albert M., Power segmented electrode.

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62. Shamouilian, Shamouil; Sun, Jennifer Y.; Kumar, Ananda H., Process chamber having a corrosion-resistant wall and method.

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63. Schneider Gerhard ; Weldon Edwin C., Process chamber having improved gas distributor and method of manufacture.

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64. Scheible, Kathleen; Flanigan, Michael Allen; Yoshidome, Goichi; Allen, Adolph Miller; Pavloff, Cristopher M., Process kit and target for substrate processing chamber.

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65. Young, Donny; Ritchie, Alan Alexander; Hong, Ilyoung (Richard); Scheible, Kathleen A., Process kit components for titanium sputtering chamber.

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66. Pavloff, Cristopher Mark; Hong, Ilyoung, Process kit for substrate processing chamber.

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67. Liu, Hsi-Shui; Wang, Yeh-Chieh; Pai, Jiun-Rong, Replaceable electrostatic chuck sidewall shield.

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68. Kadomura Shingo,JPX ; Jozaki Tomohide,JPX ; Hirano Shinsuke,JPX ; Miyashita Kinya,JPX ; Miyata Seiichirou,JPX ; Tatsumi Yoshiaki,JPX, Static electricity chuck and wafer stage.

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69. Riker, Martin; Wang, Wei W., Substrate cleaning chamber and components.

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70. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate processing with rapid temperature gradient control.

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71. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate support assembly.

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72. Matyushkin, Alexander; Katz, Dan; Holland, John; Panagopoulos, Theodoros; Willwerth, Michael D., Substrate support assembly having rapid temperature control.

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73. Shamouilian Shamouil ; Kumar Ananda H. ; Salimian Siamak ; Dahimene Mahmoud ; Chafin Michael G. ; Grimard Dennis S., Substrate support for plasma processing.

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74. Wang, You; Kholodenko, Arnold; Shamouilian, Shamouil; Veytser, Alexander M.; Cheng, Wing L., Substrate support tolerant to thermal expansion stresses.

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75. Matyushkin, Alexander; Koosau, Dennis; Panagopoulos, Theodoros; Holland, John, Substrate support with electrostatic chuck having dual temperature zones.

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76. Mett, Richard R.; Noorbakhsh, Hamid; Greenway, Robert D., Substrate support with gas feed-through and method.

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77. Lue Brian ; Ishikawa Tetsuya ; Redeker Fred C. ; Wong Manus ; Li Shijian, Substrate support with pressure zones having reduced contact area and temperature feedback.

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78. Kiesewetter, Jorg; Teich, Michael; Schneidewind, Stefan; Dietrich, Claus, Substrate-holding device for testing circuit arrangements on substrates.

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79. Kadthala R. Narendrnath ; Syed H. Askari ; Dennis S. Grimard ; Surinder S. Bedi ; Ananda H. Kumar ; Shamouil Shamouilian, Support for supporting a substrate in a process chamber.

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80. Miller, Keith A.; Lavitsky, Ilya, Support ring assembly.

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81. Lee, Wonhaeng; Ha, Kang Rae, Supporting unit and substrate treating apparatus including the same.

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82. Bhatnagar, Ashish; Murugesh, Laxman; Gopalakrishnan, Padma, Surface annealing of components for substrate processing chambers.

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83. Nagasaki Koichi,JPX, Wafer holding device.

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