초록 ▼

A system and method is disclosed for measuring thickness of at least one film on a substrate by propagating an acoustic wave through the film on a substrate such that echo waves are generated and received by a transducer. An output signal is generated and processed to give a thickness value. The thi

A system and method is disclosed for measuring thickness of at least one film on a substrate by propagating an acoustic wave through the film on a substrate such that echo waves are generated and received by a transducer. An output signal is generated and processed to give a thickness value. The thickness valve is obtained from the time lapse between the propagated wave and receipt of the echo wave; by the frequency domain of the echo wave; or the phase of the echo wave.

대표청구항 ▼

A system for measuring thickness of at least one film on a substrate, such constituting a composite unit, said film and substrate having an interface, said system comprising: means including a buffer rod having an end shaped to make Hertzian contact with said composite unit for propagating a high fr

A system for measuring thickness of at least one film on a substrate, such constituting a composite unit, said film and substrate having an interface, said system comprising: means including a buffer rod having an end shaped to make Hertzian contact with said composite unit for propagating a high frequency acoustic wave through said composite unit, said acoustic wave generating reflected echo waves at the interfaces between the buffer rod and composite, between the composite and air, and between the film and substrate; means for receiving said echo waves and generating output signals; and means for processing said output signals to give a film thickness value.