이 특허를 인용한 특허 (206)

1. Deligianni, Hariklia; Romankiw, Lubomyr T., 60×120 cm2 prototype electrodeposition cell for processing of thin film solar panels.

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2. Woodruff, Daniel J.; Hanson, Kyle M.; Eudy, Steve L.; Weber, Curtis A.; Harris, Randy, Adaptable electrochemical processing chamber.

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3. Balisky,Todd Alan, Analytical reagent for acid copper sulfate solutions.

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4. He, Zhian, Anisotropic high resistance ionic current source (AHRICS).

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5. Reid, Jonathan D.; Archer, Timothy Mark; Vu, Thomas Tan; Varadarajan, Seshasayee; Henri, Jon; Mayer, Steven T.; Sauer, David; Kang, Anita; Feldewerth, Gerald, Anode and anode chamber for copper electroplating.

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6. Rimma Volodarsky ; Konstantin Volodarsky ; Cyprian Uzoh ; Homayoun Talieh ; Douglas W. Young, Anode assembly for plating and planarizing a conductive layer.

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7. Volodarsky, Rimma; Volodarsky, Konstantin; Uzoh, Cyprian; Talieh, Homayoun; Young, Douglas W., Anode assembly for plating and planarizing a conductive layer.

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8. Forrest B. Day ; Michael Rytting ; Steven S. Davis, Anode box for electrometallurgical processes.

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9. Uzoh Cyprian E., Anode design for semiconductor deposition having novel electrical contact assembly.

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10. Uzoh, Cyprian E.; Talieh, Homayoun; Basol, Bulent M., Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs.

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11. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.

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12. Chen,Linlin; Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Apparatus and method for electrochemically depositing metal on a semiconductor workpiece.

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13. Kagajwala, Burhanuddin; Buckalew, Bryan L.; Chua, Lee Peng; Berke, Aaron; Rash, Robert; Mayer, Steven T., Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity.

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14. Hanson,Kyle M., Apparatus and methods for electrochemical processing of microelectronic workpieces.

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15. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.

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16. Hanson,Kyle M.; Ritzdorf,Thomas L.; Wilson,Gregory J.; McHugh,Paul R., Apparatus and methods for electrochemical processing of microelectronic workpieces.

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17. Weiner, Kurt H.; Verma, Gaurav, Apparatus and methods for fast chemical electrodeposition for fabrication of solar cells.

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18. Weiner, Kurt H.; Verma, Gaurav, Apparatus and methods for fast chemical electrodeposition for fabrication of solar cells.

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19. Buckalew, Bryan L.; Mayer, Steven T.; Porter, David; Ponnuswamy, Thomas A., Apparatus for advanced packaging applications.

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20. Buckalew, Bryan L.; Mayer, Steven T.; Porter, David; Ponnuswamy, Thomas A., Apparatus for advanced packaging applications.

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21. Akram, Salman; Hembree, David R., Apparatus for continuous processing of semiconductor wafers.

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22. Basol, Bulent M.; Lindquist, Paul, Apparatus for controlling thickness uniformity of electroplated and electroetched layers.

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23. Keigler, Arthur; Harrell, John; Liu, Zhenqiu; Wu, Qunwei, Apparatus for fluid processing a workpiece.

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24. Ashjaee,Jalal; Nagorski,Boguslaw; Basol,Bulent M.; Talieh,Homayoun; Uzoh,Cyprian, Apparatus for processing surface of workpiece with small electrodes and surface contacts.

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25. Marsden, John O; Sandoval, Scot P; Stevens, Antonioni C; Robinson, Timothy G; Gilbert, Stanley R, Apparatus for producing metal powder by electrowinning.

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26. Keigler, Arthur; Wu, Qunwei; Liu, Zhenqiu; Harrell, John, Balancing pressure to improve a fluid seal.

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27. Keigler, Arthur; Wu, Qunwei; Liu, Zhenqiu; Harrell, John, Balancing pressure to improve a fluid seal.

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28. Browne, Robert M.; Allen, Donald G.; Reinstein, Hank; Thomas, Todd, Cam driven paddle assembly for a plating cell.

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29. Berner, Robert W.; Fatula, Jr., Joseph J.; Hitzfeld, Robert; Contreras, Richard; Chiu, Andrew, Cathode current control system for a wafer electroplating apparatus.

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30. Berner, Robert W.; Fatula, Jr., Joseph J.; Hitzfeld, Robert; Contreras, Richard; Chiu, Andrew, Cathode current control system for a wafer electroplating apparatus.

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31. Hanson, Kyle M.; Klocke, John L., Chambers, systems, and methods for electrochemically processing microfeature workpieces.

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32. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.

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33. Klocke,John; Hanson,Kyle M, Chambers, systems, and methods for electrochemically processing microfeature workpieces.

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34. Grand, Pierre-Philippe; Jaime, Salvador; De Gasquet, Philippe; Deligianni, Hariklia; Romankiw, Lubomyr T.; Vaidyanathan, Raman; Huang, Qiang; Ahmed, Shafaat, Checking the stoichiometry of I-III-VI layers for use in photovoltaic using improved electrolysis conditions.

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35. Maydan, Dan, Coated anode apparatus and associated method.

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36. Basol, Bulent; Talieh, Homayoun; Uzoh, Cyprian, Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization.

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37. Kovarsky,Nicolay; Yang,Michael; Lubomirsky,Dmitry, Contact plating apparatus.

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38. Herchen,Harald, Contact ring with embedded flexible contacts.

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39. Koon Kam Kwan,HKX, Continuous vertical plating system and method of plating.

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40. He, Zhian; Zhou, Jian; Feng, Jingbin; Reid, Jonathan D.; Ghongadi, Shantinath, Control of electrolyte flow dynamics for uniform electroplating.

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41. Mayer, Steven T.; Porter, David W., Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.

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42. Mayer, Steven T.; Porter, David W., Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.

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43. Mayer, Steven T.; Porter, David W.; Goh, Edwin; Buckalew, Bryan L.; Rash, Robert, Control of electrolyte hydrodynamics for efficient mass transfer during electroplating.

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44. Fanti Lisa A., Copper anode assembly for stabilizing organic additives in electroplating of copper.

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45. Mayer, Steven T.; Patton, Evan E.; Jackson, Robert L.; Reid, Jonathan D., Copper electroplating method and apparatus.

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46. Ponnuswamy, Thomas A.; Sukamto, John H.; Reid, Jonathan D.; Mayer, Steven T.; Zhu, Huanfeng, Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers.

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47. Ponnuswamy, Thomas A.; Sukamto, John H.; Reid, Jonathan D.; Mayer, Steven T., Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers.

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48. Abraham, Richard; Mayer, Steven T.; Buckalew, Bryan L.; Rash, Robert, Cross flow manifold for electroplating apparatus.

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49. Abraham, Richard; Mayer, Steven T.; Buckalew, Bryan L.; Rash, Robert, Cross flow manifold for electroplating apparatus.

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50. Hey, H. Peter W.; Dordi, Yezdi N.; Olgado, Donald J. K.; Denome, Mark, Deposition uniformity control for electroplating apparatus, and associated method.

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51. Weinhold, Ray; Wiener, Ferdinand, Device for vertical galvanic metal deposition on a substrate.

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52. Rauenbusch, Ralph; Thomas, Christian; Weinhold, Ray; Klingl, Heinz, Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device.

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53. Homayoun Talieh ; Cyprian Uzoh ; Bulent M. Basol, Device providing electrical contact to the surface of a semiconductor workpiece during metal plating.

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54. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Device providing electrical contact to the surface of a semiconductor workpiece during processing.

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55. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Device providing electrical contact to the surface of a semiconductor workpiece during processing.

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56. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Device providing electrical contact to the surface of a semiconductor workpiece during processing.

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57. Van Den Bossche, Bart Juul Wilhelmina; Purcar, Marius Ioan, Device suitable for electrochemically processing an object as well as a method for manufacturing such a device, a method for electrochemically processing an object, using such a device, as well as an object formed by using such a method.

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58. Chao Sandy S. ; Lloyd Mark, Double pressure vessel chemical dispenser unit.

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59. Graham, Gabriel Hay; Hiester, Jacob Lee; Chua, Lee Peng; Buckalew, Bryan L., Dynamic modulation of cross flow manifold during electroplating.

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60. Graham, Gabriel Hay; Buckalew, Bryan L.; Mayer, Steven T.; Rash, Robert; Fortner, James Isaac; Chua, Lee Peng, Edge flow element for electroplating apparatus.

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61. Herchen,Harald; Lubomirsky,Dmitry; Zheng,Bo; Pang,Lily L., Electric field reducing thrust plate.

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62. Dordi Yezdi ; Malik Muhammad Atif ; Hao Henan ; Franklin Timothy H. ; Stevens Joe ; Olgado Donald, Electro-chemical deposition system.

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63. Dordi Yezdi ; Olgado Donald J. ; Morad Ratson ; Hey Peter ; Denome Mark ; Sugarman Michael ; Lloyd Mark ; Stevens Joseph ; Marohl Dan ; Shin Ho Seon ; Ravinovich Eugene ; Cheung Robin ; Sinha Ashok K, Electro-chemical deposition system.

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64. Dordi, Yezdi; Olgado, Donald J.; Morad, Ratson; Hey, Peter; Denome, Mark; Sugarman, Michael; Lloyd, Mark; Stevens, Joseph; Marohl, Dan; Shin, Ho Seon; Ravinovich, Eugene; Cheung, Robin; Sinha, Ashok , Electro-chemical deposition system.

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65. Shen Ben ; Dordi Yezdi ; Birkmaier George, Electro-chemical deposition system and method.

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66. Landau Uziel, Electro-chemical deposition system and method of electroplating on substrates.

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67. Landau,Uziel, Electro-chemical deposition system and method of electroplating on substrates.

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68. Basol,Bulent M.; Talieh,Homayoun, Electrochemical mechanical processing apparatus.

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69. Uzoh,Cyprian E.; Basol,Bulent M., Electrode assembly for electrochemical processing of workpiece.

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70. Chen, Jason; Liu, Nakano; Shao, Winson; Chu, Wen; Hua, Chang-Hwang, Electroless plating apparatus and method.

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71. Henry,David; Dieppedale,Christel; Terrier,Thierry; Barrois,Gerard, Electrolytic reactor.

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72. Andricacos, Panayotis Constantinou; Deligianni, Harikilia; Dukovic, John Owen; Edelstein, Daniel C.; Horkans, Wilma Jean; Hu, Chao-Kun; Hurd, Jeffrey Louis; Rodbell, Kenneth P.; Uzoh, Cyprian Emeka; , Electroplated interconnection structures on integrated circuit chips.

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73. Cohen, Uri, Electroplated metallic conductors.

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74. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.

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75. Woodruff,Daniel J.; Hanson,Kyle M., Electroplating apparatus with segmented anode array.

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76. Feng, Jingbin; He, Zhian; Rash, Robert; Mayer, Steven T., Electroplating apparatus with vented electrolyte manifold.

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77. Uzoh Cyprian E., Electroplating workpiece fixture having liquid gap spacer.

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78. Uzoh Cyprian Emeka, Electroplating workpiece fixture having liquid gap spacer.

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79. Basol, Bulent M.; Talieh, Homayoun, Electropolishing system and process.

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80. Mayer, Steven T.; Buckalew, Bryan L.; Fu, Haiying; Ponnuswamy, Thomas; Diaz Camilo, Hilton; Rash, Robert; Porter, David W., Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating.

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81. Mayer, Steven T.; Buckalew, Bryan L.; Fu, Haiying; Ponnuswamy, Thomas; Diaz Camilo, Hilton; Rash, Robert; Porter, David W., Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating.

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82. Sendelbach, Matthew J.; Vaid, Alok; Zangooie, Shahin, Etching system and method for forming multiple porous semiconductor regions with different optical and structural properties on a single semiconductor wafer.

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83. Dordi, Yezdi N.; Stevens, Joseph J.; Hey, H. Peter W.; Olgado, Donald J. K., Flow diffuser to be used in electro-chemical plating system and method.

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84. Mayer, Steven T.; Reid, Jonathan D., High resistance ionic current source.

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85. Cohen, Uri, High speed electroplating metallic conductors.

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86. Kovarsky,Nicolay Y.; Lubomirsky,Dmitry; Rabinovich,Yevgeniy (Eugene), Insoluble anode with an auxiliary electrode.

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87. McHugh,Paul R.; Wilson,Gregory J.; Woodruff,Daniel J.; Zimmerman,Nolan; Erickson,James J., Integrated microfeature workpiece processing tools with registration systems for paddle reactors.

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88. Woodruff,Daniel J.; Mattson,David P.; Erickson,James J.; Egloff,Matthew C., Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces.

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89. Davis,Jeffry Alan; Harris,Randy A., Integrated tool with interchangeable wet processing components for processing microfeature workpieces.

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90. Silinger, Paul; Fery, Mark, Internal heat spreader plating methods and devices.

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91. Olgado, Donald J. K., Linear motion apparatus and associated method.

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92. Burkhart,Vincent E.; Herchen,Harald; Yahalom,Joseph, Liquid isolation of contact rings.

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93. Bogart,Jeffrey; Basol,Bulent M., Means to improve center to edge uniformity of electrochemical mechanical processing of workpiece surface.

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94. Kim, Doyeon; Ghongadi, Shantinath; Takada, Yuichi; Huang, Ludan; Majid, Tariq, Membrane design for reducing defects in electroplating systems.

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95. Kolics, Artur, Metallization of the wafer edge for optimized electroplating performance on resistive substrates.

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96. Kolics, Artur, Metallization of the wafer edge for optimized electroplating performance on resistive substrates.

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97. Kolics, Artur, Metallization of the wafer edge for optimized electroplating performance on resistive substrates.

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98. Paul Lindquist ; Bulent Basol ; Cyprian Uzoh ; Homayoun Talieh, Method and apparatus employing pad designs and structures with improved fluid distribution.

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99. Chen,B. Michelle; Shin,Ho Seon; Dordi,Yezdi; Morad,Ratson; Cheung,Robin, Method and apparatus for annealing copper films.

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100. Akram Salman ; Hembree David R., Method and apparatus for continuous processing of semiconductor wafers.

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101. Akram Salman ; Hembree David R., Method and apparatus for continuous processing of semiconductor wafers.

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102. Akram Salman ; Hembree David R., Method and apparatus for continuous processing of semiconductor wafers.

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103. Joshi Swati V. ; Botts Robert R. ; Nicholls Louis W., Method and apparatus for controlling plating thickness of a workpiece.

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104. Basol, Bulent M.; Uzoh, Cyprian; Talieh, Homayoun, Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate.

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105. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.

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106. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.

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107. Mayer, Steven; Feng, Jingbin; He, Zhian; Reid, Jonathan; Varadarajan, Seshasayee, Method and apparatus for electroplating.

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108. Reid, Jonathan; Buckalew, Bryan; He, Zhian; Park, Seyang; Varadarajan, Seshasayee; Pennington, Bryan; Ponnuswamy, Thomas; Breling, Patrick; Ibarreta, Glenn; Mayer, Steven, Method and apparatus for electroplating.

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109. Marsden, John O.; Gillaspie, James D.; Wilmot, John C., Method and apparatus for electrowinning copper using an atmospheric leach with ferrous/ferric anode reaction electrowinning.

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110. Wang,Hui, Method and apparatus for end-point detection.

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111. Reid, Jonathan D.; Zhu, Huanfeng, Method and apparatus for filling interconnect structures.

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112. Reid, Jonathan D.; Zhu, Huanfeng, Method and apparatus for filling interconnect structures.

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113. Keigler, Arthur; Harrell, John; Liu, Zhenqiu; Wu, Qunwei, Method and apparatus for fluid processing a workpiece.

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114. Keigler, Arthur; Harrell, John; Liu, Zhenqiu; Wu, Qunwei, Method and apparatus for fluid processing a workpiece.

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115. Keigler,Arthur; Harrell,John; Liu,Zhenqiu; Wu,Qunwei, Method and apparatus for fluid processing a workpiece.

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116. Morad, Ratson; Shin, Ho Seon; Cheung, Robin; Kogan, Igor, Method and apparatus for heating and cooling substrates.

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117. Basol, Bulent M.; Uzoh, Cyprian; Talieh, Homayoun, Method and apparatus for processing a substrate with minimal edge exclusion.

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118. Vasilev, Vladislav, Method and apparatus for workpiece surface modification for selective material deposition.

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119. Vasilev, Vladislav, Method and apparatus for workpiece surface modification for selective material deposition.

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120. Basol,Bulent M.; Talieh,Homayoun, Method and apparatus to deposit layers with uniform properties.

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121. Hey, Peter; Kwak, Byung-Sung Leo, Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio.

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122. Dordi, Yezdi N.; Stevens, Joseph J.; Sugarman, Michael N., Method and associated apparatus for tilting a substrate upon entry for metal deposition.

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123. Basol, Bulent M.; Uzoh, Cyprian E., Method and system monitoring and controlling film thickness profile during plating and electroetching.

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124. Daniel A. Carl ; Barry Chin ; Liang Chen ; Robin Cheung ; Peijun Ding ; Yezdi Dordi ; Imran Hashim ; Peter Hey ; Ashok K. Sinha, Method for achieving copper fill of high aspect ratio interconnect features.

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125. Akram, Salman; Hembree, David R., Method for continuous processing of semiconductor wafers.

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126. Basol, Bulent M., Method for controlling conductor deposition on predetermined portions of a wafer.

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127. Basol,Bulent M.; Lindquist,Paul, Method for controlling thickness uniformity of electroplated layers.

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128. Hui Wang, Method for electropolishing metal on semiconductor devices.

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129. Keigler, Arthur; Harrell, John; Liu, Zhenqiu; Wu, Qunwei, Method for fluid processing a workpiece.

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130. Zheng, Bo; Bajaj, Rajeev; Wang, Zhonghui Alex, Method for regulating the electrical power applied to a substrate during an immersion process.

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131. Keigler Arthur, Method of and apparatus for controlling fluid flow and electric fields involved in the electroplating of substantially flat workpieces and the like and more generally controlling fluid flow in the pr.

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132. Jalal Ashjaee ; Boguslaw A. Nagorski ; Bulent M. Basol ; Homayoun Talieh ; Cyprian Uzoh, Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing.

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133. Zheng, Bo; Wang, Hougong; Dixit, Girish; Chen, Fusen, Method of application of electrical biasing to enhance metal deposition.

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134. Mayer, Steven T.; Reid, Jonathan D., Method of electroplating using a high resistance ionic current source.

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135. Mayer, Steven T; Reid, Jonathan D., Method of electroplating using a high resistance ionic current source.

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136. Andricacos, Panayotis Constantinou; Deligianni, Hariklia; Dukovic, John Owen; Edelstein, Daniel Charles; Horkans, Wilma Jean; Hu, Chao-Kun; Hurd, Jeffrey Louis; Rodbell, Kenneth Parker; Uzoh, Cyprian, Method of making electroplated interconnection structures on integrated circuit chips.

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137. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Method of making rolling electrical contact to wafer front surface.

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138. Hui Wang, Methods and apparatus for electropolishing metal interconnections on semiconductor devices.

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139. Wang, Hui, Methods and apparatus for electropolishing metal interconnections on semiconductor devices.

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140. Hui Wang, Methods and apparatus for end-point detection.

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141. Wang Hui, Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces.

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142. Wang, Hui, Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces.

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143. Hui Wang, Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces.

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144. Oberlitner, Thomas H.; Hanson, Kyle M., Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece.

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145. Oberlitner,Thomas H.; Hanson,Kyle M., Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece.

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146. Cyprian Uzoh ; Bulent Basol ; Homayoun Talieh, Modified plating solution for plating and planarization and process utilizing same.

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147. Olgado, Donald J.; Tepman, Avi; Franklin, Timothy J., Multiple blade robot adjustment apparatus and associated method.

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148. Cyprian Uzoh ; Bulent Basol ; Homayoun Talieh, Pad designs and structures for a versatile materials processing apparatus.

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149. Uzoh,Cyprian; Basol,Bulent; Talieh,Homayoun, Pad designs and structures for a versatile materials processing apparatus.

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150. Joseph J. Fatula ; Robert M. Browne, Paddle design for plating bath.

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151. Chen, Chao-Peng; Chudasama, Jaswant; Mishra, Pradeep; Lin, Chen-Li; Wagner, David, Paddle for electroplating for selectively depositing greater thickness.

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152. Uzoh, Cyprian Emeka, Paddle for materials processing.

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153. McHugh,Paul R.; Wilson,Gregory J.; Woodruff,Daniel J.; Zimmerman,Nolan; Erickson,James J., Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces.

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154. Mayer, Steven T.; Drewery, John Stephen; Webb, Eric G., Photoresist-free metal deposition.

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155. Akram,Salman; Hembree,David R., Plating.

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156. Hui Wang, Plating apparatus and method.

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157. Yoshioka, Junichiro; Saito, Nobutoshi; Mukaiyama, Yoshitaka; Tokuoka, Tsuyoshi, Plating apparatus and method.

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158. Yoshioka,Junichiro; Saito,Nobutoshi; Mukaiyama,Yoshitaka; Tokuoka,Tsuyoshi, Plating apparatus and method.

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159. Nagai, Mizuki; Saito, Nobutoshi; Kuriyama, Fumio; Fukunaga, Akira, Plating apparatus and plating method.

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160. Saito, Nobutoshi; Fujikata, Jumpei; Yamamoto, Tadaaki; Kamimura, Kenji, Plating apparatus and plating method.

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161. Saito, Nobutoshi; Fujikata, Jumpei; Yamamoto, Tadaaki; Kamimura, Kenji, Plating apparatus and plating method.

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162. Saito, Nobutoshi; Fujikata, Jumpei; Yamamoto, Tadaaki; Kamimura, Kenji, Plating apparatus and plating method.

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163. Basol,Bulent, Plating by creating a differential between additives disposed on a surface portion and a cavity portion of a workpiece.

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164. Mayer, Steven T.; Ghongadi, Shantinath; Ganesan, Kousik; He, Zhian; Feng, Jingbin, Plating method and apparatus with multiple internally irrigated chambers.

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165. Mayer, Steven; Ghongadi, Shantinath; Ganesan, Kousik; He, Zhian; Feng, Jingbin, Plating method and apparatus with multiple internally irrigated chambers.

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166. Basol, Bulent M., Plating methods for low aspect ratio cavities.

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167. Kaja, Suryanarayana; Prasad, Chandrika; Yu, RongQing Roy, Process and apparatus for electroplating microscopic features uniformly across a large substrate.

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168. Fanti Lisa A., Process for stabilizing organic additives in electroplating of copper.

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169. Woodruff, Daniel; Eudy, Steve; Erickson, James; Oberlitner, Thomas; Egloff, Matthew, Processing apparatus including a reactor for electrochemically etching a microelectronic workpiece.

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170. Woodruff, Daniel; Eudy, Steve; Erickson, James; Oberlitner, Thomas; Egloff, Matthew, Processing apparatus including a reactor for electrochemically etching microelectronic workpiece.

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171. Talieh,Homayoun; Uzoh,Cyprian; Basol,Bulent M., Providing electrical contact to the surface of a semiconductor workpiece during processing.

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172. McHugh,Paul R.; Wilson,Gregory J.; Woodruff,Daniel J.; Zimmerman,Nolan; Erickson,James J., Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods.

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173. Olgado, Donald J. K., Removable modular cell for electro-chemical plating and method.

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174. Hey, H. Peter W.; Dordi, Yezdi N., Reverse voltage bias for electro-chemical plating system and method.

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175. Akram Salman ; Hembree David R., Rotating system and method for electrodepositing materials on semiconductor wafers.

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176. Akram Salman ; Hembree David R., Rotating system for electrochemical treatment of semiconductor wafers.

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177. Mayer, Steven T.; Drewery, John S., Rotationally asymmetric variable electrode correction.

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178. Hey, H. Peter W.; Sugarman, Michael N.; Denome, Mark, Segmenting of processing system into wet and dry areas.

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179. Cheng, Shih Jye; Lu, Tung Bao, Semiconductor structure having a silver alloy bump body and manufacturing method thereof.

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180. Yoshioka, Junichiro; Mukaiyama, Yoshitaka, Semiconductor wafer holder and electroplating system for plating a semiconductor wafer.

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181. Yoshioka, Junichiro; Mukaiyama, Yoshitaka, Semiconductor wafer holder and electroplating system for plating a semiconductor wafer.

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182. Yoshioka, Junichiro; Mukaiyama, Yoshitaka, Semiconductor wafer holder and electroplating system for plating a semiconductor wafer.

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183. Yoshioka, Junichiro; Mukaiyama, Yoshitaka, Semiconductor wafer holder and electroplating system for plating a semiconductor wafer.

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184. Ahmed, Shafaat; Deligianni, Hariklia; Romankiw, Lubomyr T.; Wang, Kejia, Structure and method of fabricating a CZTS photovoltaic device by electrodeposition.

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185. Ahmed, Shafaat; Deligianni, Hariklia; Romankiw, Lubomyr T.; Wang, Kejia, Structure and method of fabricating a CZTS photovoltaic device by electrodeposition.

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186. Ahmed, Shafaat; Deligianni, Hariklia; Romankiw, Lubomyr T.; Wang, Kejia, Structure and method of fabricating a CZTS photovoltaic device by electrodeposition.

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187. Mine, Junko, Substrate electrolytic processing apparatus and paddle for use in such substrate electrolytic processing apparatus.

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188. Goodman, Daniel; Keigler, Arthur; Guarnaccia, David G., Substrate holder.

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189. Donald J. K. Olgado ; Jayant Lakshmikanthan, Substrate holder system with substrate extension apparatus and associated method.

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190. Yoshioka, Junichiro; Katsuoka, Seiji; Sekimoto, Masahiko; Endo, Yasuhiko; Guo, Yugang, Substrate holder, plating apparatus, and plating method.

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191. Yoshioka, Junichiro; Katsuoka, Seiji; Sekimoto, Masahiko; Endo, Yasuhiko; Guo, Yugang, Substrate holder, plating apparatus, and plating method.

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192. Goodman, Daniel; Keigler, Arthur; Fisher, Freeman, Substrate loader and unloader.

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193. Basol, Bulent M.; Talieh, Homayoun, System and method for electrochemical mechanical polishing.

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194. Hoermann, Alexander F.; Rabinovich, Yevgeniy; Ta, Kathryn P., System and methods for measuring chemical concentrations of a plating solution.

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195. Wilson, Gregory J.; McHugh, Paul R.; Hanson, Kyle M., System for electrochemically processing a workpiece.

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196. Basol,Bulent M.; Ashjaee,Jalal; Govzman,Boris; Talieh,Homayoun; Frey,Bernard M., System for electropolishing and electrochemical mechanical polishing.

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197. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.

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198. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.

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199. Wilson,Gregory J.; McHugh,Paul R.; Weaver,Robert A.; Ritzdorf,Thomas L., Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece.

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200. Mok,Yeuk Fai Edwin; Nguyen,Son T., Two position anneal chamber.

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201. Reid, Jonathan; Park, Seyang; Varadarajan, Seshasayee; Doubina, Natalia, Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers.

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202. Klein,Martin P.; Keigler,Arthur; Felsenthal,David, Ultra-thin wafer handling system.

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203. Mayer, Steven T., Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction.

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204. Rye, Jason; Silvetti, Mario David; Harris, Randy A.; Puch, Bryan; Francischetti, Vincent Steffan; Sundar, Satish, Wafer processing system with chuck assembly maintenance module.

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205. Uzoh, Cyprian; Nagorski, Boguslaw Andrzej; Volodarsky, Konstantin; Young, Douglas W., Work piece carrier head for plating and polishing.

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206. Wilson,Gregory J.; McHugh,Paul R.; Hanson,Kyle M., Workpiece processor having processing chamber with improved processing fluid flow.

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