이 특허를 인용한 특허 (60)

1. Chan, Clayton Ka Tsun; Bibl, Andreas, Adhesive wafer bonding with controlled thickness variation.

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2. Chan, Clayton Ka Tsun; Bibl, Andreas, Adhesive wafer bonding with sacrificial spacers for controlled thickness variation.

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3. Ohuchi Shinji,JPX ; Egawa Yoshimi,JPX ; Anzai Noritaka,JPX, Bond pad for stress releif between a substrate and an external substrate.

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4. Sakurai,Hiroyuki; Sakurai,Keizo, Bump connection and method and apparatus for forming said connection.

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5. Bando Akio,JPX ; Katoh Motohiko,JPX ; Moroe Hirofumi,JPX, Bump forming method.

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6. Yamazaki Nobuto,JPX ; Kato Motohiko,JPX, Bump forming method.

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7. Golda, Dariusz; Bathurst, Stephen P.; Higginson, John A.; Bibl, Andreas; Birkmeyer, Jeffrey, Compliant electrostatic transfer head with defined cavity.

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8. Golda, Dariusz; Bathurst, Stephen P.; Higginson, John A.; Bibl, Andreas; Birkmeyer, Jeffrey, Compliant electrostatic transfer head with spring support layer.

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9. Bibl, Andreas; Sakariya, Kapil V.; Pavate, Vikram, Display module and system applications.

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10. Bibl, Andreas; Sakariya, Kapil V.; Pavate, Vikram, Display module and system applications.

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11. Bibl, Andreas; Sakariya, Kapil V.; Pavate, Vikram, Display module and system applications.

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12. Bibl, Andreas; Sakariya, Kapil V.; Pavate, Vikram, Display module and system applications.

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13. Joshi,Rajeev; Tangpuz,Consuelo; Rios,Margie T.; Cruz,Erwin Victor R., Dual metal stud bumping for flip chip applications.

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14. Joshi,Rajeev; Tangpuz,Consuelo; Rios,Margie T.; Cruz,Erwin Victor R., Dual metal stud bumping for flip chip applications.

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15. McGroddy, Kelly; Hu, Hsin-Hua; Bibl, Andreas; Chan, Clayton Ka Tsun, Etch removal of current distribution layer for LED current confinement.

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16. Bibl, Andreas; Golda, Dariusz, Flexible display and method of formation with sacrificial release layer.

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17. Sakariya, Kapil V.; Nauta, Tore, Interactive display panel with IR diodes.

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18. Sakariya, Kapil V.; Hendijanifard, Mohammad; Nauta, Tore, Interactive display panel with emitting and sensing diodes.

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19. Hu, Hsin-Hua; Bibl, Andreas; Higginson, John A.; Law, Hung-Fai Stephen, LED array.

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20. Hu, Hsin-Hua; Bibl, Andreas, LED device with embedded nanowire LEDs.

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21. Hu, Hsin-Hua; McGroddy, Kelly, LED with current injection confinement trench.

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22. McGroddy, Kelly; Hu, Hsin-Hua; Bibl, Andreas; Chan, Clayton Ka Tsun; Haeger, Daniel Arthur, LED with internally confined current injection area.

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23. Higginson, John A.; Bibl, Andreas; Albertalli, David, Mass transfer tool.

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24. Higginson, John A.; Bibl, Andreas; Albertalli, David, Mass transfer tool.

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25. Parks, Paul Argus; Light, Nile Alexander; Bathurst, Stephen P.; Higginson, John A.; Bibl, Andreas, Mass transfer tool manipulator assembly with remote center of compliance.

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26. Parks, Paul Argus; Light, Nile Alexander; Bathurst, Stephen P.; Higginson, John A.; Bibl, Andreas, Mass transfer tool manipulator assembly with remote center of compliance.

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27. Schoenfeld, Aaron; Ma, Manny K. F.; Kinsman, Larry D.; Brooks, J. Mike; Allen, Timothy J., Method and apparatus for coupling a semiconductor die to die terminals.

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28. Schoenfeld, Aaron; Ma, Manny K. F.; Kinsman, Larry D.; Brooks, J. Mike; Allen, Timothy J., Method and apparatus for coupling a semiconductor die to die terminals.

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29. Schoenfeld, Aaron; Ma, Manny K. F.; Kinsman, Larry D.; Brooks, J. Mike; Allen, Timothy J., Method and apparatus for coupling a semiconductor die to die terminals.

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30. Bibl, Andreas; Higginson, John A.; Law, Hung-Fai Stephen; Hu, Hsin-Hua, Method of fabricating a micro device transfer head.

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31. Hu, Hsin-Hua; Bibl, Andreas; Higginson, John A.; Law, Hung-Fai Stephen, Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer.

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32. Hu, Hsin-Hua; Bibl, Andreas, Method of forming a micro LED device with self-aligned metallization stack.

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33. Hu, Hsin-Hua; Bibl, Andreas; Higginson, John A.; Law, Hung-Fai Stephen, Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer.

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34. Ball Michael B., Method of improving interconnect of semiconductor device by utilizing a flattened ball bond.

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35. Ball Michael B., Method of improving interconnect of semiconductor devices by using a flattened ball bond.

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36. Michael B. Ball, Method of improving interconnect of semiconductor devices by using a flattened ball bond.

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37. Ball Michael B., Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond.

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38. Ball, Michael B., Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond.

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39. Ohuchi Shinji,JPX ; Egawa Yoshimi,JPX ; Anzai Noritaka,JPX, Method of manufacturing semiconductor devices having solder bumps with reduced cracks.

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40. Bibl, Andreas; Higginson, John A.; Law, Hung-Fai Stephen; Hu, Hsin-Hua, Method of transferring a light emitting diode.

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41. Bibl, Andreas; Higginson, John A.; Hu, Hsin-Hua; Law, Hung-Fai Stephen, Method of transferring and bonding an array of micro devices.

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42. Bibl, Andreas; Higginson, John A.; Law, Hung-Fai Stephen; Hu, Hsin-Hua, Micro device transfer head.

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43. Bibl, Andreas; Higginson, John A.; Law, Hung-Fai Stephen; Hu, Hsin-Hua, Micro device transfer head heater assembly and method of transferring a micro device.

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44. Bibl, Andreas; Higginson, John A.; Law, Hung-Fai Stephen; Hu, Hsin-Hua, Micro device transfer head heater assembly and method of transferring a micro device.

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45. Bibl, Andreas; Higginson, John A.; Law, Hung-Fai Stephen; Hu, Hsin-Hua, Micro device transfer head heater assembly and method of transferring a micro device.

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46. Bibl, Andreas; Higginson, John A.; Law, Hung-Fai Stephen; Hu, Hsin-Hua, Micro light emitting diode.

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47. Bibl, Andreas; Parks, Paul Argus, Micro pick up array alignment encoder.

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48. Bathurst, Stephen P.; Parks, Paul Argus; Light, Nile Alexander, Micro pick up array pivot mount.

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49. Bathurst, Stephen P.; Parks, Paul Argus; Light, Nile Alexander, Micro pick up array pivot mount design for strain amplification.

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50. Bathurst, Stephen P.; Parks, Paul Argus; Light, Nile Alexander, Micro pick up array pivot mount with integrated strain sensing elements.

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51. Zakel Elke,DEX ; Nave Jens,DEX ; Eldring Joachim, Process and device for forming raised metallised contacts.

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52. Pavate, Vikram; Bibl, Andreas, RFID tag and micro chip integration design.

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53. Kweon,Young Do; Pendse,Rajendra D.; Ahmad,Nazir; Kim,Kyung Moon, Self-coplanarity bumping shape for flip-chip.

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54. Koyama, Yugo, Semiconductor device having bumps.

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55. Kei Murayama JP, Semiconductor device to be mounted on main circuit board and process for manufacturing same device.

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56. Chen, Meng-Tse; Lin, Hsiu-Jen; Lin, Chih-Wei; Chen, Cheng-Ting; Cheng, Ming-Da; Liu, Chung-Shi, Stud bump structure for semiconductor package assemblies.

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57. Kwon Seok Mo,KRX ; Choe Si Hyun,KRX, Two step wire bond process.

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58. Seok Mo Kwon KR; Si Hyun Choe KR, Two step wire bond process.

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59. Hu, Hsin-Hua; Bibl, Andreas, Wearable display having an array of LEDs on a conformable silicon substrate.

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60. Lee, Chun-Chi, Wire bonding process and wire bond structure.

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