초록 ▼

A composition useful as a die-attach adhesive, polymer bump or encapsulant comprises from about 5-100% by weight of a base resin and from zero to 95% by weight of a particulate filler such as silver, wherein the base resin contains (a) from 10-95 parts by weight of a cycloaliphatic epoxy-functional

A composition useful as a die-attach adhesive, polymer bump or encapsulant comprises from about 5-100% by weight of a base resin and from zero to 95% by weight of a particulate filler such as silver, wherein the base resin contains (a) from 10-95 parts by weight of a cycloaliphatic epoxy-functional siloxane, (b) from about 5-90 parts by weight of a non-silicon-containing polyepoxy resin, .COPYRGT. from about 0.1-3 parts by weight of an iodonium salt, (d) from zero to about 3 parts by weight of a copper compound and, optionally, a silane adhesion promotor and/or an elastomeric toughener.

대표청구항 ▼

[ We claim:] [1.] A resin composition comprising from about 5 to 40% by weight of a base resin and from about 60 to 95% by weight of a particulate filler selected from the group consisting of silver, gold, silica, alumina, quartz, aluminum nitride, aluminum nitride coated with silica, barium sulfate

[ We claim:] [1.] A resin composition comprising from about 5 to 40% by weight of a base resin and from about 60 to 95% by weight of a particulate filler selected from the group consisting of silver, gold, silica, alumina, quartz, aluminum nitride, aluminum nitride coated with silica, barium sulfate, alumina trihydrate, and boron nitride, wherein said base resin comprises:(a) from about 20 to 50 parts by weight of 1,1,3,3-tetramethyl-1,3-bis[2-(7-oxabicyclo[4.1.0]hept-3-yl) ethyl]disiloxane;(b) from about 30 to 60 parts by weight of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexane carboxylate, dicyclopentadiene dioxide, or bis(3,4-epoxycyclohexyl) adipate;(c) from about 0.5 to 3 parts by weight of an iodonium salt of formula [ STR 7 ] wherein M is selected from the group consisting of boron, phosphorus, and antimony; X is halogen or C.sub.6 F.sub.5 when M is boron and n is 4; n is 4 or 6; and R is selected from the group consisting of hydrogen, C.sub.1 to C.sub.20 alkyl, C.sub.1 to C.sub.20 alkoxyl, C.sub.1 to C.sub.20 hydroxyalkoxyl, halogen, and nitro;(d) from zero to about 2 parts by weight of copper stearate, copper naphthenate, copper acetate, copper acetylacetonate, or copper 1,3-pentadienoate;(e) from about 0.4 to 5 parts by weight of glycidoxypropyltrimethoxysilane, octyltriethoxysilane, mercaptopropyltriethoxysilane, or mixtures thereof; and(f) from about 5 to 20 parts by weight of epoxidized polybutadiene, carboxyl-terminated polybutadiene, or carboxyl-terminated polybutadiene acrylonitrile.