$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Surface inspection system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-021/00
출원번호 US-0536862 (1995-09-29)
발명자 / 주소
  • Jordan
  • III John R.
  • Nikoonahad Mehrdad
  • Wells Keith B.
출원인 / 주소
  • Kla-Tencor Corporation
대리인 / 주소
    Majestic, Parsons, Siebert & Hsue
인용정보 피인용 횟수 : 171  인용 특허 : 37

초록

A high throughput surface inspection system with enhanced detection sensitivity is described. The acquired data is processed in real time at a rate of below 50 MHz thereby reducing the cost for data processing. Anomalies are detected and verified by comparing adjacent repeating patterns and the heig

대표청구항

[ What is claimed is:] [1.] An inspection system for detecting anomalies on a surface, comprising:means for optically scanning the surface;means for collecting light scattered by the surface and deriving an intensity value for at least a first pixel location from the collected light;means for determ

이 특허에 인용된 특허 (37)

  1. Picault Jean-Pierre C. (Arpajon FRX), Acousto-optical deflector.
  2. Grobman Warren D. (Yorktown Heights NY) Nelson ; Jr. David A. (Carmel NY) Warlaumont John M. (Croton-on-Hudson NY), Alignment method and apparatus for x-ray or optical lithography.
  3. Mizutani Hideo (Yokohama JPX) Sato Isao (Tokyo JPX) Shibuya Masato (Kawasaki JPX), Apparatus for detecting the level of an object surface.
  4. Hayano Fuminori (Fujisawa JPX) Imamura Kazunori (Tokyo JPX) Murata Sunao (Kawasaki JPX) Kato Kinya (Tokyo JPX), Apparatus with four light detectors for checking surface of mask with pellicle.
  5. Koizumi Mitsuyoshi (Yokohama JPX) Oshima Yoshimasa (Yokohama JPX) Akiyama Nobuyuki (Yokohama JPX) Yachi Toshiaki (Kodaira JPX), Automatic contaminants detection apparatus.
  6. Specht Donald F. (Los Altos CA) Wihl Tim S. (San Jose CA) Young Scott A. (Scotts Valley CA) Hager ; Jr. James J. (San Jose CA) Lutzker Matthew B. (Menlo Park CA), Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-sys.
  7. Kelderman Herman F. (Berkeley CA) Fein Michael E. (Mountain View CA) Loh Alan E. (Sunnyvale CA) Adams Arnold (Goleta CA) Neukermans Armand P. (Palo Alto CA), Confocal measuring microscope with automatic focusing.
  8. Knollenberg Robert G. (Boulder CO), Device and method for optically detecting particles in a fluid.
  9. Akamatsu Takahiro (Machida JPX) Kawashima Haruna (Kawasaki JPX) Kubo Hiroyoshi (Kawasaki JPX), Device for detecting the position of a surface.
  10. Suwa Kyoichi (Kanagawa JPX), Focusing apparatus for projection optical system.
  11. Tokura Nobufumi (Fukuoka JPX), Height measurement apparatus using laser light beam.
  12. Hayano Fuminori (Kamakura JPX) Imamura Kazunori (Tokyo JPX) Murata Sunao (Kawasaki JPX), Inspecting apparatus for determining presence and location of foreign particles on reticles or pellicles.
  13. Porter Vernon R. (Plano TX) Manns William G. (Dallas TX) Wood Anthony B. (Dallas TX) Baber S. Charles (Richardson TX) Penn Thomas C. (Richardson TX), Laser scanner using focusing acousto-optic device.
  14. Galbraith Lee K. (Mountain View CA), Light collector for optical contaminant and flaw detector.
  15. Hagiwara Tsuneyuki (Tokyo JPX) Hayano Fuminori (Yokohama JPX), Light scanning apparatus for detecting foreign particles on surface having circuit pattern.
  16. Roulot, Maurice, Light source with acousto-optic deflector and afocal lens system.
  17. Shahar Arie (10 David Street 56910 Moshav Magshimin NJ ILX) Schwartz Nira (1314 Wellington PI. Aberdeen NJ 07747), Method and apparatus for measuring surface distances from a reference plane.
  18. Scott Richard S. F. (Woodside CA) Uziel Yoram (Yodfat CA ILX) Filice Franco A. (Gilroy CA), Method and apparatus for the automated analysis of three-dimensional objects.
  19. Steigmeier Edgar F. (Hedingen CHX) Auderset Heinrich (Horgen CHX), Method for determining the quality of light scattering material.
  20. Walker Curtis M. (Armada MI) Brown Gordon R. (Livonia MI), Non-contact sensor with particular utility for measurement of road profile.
  21. Kakinoki Yoshikazu (Machida JPX) Nakashima Masato (Yokohama JPX) Koezuka Tetsuo (Hachioji JPX) Hiraoka Noriyuki (Kawasaki JPX) Tsukahara Hiroyuki (Atsugi JPX) Suto Yoshinori (Kawasaki JPX) Oshima Yos, Optical system for detecting three-dimensional shape.
  22. Nikoonahad Mehrdad (Menlo Park CA) Rigg Philip R. (Saratoga CA) Wells Keith B. (Santa Cruz CA) Calhoun David S. (Mountain View CA), Optical wafer positioning system.
  23. Ikari Motoo (Osaka JPX) Yakada Yuji (Osaka JPX) Yamamoto Shintaro (Osaka JPX) Isoi Toshimitsu (Osaka JPX) Shirakura Kaoru (Osaka JPX) Satake Tadashi (Osaka JPX) Kanbe Yoshiaki (Osaka JPX) Ishiguro Ya, Optically scanning displacement sensor with linearity correction means.
  24. Allemand Charly D. (Nantucket MA), Particle detection method and apparatus.
  25. Vaught John L. (Palo Alto CA) Neukermans Armand P. (Palo Alto CA) Keldermann Herman F. (Berkeley CA) Koenig Franklin R. (Palo Alto CA), Particle detection on patterned wafers and the like.
  26. Wihl Tim S. (San Jose CA) Wihl Mark J. (San Jose CA), Photomask inspection apparatus and method using corner comparator defect detection algorithm.
  27. Levy Kenneth (Saratoga CA) Buchholz Steve (San Jose CA) Broadbent William H. (Sunnyvale CA) Wihl Mark J. (San Jose CA), Photomask inspection apparatus and method with improved defect detection.
  28. Manns William G. (Dallas TX) Weeks Don J. (Southlake TX) Merryman Jerry D. (Dallas TX) Sheng Chyi N. (Richardson TX), Position compensation of laser scan for stage movement.
  29. Ido Satoshi (Tokorozawa JPX) Fujinami Minpei (Iruma JPX) Kato Yasuo (Zama JPX) Sakitani Yoshio (Iruma JPX) Ozasa Susumu (Kashiwa JPX), Position detecting system.
  30. Avni Eitan (Langhorne PA) Pace Sal A. (Trenton NJ), Real time mottle measuring device and method.
  31. Danielson Donald L. (Palo Alto CA) Wihl Mark J. (Tracy CA) Joseph David A. (Santa Cruz CA), Reticle inspection system.
  32. Kajimura Hiroshi (Tokyo JPX), Scanning probe microscope with slant detection and compensation.
  33. Mizutani Hideo (Tokyo JPX) Ishizaka Shoji (Kawasaki JPX) Suto Takeshi (Funabashi JPX), Surface displacement sensor with opening angle control.
  34. Stauffer Norman L. (Englewood CO), Surface position sensor.
  35. Heebner Richard W. (Solebury Township ; Bucks County PA) Schmitt Randal L. (Plainsboro Township ; Middlesex County NJ), Technique for inspecting semiconductor wafers for particulate contamination.
  36. Nikoonahad Mehrdad (Menlo Park CA) Tebelskis James A. (San Jose CA), Wafer alignment sensor.
  37. Reeds John W. (Thousand Oaks CA), X-Y-q 상세보기

이 특허를 인용한 특허 (171)

  1. Bills, Richard Earl, Apparatus and method for detecting defects in the surface of a workpiece.
  2. Furman, Dov; Neumann, Gad; Wagner, Mark; Dotan, Noam; Segal, Ram; Silberstein, Shai, Apparatus for determining optimum position of focus of an imaging system.
  3. Chen, Hong; Wu, Kenong; Shifrin, Eugene; Yamaoka, Masatoshi, Array mode repeater detection.
  4. Jin,Ju; Sadam,Satish; Verma,Vishal; Huang,Zhiyan; Lin,Siming; Robbins,Michael D; Forderhase,Paul F., Automatic wafer edge inspection and review system.
  5. Johnston, Kyle S.; Bass, Charles M., Calibration for 3D measurement system.
  6. Meeks, Steven W.; Kudinar, Rusmin, Combined high speed optical profilometer and ellipsometer.
  7. Meeks,Steven W; Kudinar,Rusmin, Combined high speed optical profilometer and ellipsometer.
  8. Kawaragi, Hiroshi, Defect detecting apparatus, defect detecting method, information processing apparatus, information processing method, and program therefor.
  9. Vaez-Iravani, Mehdi; Rzepiela, Jeffrey Alan; Treadwell, Carl; Zeng, Andrew; Fiordalice, Robert, Defect detection system.
  10. Vaez-Iravani, Mehdi; Rzepiela, Jeffrey Alan; Treadwell, Carl; Zeng, Andrew; Fiordalice, Robert, Defect detection system.
  11. Yonezawa, Eiji, Defect inspection method and defect inspection apparatus.
  12. Shibata, Yukihiro; Fukushima, Hideki; Urano, Yuta; Honda, Toshifumi, Defect inspection method and device using same.
  13. Shibata, Yukihiro; Fukushima, Hideki; Urano, Yuta; Honda, Toshifumi, Defect inspection method and device using same.
  14. Aiko, Kenji; Chikamatsu, Shuichi; Noguchi, Minori; Iwata, Hisafumi, Defect inspection system.
  15. Aiko, Kenji; Chikamatsu, Shuichi; Noguchi, Minori; Iwata, Hisafumi, Defect inspection system.
  16. Aiko, Kenji; Chikamatsu, Shuichi; Noguchi, Minori; Iwata, Hisafumi, Defect inspection system.
  17. Xu,James J.; Lee,Ken K., Defect review system with 2D scanning and a ring detector.
  18. Meeks, Steven W., Detecting and classifying surface features or defects by controlling the angle of the illumination plane of incidence with respect to the feature or defect.
  19. Meeks,Steven W., Detecting multi-domain states in perpendicular magnetic media.
  20. Bechtler,Laurie; Velidandla,Vamsi; Meeks,Steven W., Detecting surface pits.
  21. Johnston, Kyle S.; Franklin, Joseph A.; Nelson, Spencer G.; Bass, Charles M., Determination of the angular position of a laser beam.
  22. Windorfer, Harald, Device for processing a surface.
  23. Inoue, Tokiko; Iida, Yusuke; Matsunaga, Tatsuya; Oba, Hitoshi, Displacement sensor.
  24. Yu, Zongqiang, Dual stage defect region identification and defect detection method and apparatus.
  25. Hess,Harald F.; Carr,Thomas Daniel; Sappey,Romain, Dynamic reference plane compensation.
  26. Furman, Dov; Neumann, Gad; Dotan, Noam, Fiber optical illumination system.
  27. Furman,Dov, Fiber optical illumination system.
  28. Furman,Dov; Neumann,Gad; Dotan,Noam, Fiber optical illumination system.
  29. Yamashita, Hiroyuki; Kobayashi, Mamoru; Imai, Eiji; Morishige, Yoshio; Nagoya, Koichi; Fukushima, Hideki, Foreign matter inspection method and foreign matter inspection apparatus.
  30. Yamashita, Hiroyuki; Kobayashi, Mamoru; Imai, Eiji; Morishige, Yoshio; Nagoya, Koichi; Fukushima, Hideki, Foreign matter inspection method and foreign matter inspection apparatus.
  31. Yamashita, Hiroyuki; Kobayashi, Mamoru; Imai, Eiji; Morishige, Yoshio; Nagoya, Koichi; Fukushima, Hideki, Foreign matter inspection method and foreign matter inspection apparatus.
  32. Clary, Thomas R.; Franklin, Joseph A.; Johnston, Kyle S.; Ridge, Joseph D., High precision optical imaging systems and related systems.
  33. Mcmillan, Wayne; Wolters, Christian, Illumination energy management in surface inspection.
  34. Furman, Dov; Kaner, Roy; Gonen, Ori; Mandelik, Daniel; Tal, Eran; Silberstein, Shai, Image splitting in optical inspection systems.
  35. Furman, Dov; Silberstein, Shai; Miklatzky, Effy; Mandelik, Daniel; Abraham, Martin, Image splitting in optical inspection systems.
  36. Li, Shifang, Increasing dynamic range of a height sensor for inspection and metrology.
  37. Yutaka Imai JP; Ayumu Taguchi JP; Hitoshi Tamada JP; Hiroyuki Wada JP, Inspection apparatus and method.
  38. Wolters, Christian; Xu, Zhiwei; Reich, Juergen, Inspection beam shaping for improved detection sensitivity.
  39. Weiss,Adam; Saranli,Afsar, Inspection of TFT LCD panels using on-demand automated optical inspection sub-system.
  40. Vaez Iravani,Mehdi, Inspection system for integrated applications.
  41. Reinhron, Silviu; Almogy, Gilad, Inspection systems performing two-dimensional imaging with line light spot.
  42. Eytan,Giora; Tsadka,Sagie, Inspection systems using sensor array and double threshold arrangement.
  43. Raymond, Christopher, Line profile asymmetry measurement.
  44. Raymond, Christopher, Line profile asymmetry measurement.
  45. Raymond, Christopher J., Line profile asymmetry measurement using scatterometry.
  46. Meeks, Steven W., Material independent optical profilometer.
  47. Meeks, Steven W., Material independent profiler.
  48. Avner Karpol IL; Silviu Reinhorn IL; Emanuel Elysaf IL; Shimon Yalov IL; Boaz Kenan IL, Method and apparatus for article inspection including speckle reduction.
  49. Avner Karpol IL; Silviu Reinhorn IL; Emanuel Elysaf IL; Shimon Yalov IL; Boaz Kenan IL, Method and apparatus for article inspection including speckle reduction.
  50. Karpol, Avner; Reinhorn, Silviu; Elyasaf, Emanuel; Yalov, Shimon; Kenan, Boaz, Method and apparatus for article inspection including speckle reduction.
  51. Karpol, Avner; Reinhorn, Silviu; Elysaf, Emanuel; Yalov, Shimon; Kenan, Boaz, Method and apparatus for article inspection including speckle reduction.
  52. Karpol,Avner; Reinhorn,Silviu; Elysaf,Emanuel; Yalov,Shimon; Kenan,Boaz, Method and apparatus for article inspection including speckle reduction.
  53. Shibata,Yukihiro; Maeda,Shunji, Method and apparatus for detecting defects.
  54. Sali, Erez; Yanir, Tomer; Wagner, Mark; Dotan, Noam; Dorfan, Yuval; Zaslavsky, Ran, Method and apparatus for detecting defects in wafers.
  55. Dorphan, Yuval; Zaslavsky, Ran; Wagner, Mark; Furman, Dov; Silberstein, Shai, Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images.
  56. Hunter, Reginald, Method and apparatus for embedded substrate and system status monitoring.
  57. Hunter, Reginald, Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques.
  58. Reunanen, Juha; Saarela, Antti, Method and apparatus for identifying repeated patterns.
  59. Oshemkov, Sergey; Klaesges, Ralph; Mengel, Markus, Method and apparatus for modifying a substrate surface of a photolithographic mask.
  60. Hunter, Reginald, Method and apparatus for substrate surface inspection using spectral profiling techniques.
  61. Meeks, Steven W.; Soetarman, Ronny, Method and apparatus to optically detect defects in transparent solids.
  62. Hunter, Reginald, Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques.
  63. Hunter,Reginald, Method and apparatus to provide for automated process verification and hierarchical substrate examination.
  64. Mangan, Shmuel; Sagiv, Amir; Abramson, Mariano, Method and system for creation of binary spatial filters.
  65. Lorusso, Gian Francesco; Grella, Luca; Masnaghetti, Douglas K.; Azordegan, Amir, Method and system for e-beam scanning.
  66. Drent, William Van; Vajda, Ferenc, Method and system for perpendicular magnetic media metrology.
  67. Mangan, Shmuel; Sagiv, Amir; Abramson, Mariano, Method and system for use of binary spatial filters.
  68. Stahlhut, Oliver; Neumann, Christian; Mäker, Michael, Method for analyzing reflection properties.
  69. Whitefield, Bruce; Abercrombie, David, Method for calculating high-resolution wafer parameter profiles.
  70. Feld Michael,CAX ; Tordjman David,CAX ; Feld Alex,CAX, Method for the verification of the polarity and presence of components on a printed circuit board.
  71. Michael Feld CA; David Tordjman CA; Alex Feld CA, Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuits board.
  72. Karpol, Avner; Reinhorn, Silviu; Elysaf, Emanuel; Yalov, Shimon; Kenan, Boaz, Method of and apparatus for article inspection including speckle reduction.
  73. Karpol, Avner; Reinhorn, Silviu; Elysaf, Emanuel; Yalov, Shimon; Kenan, Boaz, Method of and apparatus for article inspection including speckle reduction.
  74. Elichai, Rami; Schwartz, Gilad; Naftali, Ron; Margulis, Pavel; Slobodnik, Igor, Method of and apparatus for line alignment to compensate for static and dynamic inaccuracies in scanning.
  75. Meeks,Steven W., Method of detecting and classifying scratches and particles on thin film disks or wafers.
  76. Meeks, Steven W., Method of detecting and classifying scratches, particles and pits on thin film disks or wafers.
  77. Moghaddam, Alireza Shahdoost; Nguyen, Hung Phi, Method of detecting the thickness of thin film disks or wafers.
  78. Wang, Chun-Sheng; Sung, Yi-Chang; Liao, Chi-Hung; Turn, Li-Kong; Liu, Louie, Method of wafer height mapping.
  79. Latypov Azat M., Method to remove station-induced error pattern from measured object characteristics and compensate the measured object characteristics with the error.
  80. Fielden, John; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan, Methods and systems for determining a characteristic of a layer formed on a specimen by a deposition process.
  81. Nikoonahad, Mehrdad; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Wack, Dan; Fielden, John, Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation.
  82. Fielden,John; Levy,Ady; Brown,Kyle A.; Bultman,Gary; Nikoonahad,Mehrdad; Wack,Dan, Methods and systems for determining a composition and a thickness of a specimen.
  83. Wack, Dan; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Fielden, John, Methods and systems for determining a critical dimension an a presence of defects on a specimen.
  84. Nikoonahad, Mehrdad; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Wack, Dan; Fielden, John, Methods and systems for determining a critical dimension and a thin film characteristic of a specimen.
  85. Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan; Fielden, John, Methods and systems for determining a critical dimension and overlay of a specimen.
  86. Levy, Ady; Brown, Kyle A.; Smedt, Rodney; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan; Fielden, John; Abdul-Halim, Ibrahim, Methods and systems for determining a critical dimension and overlay of a specimen.
  87. Levy, Ady; Brown, Kyle A.; Smedt, Rodney; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan; Fielden, John; Abdul-Halim, Ibrahim, Methods and systems for determining a critical dimension and overlay of a specimen.
  88. Levy, Ady; Brown, Kyle A.; Smedt, Rodney; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan; Fielden, John; Abdulhalim, Ibrahim, Methods and systems for determining a critical dimension and overlay of a specimen.
  89. Nikoonahad, Mehrdad; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Wack, Dan; Fielden, John, Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen.
  90. Bultman,Gary; Levy,Ady; Brown,Kyle A.; Nikoonahad,Mehrdad; Wack,Dan; Fielden,John, Methods and systems for determining a presence of defects and a thin film characteristic of a specimen.
  91. Bultman, Gary; Levy, Ady; Brown, Kyle A.; Nikoonahad, Mehrdad; Wack, Dan; Fielden, John, Methods and systems for determining a presence of macro and micro defects on a specimen.
  92. Bultman,Gary; Levy,Ady; Brown,Kyle A.; Nikoonahad,Mehrdad; Wack,Dan; Fielden,John, Methods and systems for determining a presence of macro and micro defects on a specimen.
  93. Wack, Dan; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Fielden, John, Methods and systems for determining a presence of macro defects and overlay of a specimen.
  94. Wack, Dan; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Fielden, John, Methods and systems for determining a presence of macro defects and overlay of a specimen.
  95. Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan; Fielden, John, Methods and systems for determining a property of a specimen prior to, during, or subsequent to an etch process.
  96. Wack,Dan; Levy,Ady; Brown,Kyle A.; Bultman,Gary; Nikoonahad,Mehrdad; Fielden,John, Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography.
  97. Fielden, John; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan, Methods and systems for determining a thickness of a structure on a specimen and at least one additional property of the specimen.
  98. Fielden,John; Levy,Ady; Brown,Kyle A.; Bultman,Gary; Nikoonahad,Mehrdad; Wack,Dan, Methods and systems for determining a thin film characteristic and an electrical property of a specimen.
  99. Wack,Dan; Levy,Ady; Brown,Kyle A.; Bultman,Gary; Nikoonahad,Mehrdad; Fielden,John, Methods and systems for determining an adhesion characteristic and a thickness of a specimen.
  100. Nikoonahad, Mehrdad; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Wack, Dan; Fielden, John, Methods and systems for determining an implant characteristic and a presence of defects on a specimen.
  101. Nikoonahad, Mehrdad; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Wack, Dan; Fielden, John, Methods and systems for determining at least four properties of a specimen.
  102. Wack, Dan; Levy, Ady; Brown, Kyle A.; Smedt, Rodney C.; Bultman, Gary; Nikoonahad, Mehrdad; Fielden, John, Methods and systems for determining at least one characteristic of defects on at least two sides of a specimen.
  103. Fielden, John; Levy, Ady; Brown, Kyle A.; Bultman, Gary; Nikoonahad, Mehrdad; Wack, Dan, Methods and systems for determining flatness, a presence of defects, and a thin film characteristic of a specimen.
  104. Levy,Ady; Brown,Kyle A.; Nikoonahad,Mehrdad; Bultman,Gary; Wack,Dan; Fielden,John, Methods and systems for determining overlay and flatness of a specimen.
  105. Kirk, Greg; Solarz, Rich; Kirk, Chris; Delgado, Gil; Schemelinin, Anatoly; Li, Jim; Chen, Qibiao; Wang, Charles Nenghe, Methods and systems for providing illumination of a specimen for a process performed on the specimen.
  106. Kirk, Greg; Solarz, Rich, Methods and systems for providing illumination of a specimen for inspection.
  107. Furman,Dov; Dotan,Noam; Miklatzky,Efraim, Multi mode inspection method and apparatus.
  108. Meeks, Steven W., Multi-wavelength system and method for detecting epitaxial layer defects.
  109. Meeks, Steven W.; Nguyen, Hung P., Multiple spot size optical profilometer, ellipsometer, reflectometer and scatterometer.
  110. Kinney, Patrick D.; Gupta, Anand; Rao, Nagaraja P., Optical method and apparatus for inspecting large area planar objects.
  111. Rao, Nagaraja P.; Kinney, Patrick D., Optical method and apparatus for inspecting large area planar objects.
  112. Kuznetsov, Alexander; Peterlinz, Kevin; Shchegrov, Andrei, Optical metrology of periodic targets in presence of multiple diffraction orders.
  113. Hunter, Reginald, Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems.
  114. Lewis, Isabella; Vaez-Iravani, Mehdi, Optical system for detecting anomalies and/or features of surfaces.
  115. Lewis,Isabella; Vaez Iravani,Mehdi, Optical system for detecting anomalies and/or features of surfaces.
  116. Hunter, Reginald, Particle detection and embedded vision system to enhance substrate yield and throughput.
  117. Hunter, Reginald; Tsadka, Sagie, Particle detection and embedded vision system to enhance substrate yield and throughput.
  118. Wada, Hiroyuki; Hirata, Yoshimi; Taguchi, Ayumu; Tatsuki, Koichi; Umezu, Nobuhiko; Kubota, Shigeo; Abe, Tetsuo; Ooshima, Akifumi; Hattori, Tadashi; Takatoku, Makoto; Sugano, Yukiyasu, Polysilicon evaluating method, polysilicon inspection apparatus and method for preparation of thin film transistor.
  119. Fuchs, Dan T.; Silberstein, Shai, Printed fourier filtering in optical inspection tools.
  120. Johnston, Kyle S.; Lock, Tomas E.; Clary, Thomas R.; Nelson, Spencer G.; Greenberg, Heath M., Profiling of a component having reduced sensitivity to anomalous off-axis reflections.
  121. Standiford,Keith; Neil,Mark A., Region-of-interest based electron beam metrology.
  122. Chen, Hong; Wu, Kenong; Shifrin, Eugene; Yamaoka, Masatoshi; Sivaraman, Gangadharan; Babulnath, Raghav; Kurada, Satya; Sun, Shuo, Repeater detection.
  123. Hu, Clark; Jeng, Hendrix; Jang, Bor Ping, Semiconductor wafer tilt monitoring on semiconductor fabrication equipment plate.
  124. Hou,Zhen; Soetarman,Ronny; Velidandla,Vamsi; Meeks,Steven W., Servo pattern characterization on magnetic disks.
  125. Vaez Iravani,Mehdi; Miller,Lawrence Robert, Simultaneous multi-spot inspection and imaging.
  126. Vaez-Iravani, Mehdi; Miller, Lawrence Robert, Simultaneous multi-spot inspection and imaging.
  127. Vaez-Iravani, Mehdi; Miller, Lawrence Robert, Simultaneous multi-spot inspection and imaging.
  128. Vaez-Iravani, Mehdi; Miller, Lawrence Robert, Simultaneous multi-spot inspection and imaging.
  129. Meeks, Steven W.; Sappey, Romain; Carr, Tom, Surface characteristic analysis.
  130. Oak, Dave S.; Do, Tri; Soetarman, Ronny; Meeks, Steven W.; Velidandla, Vamsi, Surface finish roughness measurement.
  131. Xu,James J.; Lee,Ken K., Surface inspection system.
  132. Miller, Lawrence Robert; Vaez-Iravani, Mehdi, Surface inspection system with improved capabilities.
  133. Miller,Lawrence Robert; Vaez Iravani,Mehdi, Surface inspection system with improved capabilities.
  134. Mehanian,Courosh; Meeks,Steven W.; Rosengaus,Eliezer, Surface scanning.
  135. Yavets-Chen, Yehuda; Tzidon, Dekel, Surface scanning device.
  136. Soetarman,Ronny; Velidandla,Vamsi M.; Leung,Jimmy; Meeks,Steven W., System and method for automatically determining magnetic eccentricity of a disk.
  137. Velidandla,Vamsi, System and method for classifying, detecting, and counting micropipes.
  138. Baran, Bruce; Koliopoulos, Chris L.; Gao, Songping; Bills, Richard E.; Murphree, Michael, System and method for controlling a beam source in a workpiece surface inspection system.
  139. Vacca Anthony ; Vavul Thomas ; Parker Donald J. ; Saidin Zain ; Watson Sterling G. ; Wiley James N., System and method for determining reticle defect printability.
  140. Meeks,Steven W., System and method for double sided optical inspection of thin film disks or wafers.
  141. Meeks, Steven W.; Kudinar, Rusmin, System and method for measuring object characteristics using phase differences in polarized light reflections.
  142. Meeks, Steven W.; Kudinar, Rusmin, System and method for measuring properties of an object using a phase difference between two reflected light signals.
  143. Moghadam,Alireza Shahdoost; Velidandla,Vamsi Mohan, System and method for optimizing wafer flatness at high rotational speeds.
  144. Meeks, Steven W.; Kudinar, Rusmin, System and method for simultaneously measuring thin film layer thickness, reflectivity, roughness, surface profile and magnetic pattern in thin film magnetic disks and silicon wafers.
  145. Chen, Wayne; Zeng, Andrew; Akbulut, Mustafa, System and methods for classifying anomalies of sample surfaces.
  146. Chen,Wayne; Zeng,Andrew; Akbulut,Mustafa, System and methods for classifying anomalies of sample surfaces.
  147. Chen,Wayne; Zeng,Andrew; Akbulut,Mustafa, System and methods for classifying anomalies of sample surfaces.
  148. Chen,Wayne; Zeng,Andrew; Akbulut,Mustafa, System and methods for classifying anomalies of sample surfaces.
  149. Vaez Iravani,Mehdi; Zhao,Guoheng; Stokowski,Stanley E., System for detecting anomalies and/or features of a surface.
  150. Zhao, Guoheng; Stokowski, Stanley; Vaez-Iravani, Mehdi, System for detecting anomalies and/or features of a surface.
  151. Zhao, Guoheng; Stokowski, Stanley; Vaez-Iravani, Mehdi, System for detecting anomalies and/or features of a surface.
  152. Zhao,Guoheng; Stokowski,Stanley; Vaez Iravani,Mehdi, System for detecting anomalies and/or features of a surface.
  153. Furman, Dov; Neumann, Gad; Wagner, Mark; Dotan, Noam; Segal, Ram; Silberstein, Shai, System for detection of wafer defects.
  154. Furman,Dov; Neumann,Gad; Wagner,Mark; Dotan,Noam; Segal,Ram; Silberstein,Shai, System for detection of wafer defects.
  155. Neumann,Gad; Dotan,Noam, System for detection of wafer defects.
  156. Furman, Dov; Neumann, Gad; Wagner, Mark; Dotan, Noam; Segal, Ram; Silberstein, Shai, System for detection of water defects.
  157. Meeks, Steven W.; Kudinar, Rusmin, System for simultaneously measuring thin film layer thickness, reflectivity, roughness, surface profile and magnetic pattern.
  158. Han-Ming Sheng TW, System to position defect location on production wafers.
  159. Owczarz, Aleksander; Winniczek, Jaroslaw W.; Nasser, Luai; Schoepp, Alan; Redeker, Fred C.; Edelberg, Erik, System, method and apparatus for in-situ substrate inspection.
  160. Owczarz,Aleksander; Winniczek,Jaroslaw W.; Nasser,Luai; Schoepp,Alan; Redeker,Fred C.; Edelberg,Erik, System, method and apparatus for in-situ substrate inspection.
  161. Marella,Paul Frank, Systems and methods for closed loop defect reduction.
  162. Rosengaus,Eliezer; Young,Lydia, Systems and methods for inspection of specimen surfaces.
  163. Sullivan, Jamie M.; Cai, Wenjian; Cao, Kai, Systems and methods for run-time alignment of a spot scanning wafer inspection system.
  164. Sullivan, Jamie; Johnson, Ralph; Gibson, John; Li, Mingguang; Vella, Eric, Systems and methods for scanning a beam of light across a specimen.
  165. Bevis,Christopher F.; Kirk,Mike; Vaez Iravani,Mehdi, Systems for inspection of patterned or unpatterned wafers and other specimen.
  166. Almogy, Gilad; Mazaki, Hadar; Phillip, Zvi Howard; Reinhorn, Silviu; Goldberg, Boris; Some, Daniel I., Variable angle illumination wafer inspection system.
  167. Meeks, Steven W.; Kudinar, Rusmin, Wafer edge inspection.
  168. Meeks, Steven W.; Kudinar, Rusmin; Wheeler, William R.; Nguyen, Hung Phi; Velidandla, Vamsi; Somanchi, Anoop; Soetarman, Ronny, Wafer edge inspection.
  169. Meeks,Steven W.; Kudinar,Rusmin; Wheeler,William R.; Nguyen,Hung Phi, Wafer edge inspection.
  170. Meeks,Steven W.; Kudinar,Rusmin; Wheeler,William; Nguyen,Hung Phi, Wafer edge inspection.
  171. Velidandla,Vamsi; Somanchi,Anoop; Soetarman,Ronny; Meeks,Steven W., Wafer edge inspection.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로