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Electrode for electrochemical machining, method of electrochemical machining with said electrode, a bearing and a metho 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25B-011/00
출원번호 US-0860120 (1997-10-21)
국제출원번호 PCT/NL96/00001 (1996-01-02)
§371/§102 date 19971021 (19971021)
국제공개번호 WO-9620061 (1996-07-04)
발명자 / 주소
  • Wardle Frank Peter,GB2
출원인 / 주소
  • SKF Industrial Trading & Development Company B.V., NLX
대리인 / 주소
    Mayer, Brown & Platt
인용정보 피인용 횟수 : 33  인용 특허 : 1

초록

The invention relates to an electrode for electrochemical machining. An electrode comprising a plurality of electrode segments separated by insulating material. As desired, different voltages are applied to each of the electrode segments giving control over the amount of material locally removed fro

대표청구항

[ I claim:] [1.] Electrode for electrochemical machining, said electrode (1) comprising side walls and a plurality of electrode segments (2), said electrode segments (2) being separated from each other and having an electrically non-insulating end (6) for facing a metal piece to be electrochemically

이 특허에 인용된 특허 (1)

  1. Fromson, Robert E., Controlled metal removal by parallel-to-face electrochemical machining.

이 특허를 인용한 특허 (33)

  1. Zdeblick, William J.; Luo, Yuefeng, Active matrix electrochemical machining apparatus and method.
  2. Tietz,James V.; Li,Shijian; Birang,Manoocher; White,John M.; Rosenberg, legal representative,Sandra L.; Scales,Marty; Emami,Ramin; Rosenberg, deceased,Lawrence M., Article for polishing semiconductor substrates.
  3. Li,Shijian; Chen,Llang Yuh; Duboust,Alain, Articles for polishing semiconductor substrates.
  4. Mavliev,Rashid A.; Wadensweiler,Ralph M., Conductive pad.
  5. Mavliev, Rashid A.; Karuppiah, Lakshmanan, Conductive pad design modification for better wafer-pad contact.
  6. Chen,Liang Yun; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid A.; Tsai,Stan D.; Wang,You; Diao,Jie; Jia,Renhe; Karuppiah,Lakshmanan; Ewald,Robert, Conductive pad with ion exchange membrane for electrochemical mechanical polishing.
  7. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph, Conductive polishing article for electrochemical mechanical polishing.
  8. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yonqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph; Sun,Lizhong; Neo,Siew S.; Duboust,Alain, Conductive polishing article for electrochemical mechanical polishing.
  9. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
  10. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
  11. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
  12. Hu, Yongqi; Wang, Yan; Duboust, Alain; Liu, Feng Q.; Mavliev, Rashid; Chen, Liang-Yuh; Morad, Ratson; Somekh, Sasson, Conductive polishing article for electrochemical mechanical polishing.
  13. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou, Conductive polishing article for electrochemical mechanical polishing.
  14. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou, Conductive polishing article for electrochemical mechanical polishing.
  15. Liu, Feng Q.; Mavliev, Rashid, Contact assembly and method for electrochemical mechanical processing.
  16. Butterfield, Paul; Chen, Liang Yuh; Hu, Yongqi; Manens, Antoine; Mavliev, Rashid; Tsai, Stan, Contacts for electrochemical processing.
  17. Butterfield,Paul; Chen,Liang Yuh; Hu,Yongqi; Manens,Antoine; Mavliev,Rashid; Tsai,Stan, Contacts for electrochemical processing.
  18. Mavliev,Rashid; Tsai,Stan; Hu,Yongqi; Butterfield,Paul; Manens,Antoine; Chen,Liang Yuh, Contacts for electrochemical processing.
  19. Duboust,Alain; Manens,Antoine P.; Chen,Liang Yuh, Edge bead removal by an electro polishing process.
  20. Pitsianis, Nikos P.; Pechanek, Gerald George; Rodriguez, Ricardo, Efficient complex multiplication and fast fourier transform (FFT) implementation on the ManArray architecture.
  21. Wang, Yuchun; Ewald, Robert A.; Hsu, Wei-Yung; Chen, Liang-Yuh, Extended pad life for ECMP and barrier removal.
  22. Luo, Yuefeng, Fabrication of topical stopper on head gasket by active matrix electrochemical deposition.
  23. Liu,Feng Q.; Chen,Liang Yuh; Tsai,Stan D.; Hu,Yongqi, Full sequence metal and barrier layer electrochemical mechanical processing.
  24. Liu,Feng Q.; Chen,Liang Yuh; Tsai,Stan D.; Hu,Yongqi, Full sequence metal and barrier layer electrochemical mechanical processing.
  25. Wang, Yan; Neo, Siew; Liu, Feng; Tsai, Stan D.; Hu, Yongqi; Duboust, Alain; Manens, Antoine; Wadensweiler, Ralph M.; Mavliev, Rashid; Chen, Liang-Yuh; Olgado, Donald J. K.; Butterfield, Paul D.; Tseng, Ming-Kuei; Chang, Shou-Sung; Sun, Lizhong, Method and apparatus for electrochemical mechanical processing.
  26. Shapiro Andrew Philip ; Salvo Joseph James, Method and system for treating contaminated media.
  27. Platz, Albin; Arbinger, Daniela, Multipart electrode array and method for the electrochemical treatment of blades having shrouding bands.
  28. Chang,Shou Sung; Tsai,Stan D.; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical polishing.
  29. Chang,Shou Sung; Tsai,Stan D.; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical processing.
  30. Chang,Shou Sung; Tsai,Stan D; Olgado,Donald J. K.; Chen,Liang Yuh; Duboust,Alain; Wadensweiler,Ralph M., Pad assembly for electrochemical mechanical processing.
  31. Hu,Yongqi; Tsai,Stan D.; Wang,Yan; Liu,Feng Q.; Chang,Shou Sung; Chen,Liang Yuh, Pad assembly for electrochemical mechanical processing.
  32. Hu,Yongqi; Tsai,Stan D.; Wang,Yan; Liu,Feng Q.; Chang,Shou Sung; Chen,Liang Yuh, Pad assembly for electrochemical mechanical processing.
  33. Manens,Antoine P.; Chen,Liang Yuh, Process control in electrochemically assisted planarization.
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