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Controlled solder interdiffusion for high power semiconductor laser diode die bonding 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/488
출원번호 US-0673222 (1996-06-27)
발명자 / 주소
  • Merritt Scott Andrew
  • Heim Peter John Schultz
  • Dagenais Mario
출원인 / 주소
  • University of Maryland
대리인 / 주소
    Watson Cole Grindle Watson P.L.L.C.
인용정보 피인용 횟수 : 35  인용 특허 : 21

초록 ▼

A method and a resulting device for mounting a semiconductor to a submount by depositing a first layer of a first metal solder having a selected first melting point and corresponding thickness onto a surface of the semiconductor. Depositing a second layer of a second metal solder having a selected s

대표청구항 ▼

[ What is claimed:] [1.] A method for mounting a semiconductor to a submount comprising the steps of:depositing a first layer of a first metal solder having a selected first melting point and corresponding thickness onto a surface of the semiconductor;depositing a second layer of a second metal sold

이 특허에 인용된 특허 (21)

  1. Williams Ronald L. (San Marcos CA), Alloy bonded indium bumps and methods of processing same.
    상세보기
  2. Sasame Akira (Hyogo JPX) Sakanoue Hitoyuki (Hyogo JPX), Aluminum nitride sintered body having a metallized coating layer on its surface.
    상세보기
  3. Storms Ronald L. (Hamburg NJ), Autogenously bonded filter assemblies.
    상세보기
  4. Henein Gerard E. (Berkeley Heights NJ) Hepplewhite Ralph T. (Millington NJ) Schwartz Bertram (Westfield NJ), Fluxless bonding of microelectronic chips.
    상세보기
  5. Kong Alvin M. (Los Angeles CA) Lau James C. (Torrance CA) Chan Steven S. (Alhambra CA), Mass simultaneous sealing and electrical connection of electronic devices.
    상세보기
  6. Melton Cynthia M. (Bolingbrook IL) Skipor Andrew (Glendale Heights IL), Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature.
    상세보기
  7. Ochiai Masayuki (Kawasaki JPX), Method for soldering electronic components onto a printed wiring board using a solder paste.
    상세보기
  8. Ueda Naoto (Itami JPX), Method of die bonding semiconductor chip.
    상세보기
  9. Nishikawa Toru,JPX ; Satoh Ryohei,JPX ; Harada Masahide,JPX ; Hayashida Tetsuya,JPX ; Shirai Mitugu,JPX, Method of fabricating electronic circuit device and apparatus for performing the same method.
    상세보기
  10. Kurata Kazuhiko,JPX, Method of manufacturing an optical semiconductor device.
    상세보기
  11. Fujiwara Kanji (Kawasaki JPX), Method of mounting a semiconductor laser device.
    상세보기
  12. Humpston Giles (Croxley Green GB2) Jacobson David M. (Wembley GB2), Methods of joining components.
    상세보기
  13. Bacon Donlad D. (Somerset NJ) Katz Avishay (Westfield NJ) Lee Chien-Hsun (North Plainfield NJ) Tai King L. (Berkeley Heights NJ) Wong Yiu-Man (Wescosville PA), Permanent metallic bonding method.
    상세보기
  14. Devenyi Tibor F. (Nepean CAX) Kovats Tibor F. I. (Ottawa CAX) Look Christopher M. (Nepean CAX), Semiconductor laser bonding technique.
    상세보기
  15. Checkley James D. (Middlebury IN) Oberholser Larry E. (Elkhart IN), Sofa clamp-quick release clamp for vehicle seats.
    상세보기
  16. Beavis Leonard C. (Albuquerque NM) Karnowsky Maurice M. (Albuquerque NM) Yost Frederick G. (Ceder Crest NM), Solder extrusion pressure bonding process and bonded products produced thereby.
    상세보기
  17. Abe Shunichi (Itami JPX) Asai Katunori (Itami JPX) Tomita Yoshihiro (Itami JPX) Ichiyama Hideyuki (Itami JPX) Ohumae Seizou (Itami JPX) Nishinaka Yoshirou (Itami JPX) Fukutome Katsuyuki (Itami JPX) U, Solder material, junctioning method, junction material, and semiconductor device.
    상세보기
  18. Gaynes Michael A. (Vestal NY) Papathomas Kostas (Endicott NY) Phelan Giana M. (Endicott NY) Woychik Charles G. (Vestal NY), Stabilization of conductive adhesive by metallurgical bonding.
    상세보기
  19. Powers V. B. (St. Petersburg FL) Roberts J. W. (Clearwater FL) Dhaliwall J. S. (Seminole FL), Stress absorption matrix.
    상세보기
  20. Schmitt Edward H. (Livermore CA) Tuckerman David B. (Livermore CA), Vacuum die attach for integrated circuits.
    상세보기
  21. Shyr Richard (Greenlawn NY), Wafer level process for fabricating passivated semiconductor devices.
    상세보기

이 특허를 인용한 특허 (35)

  1. Chen, Wei; Bird, Marc W.; Stevens, John H., Braze materials and earth-boring tools comprising braze materials.
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  2. Roellig, Ulrich; Lorenzen, Dirk, Diode laser component.
    상세보기
  3. Jan, Jong Rong; Lu, Tsai Hua; Chiu, Sao Ling; Kung, Ling Chen, Electronic devices including offset conductive bumps.
    상세보기
  4. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers.
    상세보기
  5. Hong, Sam Hyo; Hoyer, Henrik; Hume, Jeffrey, Highly reliable, cost effective and thermally enhanced AuSn die-attach technology.
    상세보기
  6. Deacon, David A. G., Laser frequency aging compensation.
    상세보기
  7. Mis, J. Daniel; Rinne, Glenn A., Lead free alloy bump structure and fabrication method.
    상세보기
  8. Rinne,Glenn A.; Nair,Krishna K., Low temperature methods of bonding components and related structures.
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  9. Nomura, Seiji; Nanba, Satoshi; Sugimoto, Yukihiro; Yamamoto, Yukio, Metal welding method and metal bonding structure.
    상세보기
  10. Guo, Shuwen; Eriksen, Odd Harald Steen; Childress, Kimiko J., Method for forming a transducer.
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  11. Eriksen, Odd Harald Steen; Childress, Kimiko J.; Guo, Shuwen, Method for making a transducer.
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  12. Kinei, Satofumi, Method for manufacturing semiconductor laser apparatus.
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  13. Reichert,Hans J��rg; Deckers,Margarete; Zanner,Rainer, Method for producing a chip-substrate connection.
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  14. Kasem,Mohammed; Owyang,King; Kuo,Frank; Jaunay,Serge Robert; Mao,Sen; Ou,Oscar; Wang,Peter; Chen,Chang Sheng, Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys.
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  15. Ok, Jung Tae; Kim, Hak Hwan; Paek, Ho Sun; Kim, Kwon Joong, Method of manufacturing bump.
    상세보기
  16. Chen, Wei; Bird, Marc W.; Stevens, John H., Methods and compositions for brazing.
    상세보기
  17. Chen, Wei; Overstreet, James L.; Stevens, John H., Methods and compositions for brazing, and earth-boring tools formed from such methods and compositions.
    상세보기
  18. Andrews,Peter, Methods of assembly for a semiconductor light emitting device package.
    상세보기
  19. Nair, Krishna K.; Rinne, Glenn A.; Batchelor, William E., Methods of forming electronic structures including conductive shunt layers and related structures.
    상세보기
  20. Mis, J. Daniel; Adema, Gretchen; Bumgarner, Susan; Chilukuri, Pooja; Rinne, Christine; Rinne, Glenn, Methods of forming lead free solder bumps.
    상세보기
  21. Jan,Jong Rong; Lu,Tsai Hua; Chiu,Sao Ling; Kung,Ling Chen, Methods of selectively bumping integrated circuit substrates and related structures.
    상세보기
  22. Wong, Andre; Bajwa, Sukbhir, Mounted semiconductor device and a method for making the same.
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  23. Batchelor, William E.; Rinne, Glenn A., Non-Circular via holes for bumping pads and related structures.
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  24. Rinne,Glenn A., Optical structures including liquid bumps and related methods.
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  25. Chakravarti, Ashima B.; Chou, Anthony I.; Furukawa, Toshiharu; Holmes, Steven J.; Natzle, Wesley C., Selective deposition of germanium spacers on nitride.
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  26. Chakravarti, Ashima B.; Chou, Anthony I.; Furukawa, Toshiharu; Holmes, Steven J.; Nazle, Wesley C., Selective deposition of germanium spacers on nitride.
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  27. Chakravarti, Ashima; Chou, Anthony; Furukawa, Toshiharu; Holmes, Steven; Natzle, Wesley, Selective deposition of germanium spacers on nitride.
    상세보기
  28. Makoto Kitano JP; Michiharu Honda JP, Semiconductor device-mounting construction and inspection method therefor.
    상세보기
  29. Kasem,Mohammed; Owyang,King; Kuo,Frank; Jaunay,Serge Robert; Mao,Sen; Ou,Oscar; Wang,Peter; Chen,Chang Sheng, Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys.
    상세보기
  30. Mis, J. Daniel; Adema, Gretchen; Bumgarner, Susan; Chilukuri, Pooja; Rinne, Christine; Rinne, Glenn, Solder structures including barrier layers with nickel and/or copper.
    상세보기
  31. Eriksen,Odd Harald Steen; Childress,Kimiko Jane, Substrate with adhesive bonding metallization with diffusion barrier.
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  32. Eriksen, Odd Harald Steen; Childress, Kimiko J.; Guo, Shuwen, Transducer for use in harsh environments.
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  33. Eriksen, Odd Harald Steen; Childress, Kimiko J.; Guo, Shuwen, Transducer with fluidly isolated connection.
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  34. Eriksen, Odd Harald Steen; Guo, Shuwen; Childress, Kimiko, Transient liquid phase eutectic bonding.
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  35. Baker, Jay DeAvis; Kneisel, Lawrence Leroy; Paruchuri, Mohan R.; Reddy, Prathap Amervai; Jairazbhoy, Vivek Amir, Void-free die attachment method with low melting metal.
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