$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Spreading resistance profiling system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-027/00
출원번호 US-0890775 (1997-07-11)
발명자 / 주소
  • Mazur Robert G.
  • Stephenson Robert C.
  • Andy Mark J.
  • Hartford Catherine L.
  • Rogers John R.
출원인 / 주소
  • Solid State Measurements, Inc.
대리인 / 주소
    Webb Ziesenheim Logsdon Orkin & Hanson, P.C.
인용정보 피인용 횟수 : 97  인용 특허 : 6

초록

A system for automatic spreading resistance profiling of wafer specimens. The system comprises a positioning stage for positioning the specimens for contact by probe tips and alternately a probe conditioning fixture or a sample calibration fixture. The system further comprises a programmed computer

대표청구항

[ What is claimed is:] [1.] A system for automatic spreading resistance profiling of one or a plurality of wafer specimens that have been prepared with a beveled surface and original surface intersecting at an edge comprising:a resistance measuring unit including positive and negative voltage probe

이 특허에 인용된 특허 (6)

  1. Yu Nu,JPX ; Sugiyama Tsunetoshi,JPX ; Ogura Shizuo,JPX ; Takano Yusuke,JPX, Apparatus for detecting defects of wiring board.
  2. Bachmann Walter A. (Sunnyvale CA) Hale Peggy A. (Ben Lomond CA), Array spreading resistance probe (ASRP) method for profile extraction from semiconductor chips of cellular construction.
  3. Davidson David L. ; Seida Steven B., Biaxial non-contacting strain measurement using machine vision.
  4. Betsui Keiichi (Kawasaki JPX), Charged particle beam deflector.
  5. Yokota Keiichi (Nirasaki JPX) Takebuchi Ryuichi (Yamanashi JPX), Method of positioning objects to be measured.
  6. Jaggi Bruno (2180 Trafalgar Street Vancouver ; British Columbia CAX V6K 4M8) Deen Mohammed J. (School of Engineering Design ; Simon Fraser Univ. Burnaby ; B.C. CAX V5A 1S6) Palcic Branko (6012 Adera , Quantitative light microscope using a solid state detector in the primary image plane.

이 특허를 인용한 특허 (97)

  1. Strid, Eric; Gleason, K. Reed, Active wafer probe.
  2. Strid,Eric; Gleason,K. Reed, Active wafer probe.
  3. Umezu,Satoshi; Miyajima,Jun; Yamaguchi,Takahiro; Arakawa,Norio, Adapter for controlling a measuring device, a measuring device, a controller for a measuring device, a method for processing measurement and a recording medium.
  4. Strid, Eric; Campbell, Richard, Calibration structures for differential signal probing.
  5. Swart Mark A., Camera system for automated verification and repair station.
  6. Dunklee, John, Chuck for holding a device under test.
  7. Dunklee, John, Chuck for holding a device under test.
  8. Dunklee, John, Chuck for holding a device under test.
  9. Dunklee,John, Chuck for holding a device under test.
  10. Dunklee,John, Chuck for holding a device under test.
  11. Dunklee,John, Chuck for holding a device under test.
  12. Stewart, Craig; Lord, Anthony; Spencer, Jeff; Burcham, Terry; McCann, Peter; Jones, Rod; Dunklee, John; Lesher, Tim; Newton, David, Chuck for holding a device under test.
  13. Stewart,Craig; Lord,Anthony; Spencer,Jeff; Burcham,Terry; McCann,Peter; Jones,Rod; Dunklee,John; Lesher,Tim; Newton,David, Chuck for holding a device under test.
  14. Andrews, Peter; Froemke, Brad; Dunklee, John, Chuck with integrated wafer support.
  15. Andrews,Peter; Froemke,Brad; Dunklee,John, Chuck with integrated wafer support.
  16. Andrews,Peter; Froemke,Brad; Dunklee,John, Chuck with integrated wafer support.
  17. Campbell, Richard; Strid, Eric W.; Andrews, Mike, Differential signal probe with integral balun.
  18. Strid, Eric; Campbell, Richard, Differential signal probing system.
  19. Campbell, Richard L.; Andrews, Michael, Differential waveguide probe.
  20. Burcham, Terry; McCann, Peter; Jones, Rod, Double sided probing structures.
  21. Burcham,Terry; McCann,Peter; Jones,Rod, Double sided probing structures.
  22. Dunklee, John; Norgden, Greg; Cowan, C. Eugene, Guarded tub enclosure.
  23. Dunklee,John; Norgden,Greg; Cowan,C. Eugene, Guarded tub enclosure.
  24. Slife, Russell P.; Jenkins, James R.; Jessen, Roger A.; Fowler, Ronald D., Head stack assembly installation system for a disc drive.
  25. Andrews, Peter; Hess, David; New, Robert, Interface for testing semiconductors.
  26. McFadden,Bruce, Localizing a temperature of a device for testing.
  27. Gleason, K. Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  28. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  29. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing structure with laterally scrubbing contacts.
  30. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing system.
  31. Smith,Kenneth; Gleason,Reed, Membrane probing system.
  32. Smith,Kenneth; Gleason,Reed, Membrane probing system.
  33. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
  34. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.
  35. Slife, Russell P.; Jenkins, James R.; Jessen, Roger A.; Fowler, Ronald D., Method for controlling installation of a head stack assembly.
  36. Hayden, Leonard; Martin, John; Andrews, Mike, Method of assembling a wafer probe.
  37. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method of constructing a membrane probe.
  38. Smith, Kenneth R., Method of replacing an existing contact of a wafer probing assembly.
  39. Yu Warren T., Method of using critical dimension mapping to qualify a new integrated circuit fabrication tool set.
  40. Strid,Eric; Campbell,Richard, On-wafer test structures for differential signals.
  41. Harris,Daniel L.; McCann,Peter R., Optical testing device.
  42. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  43. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  44. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  45. Campbell,Richard L.; Andrews,Michael; Bui,Lynh, Probe for high frequency signals.
  46. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Probe for testing a device under test.
  47. Smith, Kenneth; Jolley, Michael; Van Syckel, Victoria, Probe head having a membrane suspended probe.
  48. Smith,Kenneth; Jolley,Michael; Van Syckel,Victoria, Probe head having a membrane suspended probe.
  49. Schwindt,Randy, Probe holder for testing of a test device.
  50. Nordgren, Greg; Dunklee, John, Probe station.
  51. Nordgren, Greg; Dunklee, John, Probe station.
  52. Peters, Ron A.; Hayden, Leonard A.; Hawkins, Jeffrey A.; Dougherty, R. Mark, Probe station having multiple enclosures.
  53. Peters,Ron A.; Hayden,Leonard A.; Hawkins,Jeffrey A.; Dougherty,R. Mark, Probe station having multiple enclosures.
  54. Peters,Ron A.; Hayden,Leonard A.; Hawkins,Jeffrey A.; Dougherty,R. Mark, Probe station having multiple enclosures.
  55. Cowan, Clarence E.; Tervo, Paul A.; Dunklee, John L., Probe station thermal chuck with shielding for capacitive current.
  56. Cowan,Clarence E.; Tervo,Paul A.; Dunklee,John L., Probe station thermal chuck with shielding for capacitive current.
  57. Cowan,Clarence E.; Tervo,Paul A.; Dunklee,John L., Probe station thermal chuck with shielding for capacitive current.
  58. Dunklee,John; Cowan,Clarence E., Probe station with low inductance path.
  59. Dunklee,John; Cowan,Clarence E., Probe station with low inductance path.
  60. Lesher, Timothy; Miller, Brad; Cowan, Clarence E.; Simmons, Michael; Gray, Frank; McDonald, Cynthia L., Probe station with low noise characteristics.
  61. Lesher,Timothy; Miller,Brad; Cowan,Clarence E.; Simmons,Michael; Gray,Frank; McDonald,Cynthia L., Probe station with low noise characteristics.
  62. Lesher,Timothy; Miller,Brad; Cowan,Clarence E.; Simmons,Michael; Gray,Frank; McDonald,Cynthia L., Probe station with low noise characteristics.
  63. Navratil,Peter; Froemke,Brad; Stewart,Craig; Lord,Anthony; Spencer,Jeff; Runbaugh,Scott; Fisher,Gavin; McCann,Pete; Jones,Rod, Probe station with two platens.
  64. Lesher, Timothy E., Probe testing structure.
  65. Lesher,Timothy E., Probe testing structure.
  66. Smith, Kenneth R.; Hayward, Roger, Probing apparatus with impedance optimized interface.
  67. Morgan, Donald M., Programmable voltage divider and method for testing the impedance of a programmable element.
  68. Smith, Kenneth R., Replaceable coupon for a probing apparatus.
  69. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for high-frequency testing of a device under test.
  70. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Shielded probe for testing a device under test.
  71. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  72. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  73. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  74. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  75. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  76. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe with low contact resistance for testing a device under test.
  77. Dunklee,John, Switched suspended conductor and connection.
  78. Dunklee,John, Switched suspended conductor and connection.
  79. Strid,Eric W.; Schappacher,Jerry B.; Carlton,Dale E.; Gleason,K. Reed, System for evaluating probing networks.
  80. Strid,Eric W.; Schappacher,Jerry B.; Carlton,Dale E.; Gleason,K. Reed, System for evaluating probing networks.
  81. Singh, Bhanwar; Templeton, Michael K.; Subramanian, Ramkumar, System for monitoring and analyzing diagnostic data of spin tracks.
  82. Andrews, Peter; Hess, David, System for testing semiconductors.
  83. Negishi, Kazuki; Hansen, Mark, Test apparatus for measuring a characteristic of a device under test.
  84. Campbell, Richard, Test structure and probe for differential signals.
  85. Campbell,Richard, Test structure and probe for differential signals.
  86. Rumbaugh,Scott, Thermal optical chuck.
  87. Rumbaugh,Scott, Thermal optical chuck.
  88. Hayden, Leonard; Martin, John; Andrews, Mike, Wafer probe.
  89. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  90. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  91. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  92. Schwindt, Randy J.; Harwood, Warren K.; Tervo, Paul A.; Smith, Kenneth R.; Warner, Richard H., Wafer probe station having a skirting component.
  93. Schwindt,Randy J.; Harwood,Warren K.; Tervo,Paul A.; Smith,Kenneth R.; Warner,Richard H., Wafer probe station having a skirting component.
  94. Schwindt,Randy J.; Harwood,Warren K.; Tervo,Paul A.; Smith,Kenneth R.; Warner,Richard H., Wafer probe station having a skirting component.
  95. Harwood, Warren K.; Tervo, Paul A.; Koxxy, Martin J., Wafer probe station having environment control enclosure.
  96. Harwood,Warren K.; Tervo,Paul A.; Koxxy,Martin J., Wafer probe station having environment control enclosure.
  97. Campbell, Richard, Wideband active-passive differential signal probe.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로