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Polishing composition including an inhibitor of tungsten etching 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0086659 (1998-05-29)
발명자 / 주소
  • Grumbine Steven K.
  • Streinz Christopher C.
  • Hoglund Eric W.G.
출원인 / 주소
  • Cabot Corporation
인용정보 피인용 횟수 : 76  인용 특허 : 25

초록

A chemical mechanical polishing composition comprising a composition capable of etching tungsten and at least one inhibitor of tungsten etching and methods for using the composition to polish tungsten containing substrates.

대표청구항 ▼

[ What we claim is:] [1.] A chemical mechanical polishing composition comprising:a compound that is capable of etching tungsten; andat least one inhibitor of tungsten etching, wherein the inhibitor of tungsten etching is a compound that includes a nitrogen containing functional group selected from c

이 특허에 인용된 특허 (25)

  1. Sakatani Yoshiaki,JPX ; Ueda Kazumasa,JPX ; Takeuchi Yoshiaki,JPX, Abrasive composition and use of the same.
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  2. Rooney Terence R. (Bromsgrove GB2), Aluminum polishing compositions.
    상세보기
  3. Payne Charles C. (Aurora IL), Aqueous silica compositions for polishing silicon wafers.
    상세보기
  4. Ferrante Mario (Laxou FRX) Boucher Raymond (Villers Les Nancy FRX), Automated process for the manufacture of flexible plates and apparatus for implementing the process.
    상세보기
  5. Mueller Brian L. ; Streinz Christopher C. ; Grumbine Steven K., Composition and slurry useful for metal CMP.
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  6. Brancaleoni Gregory (Newark DE) Cook Lee M. (Steelville PA), Compositions and methods for polishing.
    상세보기
  7. Brancaleoni Gregory (Newark DE) Cook Lee M. (Steelville PA), Compositions and methods for polishing.
    상세보기
  8. Romberger John A. (Oak Park IL) Payne Charles C. (Aurora IL), Low sodium, low metals silica polishing slurries.
    상세보기
  9. James Kristi L. (Phoenix AZ) Shields A. L. (Scottsdale AZ), Metal etch solution and method.
    상세보기
  10. Allman Derryl D. J. (Colorado Springs CO), Method for polishing a wafer.
    상세보기
  11. Yu Chris C. (Boise ID) Doan Trung T. (Boise ID) Laulusa Alan E. (Boise ID), Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing.
    상세보기
  12. Doan Trung T. (Boise ID), Method of etching back of tungsten layers on semiconductor wafers, and solution therefore.
    상세보기
  13. Knotter Dirk M. (Eindhoven NLX) Wijdenes Jacob (Eindhoven NLX), Method of manufacturing a thin silicon-oxide layer.
    상세보기
  14. Sandhu Gurtej S. (Boise ID), Method of performing a field implant subsequent to field oxide fabrication by utilizing selective tungsten deposition to.
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  15. Obeng Yaw Samuel, Method of polishing.
    상세보기
  16. Krishna Vepa (St. Charles MO) Wisnieski Michael S. (O\Fallon MO) Illig Lois (Troy MO), Method of rough polishing semiconductor wafers to reduce surface roughness.
    상세보기
  17. Farkas Janos (Austin TX) Jairath Rahul (Austin TX) Stell Matt (Folsom CA) Tzeng Sing-Mo (Austin TX), Method of using additives with silica-based slurries to enhance selectivity in metal CMP.
    상세보기
  18. Kaufman Vlasta Brusic ; Wang Shumin, Multi-oxidizer slurry for chemical mechanical polishing.
    상세보기
  19. Skrovan John ; Robinson Karl M., Planarization slurry including a dispersant and method of using same.
    상세보기
  20. Sasaki Yasutaka,JPX ; Hayasaka Nobuo,JPX ; Kaneko Hisashi,JPX ; Hirabayashi Hideaki,JPX ; Higuchi Masatoshi,JPX, Polishing agent and polishing method using the same.
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  21. Kodama Hitoshi (Aichi-ken JPX) Iwasa Shoji (Aichi-ken JPX), Polishing composition.
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  22. Payne Charles C. (Chicago IL), Process for polishing semi-conductor materials.
    상세보기
  23. Payne Charles C. (Aurora IL), Silica sol compositions for polishing silicon wafers.
    상세보기
  24. Cadien Kenneth C. (Portland OR) Feller Daniel A. (Portland OR), Slurries for chemical mechanical polishing.
    상세보기
  25. Ericson ; Harry ; Fredriksson ; Carl Otto, Solutions for chemically polishing surfaces of copper and its alloys.
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이 특허를 인용한 특허 (76)

  1. Raman, Vijay Immanuel; Gubaydullin, Ilshat; Brands, Mario; Li, Yuzhuo; Peretolchin, Maxim, Aqueous polishing agent and graft copolymers and their use in a process for polishing patterned and unstructured metal surfaces.
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  6. Gagliardi, John J.; Savu, Patricia M., Chemical mechanical planarization composition, system, and method of use.
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  7. Guo, Yi; Lavoie, Jr., Raymond L., Chemical mechanical polishing composition and method for polishing tungsten.
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  8. Ho, Lin-Chen; Tsai, Wei-Wen; Lee, Cheng-Ping, Chemical mechanical polishing method for tungsten.
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  10. Wang,Shumin; Kaufman,Vlasta Brusic, Chemical mechanical polishing systems and methods for their use.
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  11. Schubert, Markus; Thate, Sven, Chemical-mechanical polishing composition comprising metal-organic framework materials.
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  12. Her, Yie-Shein; Srinivasan, Ramanathan; Babu, Suryadevara; Ramarajan, Suresh, Chemical-mechanical polishing slurry and method.
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  14. Paul M. Feeney ; Timothy C. Krywanczyk ; Lawrence D. David ; Matthew T. Tiersch ; Eric J. White, Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers.
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  15. Fang, Mingming; Mueller, Brian L.; Dirksen, James A., Composition and method for planarizing surfaces.
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  20. Grover, Gautam S.; Mueller, Brian L.; Wang, Shumin, Composition for oxide CMP.
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  22. Grumbine, Steven; Dysard, Jeffrey; Fu, Lin; Ward, William; Whitener, Glenn, Composition for tungsten CMP.
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  27. Siddiqui, Junaid Ahmed; Castillo, Daniel Hernandez; Aragaki, Steven Masami; Richards, Robin Edward, Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers.
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