초록 ▼

A method of improving the physical and/or electrical and/or magnetic properties of a thin film material formed on a substrate, wherein the properties of the thin film material are stress-dependent, by selectively applying force to the substrate during the film formation and/or thereafter during the

A method of improving the physical and/or electrical and/or magnetic properties of a thin film material formed on a substrate, wherein the properties of the thin film material are stress-dependent, by selectively applying force to the substrate during the film formation and/or thereafter during the cooling of the film in the case of a film formed at elevated temperature, to impose through the substrate an applied force condition opposing or enhancing the retention of stress in the product film. The method of the invention has particular utility in the formation of ferroelectric thin films which are grown at temperature above the Curie temperature, and which may be placed in tension during the cooling of the film to provide ferroelectric domains with polarization in the plane of the film.

대표청구항 ▼

[ What is claimed is:] [1.] A method of improving the physical and/or electrical properties and/or magnetic properties of a product film formed on a substrate by deposition on the substrate of film-forming material for the product film, wherein said properties of the product film are stress-dependen

[ What is claimed is:] [1.] A method of improving the physical and/or electrical properties and/or magnetic properties of a product film formed on a substrate by deposition on the substrate of film-forming material for the product film, wherein said properties of the product film are stress-dependent, comprising applying force to the substrate during the deposition thereon of the film-forming material and/or during the cooling of the deposited film-forming material from an elevated deposition temperature at which the film-forming material is deposited in the case of a product film formed by depositing the film-forming material at elevated temperature, wherein said force is of a magnitude and directional character to impose through the substrate an applied force condition yielding a retention of stress in the product film in opposition to the applied force condition.