초록 ▼

A body implantable pressure sensor attached to an endocardial lead for implantation in a heart chamber or cardiac blood vessel for sensing blood pressure and providing blood pressure signals to an implanted or external hemodynamic monitor and/or therapy delivery device and method of fabrication ther

A body implantable pressure sensor attached to an endocardial lead for implantation in a heart chamber or cardiac blood vessel for sensing blood pressure and providing blood pressure signals to an implanted or external hemodynamic monitor and/or therapy delivery device and method of fabrication thereof. A pressure sensor module is formed of an elongated receptacle having an elongated receptacle cavity for receiving a calibrated, micro-machined pressure transducer having a pressure responsive element. The receptacle cavity is covered by a diaphragm disposed alongside the lead body and in parallel with the lead axis. The receptacle cavity is filled with a incompressible oil for transferring pressure forces that are applied to the diaphragm to the pressure transducer. The oil is introduced through a fill port, and the fill port is sealed after the oil is introduced to prevent leakage of the oil from the receptacle cavity and to complete the hermetic sealing of the receptacle cavity. The fill port further comprises a fill tube having a fill tube lumen extending outward of an end wall of the receptacle cavity to a fill tube end, and said sealing step further comprises the steps of crimping or otherwise obstructing the fill tube end to close the fill tube lumen, fitting a fill port cover having an abutting edge over the crimped fill tube end and against the end wall of the receptacle to enclose the sealed fill tube end within a fill port cover cavity, and sealing the abutting edge against the receptacle end wall to hermetically enclose the sealed fill tube end within the fill port cover cavity.

대표청구항 ▼

[ What is claimed is:] [1.]1. A method of manufacturing an implantable pressure sensor mounted on a lead comprising the steps of:providing an elongated lead body having a lead body axis and a distal location for attachment with a pressure sensor module, said lead body having at least one lead conduc

[ What is claimed is:] [1.]1. A method of manufacturing an implantable pressure sensor mounted on a lead comprising the steps of:providing an elongated lead body having a lead body axis and a distal location for attachment with a pressure sensor module, said lead body having at least one lead conductor;forming a pressure sensor module comprising the further steps of:forming an elongated receptacle having an elongated receptacle cavity for receiving a calibrated, micro-machined pressure sensor transducer having a pressure responsive element, said receptacle formed of a base, oppositely disposed side walls and oppositely disposed end walls extending away from said base to form an opening frame adapted to be covered by a cover extending in parallel with said lead body axis;forming a fill port having a fill tube including a fill tube lumen extending outward from one of said end walls of said receptacle to a fill tube end;providing at least one electrical connector element extending into said receptacle cavity;disposing said pressure sensor within said receptacle cavity;electrically connecting said pressure sensor to said electrical connector element;sealing a diaphragm against said opening frame to enclose said receptacle cavity after said pressure sensor whereby said diaphragm is disposed along one side of the lead body at said distal location;filling said receptacle cavity via said fill port with an incompressible fluid for transmitting pressure applied outside said receptacle against said diaphragm to the pressure responsive element of said pressure sensor;closing said fill tube end to prevent leakage of said incompressible fluid from said receptacle cavity;fitting a fill port cover having an abutting edge over said crimped fill tube end and against one of said end walls to enclose said crimped fill tube end within a fill port cover cavity;sealing said abutting edge against said one of said end walls to hermetically enclose said crimped fill tube end within said fill port cover cavity; andattaching the pressure sensor module to the distal location of the lead body with said diaphragm disposed alongside said lead body and in parallel with said lead axis.