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An edge handling chuck which operates to maintain a semiconductor wafer at a desirable orientation while rotating the wafer at high speeds is disclosed. The edge handling chuck consists of a cylindrical plate which holds a silicon wafer using multiple spring loaded edge wafer clamps. Gas passes thro

An edge handling chuck which operates to maintain a semiconductor wafer at a desirable orientation while rotating the wafer at high speeds is disclosed. The edge handling chuck consists of a cylindrical plate which holds a silicon wafer using multiple spring loaded edge wafer clamps. Gas passes through a center hole in the cylindrical plate and is dispersed to the atmosphere using multiple pressure relief openings in the cylindrical plate. The purpose of this gas arrangement is to stabilize the wafer due to spinning vortex effects. The cylindrical plate has mounted therein an ertalyte ring which provides an area of angled contact for the wafer. The gas arrangement operates to pass gas to the slight space between the semiconductor wafer and the cylindrical plate, thereby contacting a lower surface of the wafer, and subsequently out of the arrangement using the pressure relief holes. The pressure for the arrangement is chosen to provide sufficient force to flatten the wafer and counter the top pressure caused by the spinning vortex.

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An edge handling chuck which operates to maintain a semiconductor wafer at a desirable orientation while rotating the wafer at high speeds is disclosed. The edge handling chuck consists of a cylindrical plate which holds a silicon wafer using multiple spring loaded edge wafer clamps. Gas passes thro

An edge handling chuck which operates to maintain a semiconductor wafer at a desirable orientation while rotating the wafer at high speeds is disclosed. The edge handling chuck consists of a cylindrical plate which holds a silicon wafer using multiple spring loaded edge wafer clamps. Gas passes through a center hole in the cylindrical plate and is dispersed to the atmosphere using multiple pressure relief openings in the cylindrical plate. The purpose of this gas arrangement is to stabilize the wafer due to spinning vortex effects. The cylindrical plate has mounted therein an ertalyte ring which provides an area of angled contact for the wafer. The gas arrangement operates to pass gas to the slight space between the semiconductor wafer and the cylindrical plate, thereby contacting a lower surface of the wafer, and subsequently out of the arrangement using the pressure relief holes. The pressure for the arrangement is chosen to provide sufficient force to flatten the wafer and counter the top pressure caused by the spinning vortex. , wherein said polyacid is maleic acid, said polyol is triethanolamine, said reaction product is triethanolamine maleic acid ester, and said co-binder solution includes a maleic anhydride polyacrylic acid triethanolamine polyester co-binder. 8. The method of claim 1, wherein said period of time is from 10 to 300 minutes. 9. The method of claim 1, wherein said polycarboxylic acid binder is terminated by sodium hypophosphite. 10. The method of claim 1, wherein said cure temperature is approximately 150° C. 11. A method of forming a formaldehyde free polycarboxylic acid based co-binder solution comprising the steps of: admixing a polyacid monomer or oligomer having at least two carboxylic acids and a molecular weight of 1000 or less, a polyol having at least two hydroxyl groups, and a polycarboxylic acid binder with agitation to form an admixture; heating said admixture for a period of time sufficient to form a co-binder solution having a reduced viscosity and a reduced cure temperature of approximately 150° C. 12. The method of claim 11, wherein said polyacid monomer or oligomer is selected from the group consisting of maleic acid, maleic anhydride, fumaric acid, succinic acid, succinic anhydride, citric acid, tartaric acid, adipic acid, glutaric acid, itaconic acid, trimellitic acid, hemimellitic acid, trimesic acid, tricarballylic acid, 1,2,3,4-butanetetracarboxylic acid, pyromellitic acid, oligomers of carboxylic acid, acrylic acid, vinyl acetate and any combination thereof. 13. The method of claim 11, wherein said polyol is selected from the group consisting of triethanolamine, glycerine, ethylene glycol, pentaerythritol, trimethylol propane, sorbitol, sucrose, glucose, resorcinol, catechol, pyrogallol, 1,4-cyclohexane diol, monoethanolamine and diethanolamine. 14. The method of claim 11, wherein said polycarboxylic acid binder has a pH of 1.5-4.5. 15. The method of claim 11, wherein said polyacid is maleic acid, said polyol is triethanolamine, said reaction product is triethanolamine maleic acid ester, and said co-binder solution includes a maleic anhydride polyacrylic acid triethanolamine polyester co-binder. 16. The method of claim 11, wherein said period of time is from 10 to 300 minutes. 17. The method of claim 11, wherein said polycarboxylic acid binder is terminated by sodium hypophosphite. 18. A composition for forming a formaldehyde free co-binder solution comprising: a polyacid monomer or oligomer having at least two carboxyl groups and a molecular weight of less than 1000; a polyol having at least three hydroxyl groups; and a polycarboxylic acid binder having a pH of from 1.5-4.5; wherein an active hydroxyl group to acid group molar ratio is from 0.2-1.5. 19. The composition of claim 18, wherein said polyol is reactive with an ester group to form an ester linkage. 20. The composition of claim 19, wherein said polyol is selected from the group consisting of triethanolamine, glycerine, ethylene glycol, pentaerythritol, trimethylol propane, sorbitol, sucrose, glucose, resorcinol, catechol, pyrogallol, 1,4-cyclohexane diol, monoethanolamine and diethanolamine. 21. The composition of claim 18, wherein said polyacid monomer or oligomer is selected from the group consisting of maleic acid, maleic anhydride, fumaric acid, succinic acid, succinic anhydride, citric acid, tartaric acid, itaconic acid, trimellitic acid, hemimellitic acid, trimesic acid, tricarballylic acid, 1,2,3,4-butanetetracarboxylic acid, pyromellitic acid, oligomers of carboxylic acid, acrylic acid, vinyl acetate and any combination thereof. 22. The composition of claim 18, wherein an amount of said polyacid and said polyol present in said composition is up to 90% of the total composition. 23. The composition of claim 18, wherein said polycarboxylic acid binder is terminated by sodium hypophosphite. 24. The composition of claim 18, further comprising an accelerator to aid in curing of said co-binder.