초록 ▼

A method of forming a via hole through a glass wafer includes depositing a material layer on an outer surface of the glass wafer, the material layer having a selection ratio higher than that of the glass wafer, forming a via-patterned portion on one side of the material layer, performing a first etc

A method of forming a via hole through a glass wafer includes depositing a material layer on an outer surface of the glass wafer, the material layer having a selection ratio higher than that of the glass wafer, forming a via-patterned portion on one side of the material layer, performing a first etching in which the via-patterned portion is etched to form a preliminary via hole, eliminating any remaining patterning material used in the formation of the via-patterned portion, performing a second etching in which the preliminary via hole is etched to form a via hole having a smooth surface and extending through the glass wafer, and eliminating the material layer. The method according to the present invention is able to form a via hole through a glass wafer without allowing formation of an undercut or minute cracks, thereby increasing the yield and reliability of MEMS elements.

대표청구항 ▼

What is claimed is: 1. A method of forming a via hole through a glass wafer, comprising: depositing a first material layer on front and rear surfaces of the glass wafer; depositing a second material layer on the first material layer; forming a via pattern in the second material layer; performing a

What is claimed is: 1. A method of forming a via hole through a glass wafer, comprising: depositing a first material layer on front and rear surfaces of the glass wafer; depositing a second material layer on the first material layer; forming a via pattern in the second material layer; performing a first etching using the via pattern to form a hole passing through the first material layer on the front surface of the glass wafer and a preliminary via hole in the glass wafer, wherein the preliminary via hole does not pass completely through the glass wafer; eliminating the second material layer; performing a second etching in which the preliminary via hole is etched to form a blind via hole having a smooth surface and extending through the glass wafer but not through the first material layer on the rear surface of the glass wafer, such that the first material layer on the rear surface of the glass wafer is exposed through the blind via hole; and eliminating the first material layer, such that the blind via hole is transformed into a through hole. 2. The method as claimed in claim 1, wherein the first material layer is formed of polysilicon. 3. The method as claimed in claim 1, wherein the first etching is performed by sandblasting. 4. The method as claimed in claim 1, wherein the first etching is performed by a device selected from the group consisting of: an ultrasonic wave, a drill, and a laser beam. 5. The method as claimed in claim 1, wherein, during the first etching, the glass wafer is etched to a sufficient depth so that the preliminary via hole has a bottom adjacent to the rear surface of the glass wafer. 6. The method as claimed in claim 1, wherein forming a via pattern in the second material layer further comprises: exposing and developing the second material to form the via pattern, wherein the second material is a film resistor. 7. The method as claimed in claim 6, wherein the film resistor comprises a material having a large resistance to sandblast etching to permit the film resistor to function as a protection film during subsequent sandblasting of the glass wafer. 8. The method as claimed in claim 1, wherein the second etching is a wet etching. 9. The method as claimed in claim 8, wherein the wet etching uses a hydrofluoric acid (HF) solution. 10. The method as claimed in claim 1, wherein the first material layer has a selection ratio higher than that of the glass wafer.