Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C25F-007/00
C25D-017/02
C25D-017/00
C25D-007/12
C25F-003/30
C25F-003/00
출원번호
US-0734100
(2003-12-11)
등록번호
US-7390382
(2008-06-24)
발명자
/ 주소
McHugh,Paul R.
Wilson,Gregory J.
Woodruff,Daniel J.
Zimmerman,Nolan
Erickson,James J.
출원인 / 주소
Semitool, Inc.
대리인 / 주소
Perkins Coie LLP
인용정보
피인용 횟수 :
5인용 특허 :
59
초록▼
Reactors having multiple electrodes and/or enclosed reciprocating paddles are disclosed. The reactor can include multiple electrodes spaced apart from a process location to provide virtual electrodes proximate to the process location for transferring material to or from the workpiece. A magnet may b
Reactors having multiple electrodes and/or enclosed reciprocating paddles are disclosed. The reactor can include multiple electrodes spaced apart from a process location to provide virtual electrodes proximate to the process location for transferring material to or from the workpiece. A magnet may be positioned proximate to the process plane to orient magnetically sensitive material deposited on the workpiece. The electrodes may be removable from the reactor without passing them through the magnet to reduce interference between the electrodes and the magnet. The workpiece may be carried by a rotatable workpiece support to orient the workpiece for processing. At least one of the electrodes can operate as a current thief to reduce terminal effects at the periphery of the workpiece. An electric field control element positioned between the electrodes and the workpiece circumferentially varies the effect of the thieving electrode current to account for effects created by elongated paddles as they oscillate proximate to the workpiece.
대표청구항▼
We claim: 1. A system for processing microfeature workpieces, comprising: a vessel configured to receive a processing fluid, the vessel having a process location positioned to receive a microfeature workpiece, the process location having a center; an electrode support positioned to carry at least o
We claim: 1. A system for processing microfeature workpieces, comprising: a vessel configured to receive a processing fluid, the vessel having a process location positioned to receive a microfeature workpiece, the process location having a center; an electrode support positioned to carry at least one electrode in fluid communication with the process location; a workpiece support positioned to carry a microfeature workpiece at the process location of the vessel; and an electric field control element positioned along a flow path between the electrode support and the process location, the electric field control element being configured to control an electrical current density in the processing fluid at the process location to have a first value at a first circumferential site of the process location and a second value different than the first value at a second circumferential site of the process location, the first and second circumferential sites being approximately the same distance from the center of the process location, wherein the vessel includes vanes aligned along axes extending between the electric field control element and the process location. 2. A system for processing microfeature workpieces, comprising: a vessel configured to receive a processing fluid, the vessel having a process location positioned to receive a microfeature workpiece, the process location having a center; an electrode support positioned to carry at least one electrode in fluid communication with the process location; a workpiece support positioned to carry a microfeature workpiece at the process location of the vessel; a paddle device having at least one paddle elongated along a paddle axis and movable relative to the process location along a motion axis transverse to the paddle axis; and an electric field control element positioned along a flow path between the electrode support and the process location, the electric field control element being configured to control an electrical current density in the processing fluid at the process location to have a first value at a first circumferential site of the process location generally aligned with the motion axis, and a second value less than the first value at a second circumferential site of the process location generally aligned with the paddle axis, the first and second circumferential sites being approximately the same distance from the center of the process location, wherein the vessel includes vanes aligned along axes extending between the electric field control element and the process location. 3. The system of claim 2 wherein: the workpiece support is positioned to carry the microfeature workpiece face-down in a generally horizontal orientation at the process location of the vessel during processing, the workpiece support being movable relative to the vessel between a load/unload position and a process position; the paddle device is positioned below the workpiece support and has at least one paddle, and wherein at least one of the workpiece support and the at least one paddle is movable relative to the other along a linear motion path while the workpiece support carries a microfeature workpiece; and the electrode support carries a thieving electrode in fluid communication with the process location, the thieving electrode being positioned along a flow path that includes a virtual thief location spaced apart from the process plane. 4. The system of claim 3, further comprising: a contact electrode carried by the workpiece support and positioned to make electrical contact with a microfeature workpiece when the workpiece support carries the microfeature workpiece; at least one anode spaced apart from the process location; and one or more power supplies coupled among the contact electrode, the thieving electrode and the at least one anode to provide current to the at least one anode at a potential greater than potentials provided to the thieving electrode and the contact electrode. 5. The system of claim 2 wherein the electrode support includes a plurality of electrode chambers at least partially separated from each other by dielectric barriers, gaps between the dielectric barriers forming a corresponding plurality of virtual electrode locations spaced apart from the process location. 6. The system of claim 5, further comprising a plurality of electrodes disposed in the corresponding plurality of electrode chambers. 7. The system of claim 2, further comprising an at least partially enclosed paddle chamber positioned between the electrode support and the process location, the paddle chamber housing the at least one paddle. 8. The system of claim 2 wherein the processing fluid is a first processing fluid, and wherein the system further comprises: a nozzle coupleable to a source of a second processing fluid and positioned above the process location to direct a stream of the second processing fluid toward a microfeature workpiece carried by the workpiece support. 9. The system of claim 8 wherein the workpiece support is movable between a first position to carry a microfeature workpiece in contact with the first processing fluid at the process location, and a second position above the first position to place the microfeature workpiece in a path of the stream of second processing fluid directed by the nozzle. 10. The system of claim 8 wherein the electrode support has a plurality of electrode chambers at least partially separated from each other by barriers, gaps between the barriers forming a corresponding plurality of virtual electrode locations spaced apart from the process location. 11. The system of claim 8, further comprising an at least partially enclosed paddle chamber positioned between the electrode support and the process location, the paddle chamber housing the at least one paddle. 12. The system of claim 2, further comprising an electrode thief spaced apart from the process location, the electrode thief being positioned in fluid communication with the process location to receive ions from the processing fluid that would otherwise attach to the microfeature workpiece. 13. The system of claim 2, further comprising: a magnet positioned to impose a magnetic field at the process location to orient material deposited on a microfeature workpiece; and wherein the electrode support is movable relative to the vessel between a process position and a removed position along a motion path that does not pass through the process plane. 14. The system of claim 13 wherein the magnet includes a permanent magnet. 15. The system of claim 2 wherein the electric field control element includes a slot having a first region with a first width and a second region with a second width greater than the first width. 16. The system of claim 2 wherein the electric field control element includes a plurality of apertures, with apertures in a first region of the electric field control element providing a first open area and apertures in a second region of the electric field control element providing a second open area greater than the first open area. 17. The system of claim 2 wherein the vessel includes a first portion and a second portion sealably coupled to the first portion, and wherein the electric field control element includes a gasket sealably positioned between the first and second portions. 18. The system of claim 2, further comprising: a paddle chamber in fluid communication with the vessel, the paddle chamber having an opening at the process location to receive a microfeature workpiece, and wherein the electric field control element forms a portion of the paddle chamber facing toward the opening, and wherein the paddle device is disposed in the paddle chamber. 19. The system of claim 2 wherein the electric field control element has a first flow-through area in regions aligned with the paddle axis and a second flow-through area greater than the first in regions aligned with the motion axis. 20. The system of claim 2 wherein: the workpiece support is positioned to carry the microfeature workpiece face-down in a generally horizontal orientation at the process location of the vessel, and to rotate the microfeature workpiece relative to the vessel, the workpiece support being movable relative to the vessel between a load/unload position and a process position. 21. The system of claim 2 wherein the at least one paddle includes a plurality of paddles having spaced apart paddle surfaces. 22. The system of claim 2 further comprising a magnet positioned at least proximate to the process location to orient magnetically sensitive material as it is deposited on the microfeature workpiece, and wherein the workpiece support is rotatable to orient the microfeature workpiece relative to the magnet for receiving the magnetically sensitive material.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (59)
Hurwitt Steven ; Jelinek Vaclav, Apparatus and method for clamping a substrate.
Berner Robert W. ; Fatula ; Jr. Joseph J. ; Hitzfeld Robert ; Contreras Richard ; Chiu Andrew, Cathode current control system for a wafer electroplating apparatus.
Hanson Kyle M. ; Haugan K. Chris ; Coyle Kevin W. ; Doolittle James ; Berner Robert W., Cathode current control system for a wafer electroplating apparatus.
Hanson Kyle M. ; Haugan K. Chris ; Coyle Kevin W. ; Doolittle James ; Berner Robert W., Cathode current control system for a wafer electroplating apparatus.
May Hans J. (Ulmenweg 17 D-58638 Iserlohn DEX) Schnettler Roland (Schwerter Str. 138 D-58099 Hagen DEX), Device for the electrolytic deposition of metal on metal strips.
Corbin ; Jr. William E. ; Datta Madhav ; Dinan Thomas E. ; Kern Frederick W., Electrochemical etching apparatus and method for spirally etching a workpiece.
Datta Madhav (Yorktown Heights NY) Romankiw Lubomyr T. (Briarcliff Manor NY), Electrochemical micromachining tool and process for through-mask patterning of thin metallic films supported by non-cond.
Inoue Satoshi,JPX ; Tanaka Toyoaki,JPX, Electrode assembly, cathode device and plating apparatus including an insulating member covering an internal circumferential edge of a cathode member.
Datta Madhav (Yorktown Heights NY) Shenoy Ravindra (Peekskill NY), Electroetching process for seed layer removal in electrochemical fabrication of wafers.
Brophy Denis J. (Staatsburg NY) Datta Madhav (Yorktown Heights NY) Harris Derek B. (Dryden NY) Ryan Frank S. (Boulder CO) Spera Frank A. (Poughkeepsie NY), Electroetching tool using localized application of channelized flow of electrolyte.
Schuster Virgil E. (Scottsdale) Asher ; Sr. Reginald K. (Scottsdale) Patel Bhagubhai D. (Tempe AZ), Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge.
Adams John A. ; Krulik Gerald A. ; Smith Everett D., Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly.
Thompson Raymon F. (Kalispell MT) Gordon Robert W. (Seattle WA) Durado Daniel (Kalispell MT), Method for single wafer processing in which a semiconductor wafer is contacted with a fluid.
Keigler Arthur, Method of and apparatus for controlling fluid flow and electric fields involved in the electroplating of substantially flat workpieces and the like and more generally controlling fluid flow in the pr.
Bacon Duane E. (Lee\s Summit MO) Hecox Spencer S. (Raytown MO), Methods of and apparatus for electroplating preselected surface regions of electrical articles.
Oberlitner, Thomas H.; Hanson, Kyle M., Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece.
Andricacos Panayotis (Croton-on-Hudson NY) Branger Moritz (Los Altos CA) Browne Robert M. (San Jose CA) Dukovic John O. (Pleasantville NY) Fu Benjamin W. B. (Cupertino CA) Hitzfeld Robert W. (San Jos, Multi-compartment eletroplating system.
Tzanavaras George (2674 Park Wilshire Dr. San Jose CA 95124) Cohen Uri (765 San Antonio Rd. ; #53 Palo Alto CA 94303), Precision high rate electroplating cell and method.
Arken David M. ; Chiu Andrew ; Fatula ; Jr. Joseph John ; Hitzfield Robert William ; Hsiao Wen-Chien David ; Hsiao Yiping, Rotary plater with radially distributed plating solution.
Brophy Denis J. (Staatsburg NY) Datta Madhav (Yorktown Heights NY) Harris Derek B. (Dryden NY) Ryan Frank S. (Boulder CO) Spera Frank A. (Poughkeepsie NY), Tool and method for electroetching.
Dinan Thomas E. (Poughkeepsie NY) Berridge Kirk G. (Fishkill NY) Datta Madhav (Yorktown Heights NY) Kanarsky Thomas S. (Hopewell Junction NY) Pike Michael B. (Hopewell Junction NY) Shenoy Ravindra V., Vertical electroetch tool nozzle and method.
Andricacos Panayotis C. (Croton-on-Hudson NY) Berridge Kirk G. (Fishkill NY) Dukovic John O. (Pleasantville NY) Flotta Matteo (Yorktown Heights NY) Ordonez Jose (Pleasant Valley NY) Poweleit Helmut R, Vertical paddle plating cell.
Van Valkenburg, Paul; Mikkola, Robert; Klocke, John L.; McHugh, Paul R.; Wilson, Gregory J.; Hanson, Kyle Moran; Bergman, Eric J., Adaptive electric field shielding in an electroplating processor using agitator geometry and motion control.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.