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[미국특허] Method of making pressure transducer and apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01L-009/04
출원번호 US-0810606 (2007-06-06)
등록번호 US-7412892 (2008-08-19)
발명자 / 주소
  • Gross,Chris
출원인 / 주소
  • Measurement Specialties, Inc.
대리인 / 주소
    Howard IP Law Group PC
인용정보 피인용 횟수 : 2  인용 특허 : 40

초록

A method for making a pressure transducer comprising: forming a recess in a diaphragm, the diaphragm having a thinned region that deflects responsively to pressure being applied thereto; depositing a glass frit in the recess; embedding a plurality of strain gages in the glass frit; and, wire bonding

대표청구항

What is claimed is: 1. A method for making a pressure transducer comprising: forming a recess in a diaphragm, the diaphragm having a thinned region that deflects responsively to pressure being applied thereto; depositing a glass frit in the recess; embedding a plurality of strain gages in the glass

이 특허에 인용된 특허 (40) 인용/피인용 타임라인 분석

  1. Chiesl, Newell E., Arrangement for measuring pressure on a semiconductor wafer and an associated method for fabricating a semiconductor wafer.
  2. Frick Roger L. (Chanhassen MN), Capacitive sensing cell made of brittle material.
  3. Choi,Won youl; Park,Keon yang; Koh,Byeong cheon; Kang,Myung sam; Na,Kyung won; Choi,Sang on, Fabricating method for a fluxgate sensor integrated in printed circuit board.
  4. Kurtz Anthony D. (Teaneck NJ) Ned Alexander A. (Bloomingdale NJ), Fusion bonding technique for use in fabricating semiconductor devices.
  5. Hynes, Eamon; Wynne, John, Integratable transducer structure.
  6. Kawate Keith W. (Attleboro Falls MA) Sabetti Anthony J. (Greenville RI), Low cost high precision sensor.
  7. Kawate Keith W. (Attleboro Falls MA) Sabetti Anthony J. (Greenville RI), Low cost high precision sensor.
  8. Kawate Keith W. (Attleboro Falls MA) Sabetti Anthony J. (Greenville RI), Low cost high precision sensor.
  9. Paolo Ferrari IT; Benedetto Vigna IT; Flavio Villa IT, Manufacturing method and integrated microstructures of semiconductor material and integrated piezoresistive pressure sensor having a diaphragm of polycrystalline semiconductor material.
  10. Diem Bernard,FRX ; Viollet-Bosson Sylvie,FRX ; Touret Patricia,FRX, Manufacturing process of strain gauge sensor using the piezoresistive effect.
  11. Fukada Tsuyoshi,JPX ; Kanosue Masakazu,JPX ; Ao Kenichi,JPX ; Murata Minoru,JPX ; Ishio Seiichiro,JPX, Method for fabrication of a semiconductor sensor.
  12. Paynter Bruce (Irvine CA) McCarrick Henry J. (Huntington Beach CA) Adamic ; Jr. Joseph W. (Fountain Valley CA), Method for making thin film piezoresistive sensor.
  13. Lee,Jin ho; Ko,Young chul; Kong,Do hyun, Method for manufacturing a micro-actuator.
  14. Kretschmann, Andre; Henn, Ralf; Wingsch, Volker, Method for manufacturing a thin-layer component, in particular a thin-layer high-pressure sensor.
  15. Benedetto Vigna IT; Paolo Ferrari IT; Flavio Villa IT, Method of fabricating a piezoresistive pressure sensor.
  16. Fukada Tsuyoshi (Kariya JPX), Method of forming a semiconductor strain sensor.
  17. Toda Risaku, Method of making small gaps for small electrical/mechanical devices.
  18. Marchant Robert B. ; Fazeli Majid, Method of making thin film piezoresistive sensor.
  19. Koch Daniel J. ; Hammond Jonathan H. ; Koury ; Jr. Daniel N. ; Gorrell Jonathan F., Method of manufacturing a sensor.
  20. Maki,Hiroshi; Suga,Hideyuki, Method of manufacturing semiconductor device.
  21. Katsumata, Takashi; Toyoda, Inao, Method of manufacturing semiconductor pressure sensor.
  22. Benz Gerhard (Boeblingen DEX) Marek Jiri (Reutlingen DEX) Bantien Frank (Ditzingen DEX) Muenzel Horst (Reutlingen DEX) Laermer Franz (Stuttgart DEX) Offenberg Michael (Tuebingen DEX) Schilp Andrea (S, Method of manufacturing sensor.
  23. Mushika,Yoshihiro, Microelectromechanical system and method for fabricating the same.
  24. Ikeda, Masaharu; Esashi, Masayoshi, Pressure transducer and manufacturing method thereof.
  25. Masaharu Ikeda JP; Masayoshi Esashi JP, Pressure transducer and manufacturing method thereof.
  26. Diem Bernard,FRX ; Delaye Marie-Therese,FRX, Pressure transducer comprising a sealed transducer with a rigid diaphragm.
  27. Mounteer Carlyle A. (Irvine CA) Poteet Ronald L. (San Juan Capistrano CA), Process for fabricating strain gage transducer.
  28. Kremidas James R. (Fenton MI), Resistive strain gauge pressure sensor.
  29. Ishio, Seiichiro, Semiconductor device and a method of producing the same.
  30. Okumura,Mika; Horikawa,Makio; Satou,Kimitoshi, Semiconductor device manufacturing method.
  31. Ferrari Paolo,ITX ; Foroni Mario,ITX ; Vigna Benedetto,ITX ; Villa Flavio,ITX, Semiconductor integrated capacitive acceleration sensor and relative fabrication method.
  32. Katsumata, Takashi; Toyoda, Inao; Tanaka, Hiroaki, Semiconductor pressure sensor.
  33. Watanabe Tatsuya,JPX ; Kudo Takahiro,JPX ; Ikeda Kyoichi,JPX, Semiconductor pressure sensor and its manufacturing method.
  34. Ishio, Seiichiro; Toyoda, Inao; Hamamoto, Kazuaki; Suzuki, Yasutoshi, Semiconductor pressure sensor having strain gauge and circuit portion on semiconductor substrate.
  35. Ishio Seiichiro,JPX ; Ao Kenichi,JPX ; Sugito Hiroshige,JPX, Semiconductor strain sensor.
  36. Chen, Shiuh-Hui Steven; Garza, Raymond; Ross, Carl; Turalski, Stefan, Semiconductor wafer having a thin die and tethers and methods of making the same.
  37. Wang, Hung-Dar; Gong, Shih-Chin, Silicon pressure sensor and the manufacturing method thereof.
  38. Gross, Chris, Silicon strain gage having a thin layer of highly conductive silicon.
  39. Shiuh-Hui Steven Chen ; Yanling Kang ; Sut-Mui Tang ; Joe P. Wang, Strain gauge.
  40. Foglietti,Vittorio; Cianci,Elena; Memmi,Daniele; Caliano,Giosu챕; Pappalardo,Massimo, Surface micromachining process for manufacturing electro-acoustic transducers, particularly ultrasonic transducers, obtained transducers and intermediate products.

이 특허를 인용한 특허 (2) 인용/피인용 타임라인 분석

  1. Chiou, Jen-Huang Albert; Chen, Shiuh-Hui Steven, Robust design of high pressure sensor device.
  2. Ding, Xiaoyi; Frye, Jeffrey James, Thin semiconductor die package.

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