초록 ▼

The embodiments of the invention describe a process chamber, such as an ALD chamber, that has gas delivery conduits with gradually increasing diameters to reduce Joule-Thompson effect during gas delivery, a ring-shaped gas liner leveled with the substrate support to sustain gas temperature and to re

The embodiments of the invention describe a process chamber, such as an ALD chamber, that has gas delivery conduits with gradually increasing diameters to reduce Joule-Thompson effect during gas delivery, a ring-shaped gas liner leveled with the substrate support to sustain gas temperature and to reduce gas flow to the substrate support backside, and a gas reservoir to allow controlled delivery of process gas. The gas conduits with gradually increasing diameters, the ring-shaped gas liner, and the gas reservoir help keep the gas temperature stable and reduce the creation of particles.

대표청구항 ▼

The invention claimed is: 1. An atomic layer deposition process chamber, comprising: a gas delivery assembly, comprising: a covering member; an expanding channel disposed at a central portion of the covering member, the expanding channel comprising a bottom surface extending from the expanding chan

The invention claimed is: 1. An atomic layer deposition process chamber, comprising: a gas delivery assembly, comprising: a covering member; an expanding channel disposed at a central portion of the covering member, the expanding channel comprising a bottom surface extending from the expanding channel to a peripheral portion of the covering member; a gas conduit having a first end, with a first diameter, connected to a gas inlet of the expanding channel, and a second end, with a second diameter, connected to a gas valve; and a gas reservoir having a first end and a second end, wherein a diameter of the first end of the gas reservoir is gradually and continuously reduced to a diameter of the gas valve that connects to the gas conduit and a diameter of the second end of the gas reservoir is gradually and continuously reduced to a diameter of a gas line that connects to a gas source; and a substrate support disposed below the covering member. 2. The chamber of claim 1, wherein the gas conduit is disposed normal to a longitudinal axis of the expanding channel. 3. The chamber of claim 1, wherein the expanding channel comprises a tapered surface extending from the central portion of the covering member to the peripheral portion of the covering member. 4. The chamber of claim 1, wherein there are four gas conduits equally spaced around a perimeter of the expanding channel. 5. The chamber of claim 1, wherein the first diameter of the gas conduit is greater than the second diameter of the gas conduit. 6. The chamber of claim 5, wherein the diameter of the gas conduit is gradually and continuously increased from the second diameter to the first diameter. 7. The chamber of claim 1, wherein the gas conduit is positioned at an angle from a center line of the expanding channel. 8. The chamber of claim 1, wherein the first end of the gas reservoir is at the same level as the gas conduit. 9. The chamber of claim 1, wherein the gas reservoir has a volume between about 80 cc to about 200 cc. 10. The chamber of claim 1, wherein the gas reservoir is formed by drilling out of a bulk body. 11. The chamber of claim 10, wherein the bulk body is made of thermal conductive materials. 12. The chamber of claim 11, wherein the thermal conductive materials is aluminum. 13. The chamber of claim 10, wherein the bulk body further comprises a heating medium buried therein. 14. The chamber of claim 10, wherein the bulk body is an aluminum sheet wrapped with a heating medium.