초록 ▼

A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member wh

A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.

대표청구항 ▼

What is claimed is: 1. A light emitting diode (LED) array module comprising:a plurality of LEDs;a substrate having a first surface and a second surface opposite the first surface, the plurality of LEDs disposed on the first surface;a cover disposed on the second surface, wherein the substrate compri

What is claimed is: 1. A light emitting diode (LED) array module comprising:a plurality of LEDs;a substrate having a first surface and a second surface opposite the first surface, the plurality of LEDs disposed on the first surface;a cover disposed on the second surface, wherein the substrate comprises:a first recess formed in the second surface; anda cooling passage member having a structure through which a cooling fluid can pass, the cooling passage member formed to contact a lower surface and a side surface of the first recess, and the cooling passage member bent to form a second recess, andwherein the cover disposed on the second surface encloses the second recess to generate a cavity-shaped heat radiation space between the cooling passage member and the cover, andthe cooling fluid is unable to pass through the cavity-shaped heat radiation space.