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A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorgano

A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.

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1. A composition prepared by mixing components comprising: (I) an alkenyl functional, phenyl-containing polyorganosiloxane having an average compositional formula given as R1aR2bSiO(4-a-b)/2 where R1 is an alkenyl group having 2 to 12 carbon atoms, each R2 is independently a methyl group or a phenyl

1. A composition prepared by mixing components comprising: (I) an alkenyl functional, phenyl-containing polyorganosiloxane having an average compositional formula given as R1aR2bSiO(4-a-b)/2 where R1 is an alkenyl group having 2 to 12 carbon atoms, each R2 is independently a methyl group or a phenyl group, at least 30 mol % of R2 are phenyl groups, a and b are positive numbers having values such that: a+b=1 to 2.2 and a/(a+b)=0.001 to 0.05;(II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having a molecular formula given as HR32SiO(SiPh2O)xSiR32H where Ph represents a phenyl group, each R3 is independently a methyl group or a phenyl group, x is an integer from 2 to 8, and x has an average value of 2 to 4; and(III) a hydrosilylation catalyst. 2. The composition of claim 1, where component (I) is selected from: ViMe2SiO(SiMePhO)nSiMe2Vi,ViMe2SiO(SiPh2O)nSiMe2Vi,ViMe2SiO(SiMe2O)n(SiMePhO)mSiMe2Vi,ViMe2SiO(SiMe2O)n(SiPh2O)mSiMe2Vi,HexMe2SiO(SiMePhO)nSiMe2Hex,HexMe2SiO(SiPh2O)nSiMe2Hex,HexMe2SiO(SiMe2O)n(SiMePhO)mSiMe2Hex,HexMe2SiO(SiMe2O)n(SiPh2O)mSiMe2Hex,ViMePhSiO(SiMePhO)nSiMePhVi,ViMePhSiO(SiPh2O)nSiMePhVi,ViMePhSiO(SiMe2O)n(SiMePhO)mSiMePhVi,ViMePhSiO(SiMe2O)n(SiPh2O)mSiMePhVi,ViMe2SiO(SiMePhO)n(SiMeViO)mSiMe2Vi,ViMe2SiO(SiMe2O)n(SiMePhO)m(SiMeViO)1SiMe2Vi,ViMe2SiO(SiMe2O)n(SiPh2O)m(SiMeViO)1SiMe2Vi,ViMePhSiO(SiMePhO)n(SiMeViO)mSiMePhVi,ViMePhSiO(SiMe2O)n(SiMePhO)m(SiMeViO)1SiMePhVi,ViMePhSiO(SiMe2O)n(SiPh2O)m(SiMeViO)1SiMePhVi,Me3SiO(SiMePhO)n(SiMeViO)mSiMe3,Me3SiO(SiMe2O)n(SiMePhO)m(SiMeViO)1SiMe3,Me3SiO(SiMe2O)n(SiPh2O)m(SiMeViO)1SiMe3,Me3SiO(SiMePhO)n(SiMeHexO)mSiMe3,Me3SiO(SiMe2O)n(SiMePhO)m(SiMeHexO)1SiMe3,Me3SiO(SiMe2O)n(SiPh2O)m(SiMeHexO)1SiMe3,(ViMe2SiO1/2)p(PhSiO3/2)q,(ViMe2SiO1/2)p(Me2SiO2/2)q(PhSiO3/2)r,(ViMe2SiO1/2)p(MePhSiO2/2)q(PhSiO3/2)r,(ViMe2SiO1/2)p(Ph2SiO2/2)q(PhSiO3/2)r,(ViMe2SiO1/2)p(MeSiO32)q(PhSiO3/2)r,(ViMe2SiO1/2)p(PhSiO3/2)q(SiO4/2)r,(HexMePhSiO1/2)p(PhSiO3/2)q,(ViMePhSiO1/2)p(PhSiO3/2)q,(ViMePhSiO1/2)p(Me2SiO2/2)q(PhSiO3/2)r,(ViMePhSiO1/2)p(MePhSiO2/2)q(PhSiO3/2)r,(ViMePhSiO1/2)p(Ph2SiO2/2)q(PhSiO3/2)r,(ViMePhSiO1/2)p(MeSiO3/2)q(PhSiO3/2)r,(ViMePhSiO1/2)p(PhSiO3/2)q(SiO4/2)r,(ViMePhSiO1/2)p(PhSiO3/2)q,(HexMe2SiO1/2)p(PhSiO3/2)q,(HexMe2SiO1/2)p(Me2SiO2/2)q(PhSiO3/2)r,(HexMe2SiO1/2)p(MePhSiO2/2)q(PhSiO3/2)r,(HexMe2SiO1/2)p(Ph2SiO2/2)q(PhSiO3/2)r,(HexMe2SiO1/2)p(MeSiO3/2)q(PhSiO3/2)r,(Me3SiO1/2)p(MeViSiO2/2)q(PhSiO3/2)r,(Me3SiO1/2)p(ViSiO3/2)q(PhSiO3/2)r,(Me3SiO1/2)p(MeViSiO2/2)q(PhSiO3/2)r,(ViMeSiO2/2)p(Me2SiO2/2)q(PhSiO3/2)r,(ViMeSiO2/2)p(MePhSiO2/2)q(PhSiO3/2)r,(ViMeSiO2/2)p(Ph2SiO2/2)q(PhSiO3/2)r,(ViMeSiO2/2)p(MeSiO3/2)q(PhSiO3/2)r,(ViMeSiO2/2)p(PhSiO3/2)q(SiO4/2)r,(ViMeSiO2/2)p(Me2SiO2/2)q(PhSiO3/2)r,(ViMeSiO2/2)p(MePhSiO2/2)q(PhSiO3/2)r,(HexMeSiO2/2)p(Ph2SiO2/2)q(PhSiO3/2)r,(HexMeSiO2/2)p(MeSiO3/2)q(PhSiO3/2)r,(HexMeSiO2/2)p(PhSiO3/2)q(SiO4/2)r, ora combination thereof,where n, m, l are positive numbers less than 200 that mean the average number of each monomer unit; and p, q, r, and s mean the average mol percentages of each monomer unit. 3. The composition of claim 2, further comprising a component selected from: (IV) a co-crosslinker (V) an adhesion promoter, (VI) a filler, (VII) treating agent, (VIII) an optically active agent, (IX) a cure modifier, (X) a rheology modifier, or a combination thereof. 4. A silicone product prepared by curing the composition of claim 2. 5. The composition of claim 1, where the composition contains 0.1% to 35% branched alkenyl functional, phenyl-containing polyorganosiloxane based on the weight of the composition. 6. The composition of claim 5, further comprising a component selected from: (IV) a co-crosslinker (V) an adhesion promoter, (VI) a filler, (VII) treating agent, (VIII) an optically active agent, (IX) a cure modifier, (X) a rheology modifier, or a combination thereof. 7. A silicone product prepared by curing the composition of claim 5. 8. The composition of claim 1, where component (II) is selected from: HMe2SiO(SiPh2O)xSiMe2H,HMePhSiO(SiPh2O)xSiMePhH, ora combination thereof. 9. The composition of claim 8, further comprising a component selected from: (IV) a co-crosslinker (V) an adhesion promoter, (VI) a filler, (VII) treating agent, (VIII) an optically active agent, (IX) a cure modifier, (X) a rheology modifier, or a combination thereof. 10. A silicone product prepared by curing the composition of claim 8. 11. The composition of claim 1, further comprising a component selected from: (IV) a co-crosslinker (V) an adhesion promoter, (VI) a filler, (VII) treating agent, (VIII) an optically active agent, (IX) a cure modifier, (X) a rheology modifier, or a combination thereof. 12. A silicone product prepared by curing the composition claim 1. 13. A device comprising: i) a semiconductor chip,ii) a lead frame;iii) a wire bonding the semiconductor chip to the lead frame, andiv) the silicone product of claim 12 coated over the semiconductor chip. 14. The device of claim 13, where the semiconductor chip is light emitting. 15. A composition prepared by mixing components comprising: (I) an Si—H functional, phenyl-containing polyorganosiloxane having an average compositional formula given as HaR2bSiO(4-a-b)/2 where each R2 is independently a methyl group or a phenyl group, at least 30 mol % of R2 are phenyl groups, a and b are positive numbers having values such that: a+b=1 to 2.2 and a/(a+b)=0.001 to 0.05;(II) an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having a molecular formula given as R1R32SiO(SiPh2O)xSiR32R where Ph represents a phenyl group, each R1 is independently an alkenyl group having 2 to 12 carbon atoms, each R3 is independently a methyl group or a phenyl group, x is an integer from 2 to 8, and x has an average value of 2 to 4; and(III) a hydrosilylation catalyst. 16. A multiple part composition having Part A and Part B, where Part A comprises:(I) an alkenyl functional, phenyl-containing polyorganosiloxane having an average compositional formula given as R1aR2bSiO(4-a-b)/2 where R1 is an alkenyl group having 2 to 12 carbon atoms, each R2 is independently a methyl group or a phenyl group, at least 30 mol % of R2 are phenyl groups, a and b are positive numbers having values such that: a+b=1 to 2.2 and a/(a+b)=0.001 to 0.05;(III) a hydrosilylation catalyst,optionally (V) an adhesion promoteroptionally (VI) a filler,optionally (VII) a treating agent,optionally (VIII) a cure modifier, and(IX) a rheology modifier;Part B comprisesoptionally (I) the alkenyl functional phenyl-containing polyorganosiloxane,(II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having a molecular formula given as HR32SiO(SiPh2O)xSiR32H where Ph represents a phenyl group, each R3 is independently a methyl group or a phenyl group, x is an integer from 2 to 8, and x has an average value of 2 to 4;optionally (IV) a co-crosslinker;optionally (V) an adhesion promoter;optionally (VI) a filler;optionally (VII) a treating agent;optionally (VIII) a cure modifier; andoptionally (IX) a rheology modifier. 17. The kit of claim 16, further comprising instructions for mixing Part A and Part B together in a weight ratio of Part A:Part B of 0.05:1 to 20:1. 18. A multiple part composition having Part A and Part B, where Part A comprises:(II) an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having a molecular formula given as R1R32SiO(SiPh2O)xSiR32R1 where Ph represents a phenyl group, each R1 is independently an alkenyl group having 2 to 12 carbon atoms, each R3 is independently a methyl group or a phenyl group, x is an integer from 2 to 8, and x has an average value of 2 to 4,(III) a hydrosilylation catalyst,optionally (V) an adhesion promoteroptionally (VI) a filler,optionally (VII) a treating agent,optionally (VIII) a cure modifier, and(IX) a rheology modifier;Part B comprises(I) an Si—H functional, phenyl-containing polyorganosiloxane having an average compositional formula given as HaR2bSiO(4-a-b)/2 where each R2 is independently a methyl group or a phenyl group, at least 30 mol % of R2 are phenyl groups, a and b are positive numbers having values such that: a+b=1 to 2.2 and a/(a+b)=0.001 to 0.05;optionally (II) an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having a molecular formula given as R1R32SiO(SiPh2O)xSiR32R1 where Ph represents a phenyl group, each R1 is independently an alkenyl group having 2 to 12 carbon atoms, each R3 is independently a methyl group or a phenyl group, x is an integer from 2 to 8, and x has an average value of 2 to 4,optionally (IV) a co-crosslinker;optionally (V) an adhesion promoter;optionally (VI) a filler;optionally (VII) a treating agent;optionally (VIII) a cure modifier; andoptionally (IX) a rheology modifier. 19. The kit of claim 18, further comprising instructions for mixing Part A and Part B together in a weight ratio of Part A:Part B of 0.05:1 to 20:1.