초록 ▼

Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an

Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.

대표청구항 ▼

1. An electroless palladium plating solution comprising a palladium compound, an amine compound, a sulfur compound and reducing agents, wherein (a) the sulfur compound is selected from the group consisting of thioglycolic acid, thiodiglycolic acid, sodium thiosulfate and sodium sulfite and contained

1. An electroless palladium plating solution comprising a palladium compound, an amine compound, a sulfur compound and reducing agents, wherein (a) the sulfur compound is selected from the group consisting of thioglycolic acid, thiodiglycolic acid, sodium thiosulfate and sodium sulfite and contained in an amount of 0.01 to 0.1 mol/l, and(b) as the reducing agents, 0.05 to 1.0 mol/l of a hypophosphorous acid compound and 0.001 to 0.1 mol/l of formic acid or a formate are used in combination. 2. The electroless palladium plating solution according to claim 1, wherein the palladium compound is one or more members selected from the group consisting of palladium chloride, palladium acetate, palladium nitrate, palladium sulfate, and ammonium palladium chloride. 3. The electroless palladium plating solution according to claim 1, wherein the amine compound is one or more members selected from the group consisting of methylamine, dimethylamine, trimethylamine, benzylamine, metylenediamine, etylenediamine, tetrametylenediamine, dietylenetriamine, EDTA (etylenediaminetetraacetic acid), sodium etylanediaminetetraacetate, and tetraetylenepentamine. 4. The electroless palladium plating solution according to claim 1, wherein a pH value thereof is 4.0 to 10.0. 5. The electroless palladium plating solution according to claim 1, wherein a temperature thereof is 35 to 80° C.